Abstract: A semiconductor device includes a substrate, an interconnect, a memory cell, and a plurality of first barrier structures. The interconnect is disposed over the substrate. The memory cell is disposed in the interconnect within a memory region of the substrate, where the memory cell includes a transistor and a capacitor. The transistor includes a gate, source/drain elements respectively standing at two opposite sides of the gate, and a channel disposed between the source/drain elements and overlapped with the gate. The capacitor is disposed over the transistor and electrically coupled to one of the source/drain elements. The plurality of first barrier structures line sidewalls and bottom surfaces of the source/drain elements, and each include a first barrier layer and a second barrier layer disposed between the source/drain elements and the first barrier layer, where a first absorption interface is disposed between the first barrier layer and the second barrier layer.

Abstract: An electronic device includes a conductive wire having a metal portion with openings. The openings include a first opening and a second opening arranged along a first direction, and the metal portion includes the first to fourth extending portions and the first to fourth joint portions. The first opening is surrounded by the first extending portion, the second extending portion, the first joint portion, and the second joint portion. The second opening is surrounded by the third extending portion, the fourth extending portion, the third joint portion, and the fourth joint portion. Along the first direction, a ratio of a first width sum of widths of the first extending portion, the second extending portion, the third extending portion, and the fourth extending portion to a second width sum of widths of the first joint portion and the third joint portion is in a range from 0.8 to 1.2.

Abstract: In some embodiments, the present disclosure relates to a method that includes forming a dielectric layer over a conductive structure on a substrate. A removal process is performed to remove a portion of the dielectric layer to expose a portion of the conductive structure. The substrate is transported into a cleaning chamber having a wafer chuck below a bell jar structure. A cleaning process is performed to clean the exposed portion of the conductive structure by turning on a noble gas source to introduce a noble gas within the cleaning chamber, turning on an oxygen gas source to introduce oxygen within the cleaning chamber, applying a first bias to a plasma coil to form a plasma gas, and applying a second bias to the wafer chuck. The substrate is removed from the cleaning chamber. A conductive layer is formed over the dielectric layer and coupled to the conductive structure.

Abstract: A capacitor includes a bottom capacitor plate including a rough upper surface with a root mean square (RMS) surface roughness of at least 1.14, a capacitor dielectric layer on the bottom capacitor plate and contacting the rough upper surface of the bottom capacitor plate, and an upper capacitor plate on the capacitor dielectric layer. A semiconductor device includes a transistor located on a substrate, a dielectric layer on the transistor, and a capacitor in the dielectric layer and including a bottom capacitor plate connected to a source region of the transistor and having a rough upper surface with a root mean square (RMS) surface roughness of at least 1.14.

Abstract: A ratcheting tool includes a handle and a head extending from the handle. The handle includes a compartment communicated with a hole of the head. A drive member is rotatably mounted in the hole of the head and includes teeth on an outer periphery thereof. A pawl is slidably mounted in the compartment of the handle. The pawl includes teeth on a side thereof for engaging with the teeth of the drive member. An anchor is mounted in the compartment of the head. An elastic element is attached between the pawl and the anchor for biasing the teeth of the pawl to engage with the teeth of the drive member. A protruded portion is integrally formed on a wall defining the compartment of the handle for positioning the anchor in place, thereby preventing the anchor from moving out of the compartment of the handle.

Abstract: A wrench includes a handle, a head having a pivotal portion, and a retaining mechanism for retaining the head in the desired angular position relative to the handle. The pivotal portion of the head includes a fore lug and a rear lug that are located with reference to a ratcheting direction of the handle. The handle has an engaging portion pivotally received in an opening between the lugs. Teeth are defined in an arcuate outer surface section of the fore lug. The thickness of the rear lug is not reduced, avoiding damage to the torque-bearing section in the pin hole of the rear lug.

Abstract: A wrench includes a handle, a head having a pivotal portion, and a retaining mechanism for retaining the head in the desired angular position relative to the handle. The pivotal portion of the head includes a fore lug and a rear lug that are located with reference to a ratcheting direction of the handle. The handle has an engaging portion pivotally received in an opening between the lugs. Teeth are defined in an arcuate outer surface section of the fore lug. The thickness of the rear lug is not reduced, avoiding damage to the torque-bearing section in the pin hole of the rear lug.

Abstract: A ratcheting tool includes a handle and a head extending from the handle. The handle includes a compartment communicated with a hole of the head. A drive member is rotatably mounted in the hole of the head and includes teeth on an outer periphery thereof. A pawl is slidably mounted in the compartment of the handle. The pawl includes teeth on a side thereof for engaging with the teeth of the drive member. An anchor is mounted in the compartment of the head. An elastic element is attached between the pawl and the anchor for biasing the teeth of the pawl to engage with the teeth of the drive member. A protruded portion is integrally formed on a wall defining the compartment of the handle for positioning the anchor in place, thereby preventing the anchor from moving out of the compartment of the handle.

Abstract: A ratcheting wrench comprises a handle and a head extending from the handle. A cavity is defined between a first side and a second side of the handle. A transverse hole is defined in the first side of the handle and communicated with the cavity. A drive member is rotatably mounted in a hole of the head. A block is mounted in the cavity of the handle, and a fixing member extends through the transverse hole of the handle and retains the block in the cavity. A pawl is mounted in the cavity of the handle. An elastic element is attached between the block and the pawl for biasing teeth of the pawl to engage with teeth of the drive member and for biasing the pawl to press against a wall defining the cavity of the handle.

Abstract: A ratcheting wrench comprises a handle and a head extending from the handle. A cavity is defined between a first side and a second side of the handle. A transverse hole is defined in the first side of the handle and communicated with the cavity. A drive member is rotatably mounted in a hole of the head. A block is mounted in the cavity of the handle, and a fixing member extends through the transverse hole of the handle and retains the block in the cavity. A pawl is mounted in the cavity of the handle. An elastic element is attached between the block and the pawl for biasing teeth of the pawl to engage with teeth of the drive member and for biasing the pawl to press against a wall defining the cavity of the handle.