Abstract: An interconnection structure and a manufacturing method thereof are provided. The interconnection structure includes a first dielectric layer, a first conductive feature, a second dielectric layer, and a barrier layer. The first conductive feature is disposed on the first dielectric layer, the second dielectric layer is disposed on the first dielectric layer and surrounds the sidewalls of the first conductive feature, the barrier layer is disposed between the first dielectric layer and the second dielectric layer and between the sidewalls of the first conductive feature and the second dielectric layer.

Abstract: A semiconductor structure is provided. The semiconductor structure includes a first low dielectric constant (low-k) layer, a first metal layer, a metal cap layer, a dielectric on dielectric (DoD) layer, an etch stop layer (ESL), a second low-k layer, a metal via and a second metal layer. The dielectric constant of the first low-k layer is less than 4. The first metal layer is embodied in the first low-k layer. The first low-k layer exposes the first metal layer. The metal cap layer is disposed on the first metal layer. The DoD layer is disposed on the first low-k layer. The etch stop layer is disposed on the metal cap layer and the DoD layer. The second low-k layer is disposed above the etch stop layer. The metal via is embodied in the second low-k layer and connected to the first metal layer.

Abstract: A method includes forming a semiconductor fin protruding higher than top surfaces of isolation regions. A top portion of the semiconductor fin is formed of a first semiconductor material. A semiconductor cap layer is formed on a top surface and sidewalls of the semiconductor fin. The semiconductor cap layer is formed of a second semiconductor material different from the first semiconductor material. The method further includes forming a gate stack on the semiconductor cap layer, forming a gate spacer on a sidewall of the gate stack, etching a portion of the semiconductor fin on a side of the gate stack to form a first recess extending into the semiconductor fin, recessing the semiconductor cap layer to form a second recess directly underlying a portion of the gate spacer, and performing an epitaxy to grow an epitaxy region extending into both the first recess and the second recess.

Abstract: A nano-FET and a method of forming is provided. In some embodiments, a nano-FET includes an epitaxial source/drain region contacting ends of a first nanostructure and a second nanostructure. The epitaxial source/drain region may include a first semiconductor material layer of a first semiconductor material, such that the first semiconductor material layer includes a first segment contacting the first nanostructure and a second segment contacting the second nanostructure, wherein the first segment is separated from the second segment. A second semiconductor material layer is formed over the first segment and the second segment. The second semiconductor material layer may include a second semiconductor material having a higher concentration of dopants of a first conductivity type than the first semiconductor material layer. The second semiconductor material layer may have a lower concentration percentage of silicon than the first semiconductor material layer.

Abstract: A semiconductor structure includes a substrate and a first epitaxial source/drain feature extending into the semiconductor layer. The semiconductor structure includes a first doped region located in the semiconductor layer below the first epitaxial source/drain feature. The first doped region includes a dopant at a first concentration. The semiconductor structure includes a second epitaxial source/drain feature extending into the semiconductor layer. The semiconductor structure includes a second doped region located in the semiconductor layer below the second epitaxial source/drain feature. The second doped region includes the dopant at a second concentration that is less than the first concentration.

Abstract: A method includes: generating a designed mask overlay mark associated with an actual mask overlay mark to be formed in a mask; forming the actual mask overlay mark in the mask based on the designed mask overlay mark, the actual mask overlay mark including a plurality of overlay patterns; forming a device feature pattern adjacent to the actual mask overlay mark; forming an alignment of the mask by a mask metrology apparatus including a light source having a wavelength and a numerical aperture, wherein a pitch between adjacent two of the plurality of overlay patterns does not exceed the wavelength divided by twice the numerical aperture; and forming a pattern in a layer of a wafer by transferring the device feature pattern while the mask is under the alignment.

Abstract: Exemplary embodiments for redistribution layers of integrated circuit components are disclosed. The redistribution layers of integrated circuit components of the present disclosure include one or more arrays of conductive contacts that are configured and arranged to allow a bonding wave to displace air between the redistribution layers during bonding. This configuration and arrangement of the one or more arrays minimize discontinuities, such as pockets of air to provide an example, between the redistribution layers during the bonding.

Abstract: Ingredient dispensers for use in dispensing a measured amount of dry and/or liquid ingredient for a user are disclosed. In some embodiments, a dry ingredient dispenser is provided and may include a receptacle configured to contain a select amount of dry ingredient and a cap comprising an actuating portion and a measuring chamber portion. In some embodiments, a liquid ingredient dispenser is provided and may include a receptacle configured to contain a select amount of liquid ingredient and a dispensing portion which may be rotatable to dispense a measured amount of liquid ingredient for the user.

Abstract: A UV LED reactor includes a housing having an inlet, an outlet and a reactor chamber; a UV LED module mounted to the housing configured to emit UV radiation into the reactor chamber having a selected wavelength range and with a selected energy (E); and a heatsink on the UV LED module configured to dissipate heat generated by the UV LED module. The heatsink on the UV LED module includes one or more surfaces in thermal communication or physical contact with the fluid, which improves the efficiency of heat transfer from the heatsink to the fluid and eliminates the need for cooling fans. The UV LED reactor can also include a UV transparent inner tube mounted to the inlet for generating a double UV exposure flow path through the reactor chamber. The UV LED reactor can also include a UV reflective coating on the sidewalls of the housing, or on a separate tube or sleeve mounted to the housing, configured to reflect UV radiation onto the fluid in the reactor chamber.

Abstract: Ingredient dispensers for use in dispensing a measured amount of dry and/or liquid ingredient for a user are disclosed. In some embodiments, a dry ingredient dispenser is provided and may include a receptacle configured to contain a select amount of dry ingredient and a cap comprising an actuating portion and a measuring chamber portion. In some embodiments, a liquid ingredient dispenser is provided and may include a receptacle configured to contain a select amount of liquid ingredient and a dispensing portion which may be rotatable to dispense a measured amount of liquid ingredient for the user.

Abstract: A consumer countertop grind-and-brew machine for coffee, or a grinder for nut butter and similar foodstuffs. The grinder burr and container for pre-ground food are connected, so that they can be replaced as an assembly. Thus, different family members that like caffeinated and decaffeinated coffee, or that prefer peanut, almond, and cashew butter can each grind their own preferred foodstuff, and swap out the grinder between to prevent cross-contamination.

Abstract: A wireless charging receiver for a portable electronic device is provided. The wireless charging receiver includes a base plate, a wireless charge receiving module, a fastening part and an electric connector. The portable electronic device may be fixed on the base plate of the wireless charging receiver by means of the fastening part. Through the electric connector of the wireless charging receiver, the wireless charge receiving module is electrically connected with the portable electronic device. Consequently, electric power is transmitted to the portable electronic device through the wireless charging receiver to charge the portable electronic device.

Abstract: A wireless charging transmitter for a portable electronic device is provided. The wireless charging transmitter includes a first housing, a second housing and a wireless charge transmitting module. The wireless charge transmitting module is disposed within the second housing. The second housing is rotatable with respect to the first housing, so that either an included angle is defined between the second housing and the first housing or the second housing and the first housing are folded together. Whereas, in a case that an included angle is defined between the second housing and the first housing, once a wireless charging receiver is contacted with the second housing, electric power may be transmitted to the wireless charging receiver. In a case that the second housing and the first housing are folded together, the wireless charging transmitter has a rectangular shape. Due to the rectangular shape, the wireless charging transmitter is easily carried.

Abstract: A wireless charging transmitter for a portable electronic device is provided. The wireless charging transmitter includes a first housing, a second housing and a wireless charge transmitting module. The wireless charge transmitting module is disposed within the second housing. The second housing is rotatable with respect to the first housing, so that either an included angle is defined between the second housing and the first housing or the second housing and the first housing are folded together. Whereas, in a case that an included angle is defined between the second housing and the first housing, once a wireless charging receiver is contacted with the second housing, electric power may be transmitted to the wireless charging receiver. In a case that the second housing and the first housing are folded together, the wireless charging transmitter has a rectangular shape. Due to the rectangular shape, the wireless charging transmitter is easily carried.

Abstract: A wireless charging receiver for a portable electronic device is provided. The wireless charging receiver includes a base plate, a wireless charge receiving module, a fastening part and an electric connector. The portable electronic device may be fixed on the base plate of the wireless charging receiver by means of the fastening part. Through the electric connector of the wireless charging receiver, the wireless charge receiving module is electrically connected with the portable electronic device. Consequently, electric power is transmitted to the portable electronic device through the wireless charging receiver to charge the portable electronic device.