Patents by Inventor Yen Tse LIU

Yen Tse LIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12222604
    Abstract: A wavelength conversion element including a substrate, a blocking wall structure layer, and a wavelength conversion layer is provided. The blocking wall structure layer is disposed on a surface of the substrate and defines multiple microgrooves. Reflectivity of the blocking wall structure layer is in a range of 1% to 99%. The wavelength conversion layer is disposed in the microgrooves and includes multiple wavelength conversion particles. A height of the blocking wall structure layer along a normal direction of the surface of the substrate is greater than a height of the wavelength conversion layer along the normal direction of the surface of the substrate. A backlight module adopting the wavelength conversion element is also provided.
    Type: Grant
    Filed: September 4, 2023
    Date of Patent: February 11, 2025
    Assignee: Coretronic Corporation
    Inventors: Ching-Nan Chuang, Hung-Tse Lin, Ming-Dah Liu, Yen-Ni Lin
  • Publication number: 20130229774
    Abstract: An electronic device is provided, and the electronic device includes a main body, an actuating module, a first linkage, a first casing and a thermal dissipating module. The actuating module is disposed in the main body. One side of the first linkage is connected with the actuating module. The first casing is connected with the other side of the first linkage. One side of the thermal dissipating module is disposed at the main body and the other side of the thermal dissipating module is disposed at the first casing. The actuating module controls the first linkage to rotate to separate the first casing from the main body so that the thermal dissipating module is exposed from the main body and the electronic device is switched from a closed state to an open state.
    Type: Application
    Filed: February 6, 2013
    Publication date: September 5, 2013
    Applicant: ASUSTek COMPUTER INC.
    Inventors: Ching-Hua CHEN, Shih-Kun CHOU, Yen Tse LIU, Shih-Ming LIN