Abstract: A method of manufacturing an interconnect structure includes forming an opening through a dielectric layer. The opening exposes a top surface of a first conductive feature. The method further includes forming a barrier layer on sidewalls of the opening, passivating the exposed top surface of the first conductive feature with a treatment process, forming a liner layer over the barrier layer, and filling the opening with a conductive material. The liner layer may include ruthenium.

Abstract: A method of manufacturing an interconnect structure includes forming an opening through a dielectric layer. The opening exposes a top surface of a first conductive feature. The method further includes forming a barrier layer on sidewalls of the opening, passivating the exposed top surface of the first conductive feature with a treatment process, forming a liner layer over the barrier layer, and filling the opening with a conductive material. The liner layer may include ruthenium.

Abstract: In some implementations, one or more semiconductor processing tools may form a via within a substrate of a semiconductor device. The one or more semiconductor processing tools may deposit a ruthenium-based liner within the via. The one or more semiconductor processing tools may deposit, after depositing the ruthenium-based liner, a copper plug within the via.

Abstract: An interconnect structure including a contact via in an interlayer dielectric, a first conductive feature in a first dielectric layer, the first dielectric layer over the interlayer dielectric, a first liner in the first dielectric layer, the first liner comprising a first part in contact with a sidewall surface of the first conductive feature, and a second part in contact with a bottom surface of the first conductive feature. The interconnect structure includes a first cap layer in contact with a top surface of the first conductive feature, a second conductive feature in a second dielectric layer, the second dielectric layer over the first dielectric layer, a second liner in the second dielectric layer, wherein the first and second conductive features comprise a first conductive material, and the contact via, first liner, first cap layer, and second liner comprise a second conductive material chemically different than the first conductive material.

Abstract: In some implementations, one or more semiconductor processing tools may form a via within a substrate of a semiconductor device. The one or more semiconductor processing tools may deposit a ruthenium-based liner within the via. The one or more semiconductor processing tools may deposit, after depositing the ruthenium-based liner, a copper plug within the via.

Abstract: An embodiment is a structure including a first fin over a substrate, a second fin over the substrate, the second fin being adjacent the first fin, an isolation region surrounding the first fin and the second fin, a gate structure along sidewalls and over upper surfaces of the first fin and the second fin, the gate structure defining channel regions in the first fin and the second fin, a source/drain region on the first fin and the second fin adjacent the gate structure, and an air gap separating the source/drain region from a top surface of the substrate.

Abstract: An eccentric wheel adjustment device includes a hub (1), an adjustment disk (2) and a release structure (3). The hub (1) has an axle portion (10) eccentrically arranged and an inner ring portion (11) formed around the axle portion (10). The adjustment disk (2) has a disk seat (20) for the hub (1) being pivotally disposed thereon and a positioning member (21) for positioning the hub (1) on the disk seat (20). The positioning member (21) has an outer ring portion (210) for aligning the inner ring portion (11) of the hub (1) in the outer ring portion (210). The release structure (3) includes a limiting block (30) and a switch member (31) driving the limiting block (30) to act so as to drive the limiting block (30) to straddle between the hub (1) and the adjustment disk (2) or to move back to the inner ring portion (11).

Abstract: A fan with a fluid diversion mechanism includes a fan frame structure and a vane wheel, and the fan frame structure has a containing space, an air inlet and an air outlet, and the fan frame structure includes a coaming plate having a plurality of diversion components, and an opening formed at any one of the diversion components and arranged in a direction towards the air inlet, and the vane wheel is installed in the containing space of the fan frame structure, so that when the vane wheel is operated, air current produced by vanes of the fan guides the air current entered from the diversion component to an external side of a retaining platform which is a leeward side, and the air current has an effective coverage for blowing a desired heat source and improves the overall airflow and air pressure of the fan.

Abstract: A motor driving apparatus is applied to a fan and motor mechanism and a voltage supply unit. The motor driving apparatus includes a motor driving unit, a voltage division resistor, a first resistor, a first switch unit, a second resistor, a second switch unit, a third resistor, a third switch unit, a transistor switch, and a pulse width modulation unit. The first switch unit, the second switch unit, and the third switch unit are configured to select the rotational speed upper limitation of the fan and motor mechanism for suppressing noise.

Abstract: A motor driving apparatus is applied to a fan and motor mechanism and a voltage supply unit. The motor driving apparatus includes a motor driving unit, a voltage division resistor, a first resistor, a first switch unit, a second resistor, a second switch unit, a third resistor, a third switch unit, a transistor switch, and a pulse width modulation unit. The first switch unit, the second switch unit, and the third switch unit are configured to select the rotational speed upper limitation of the fan and motor mechanism for suppressing noise.

Abstract: A fan with a fluid diversion mechanism includes a fan frame structure and a vane wheel, and the fan frame structure has a containing space, an air inlet and an air outlet, and the fan frame structure includes a coaming plate having a plurality of diversion components, and an opening formed at any one of the diversion components and arranged in a direction towards the air inlet, and the vane wheel is installed in the containing space of the fan frame structure, so that when the vane wheel is operated, air current produced by vanes of the fan guides the air current entered from the diversion component to an external side of a retaining platform which is a leeward side, and the air current has an effective coverage for blowing a desired heat source and improves the overall airflow and air pressure of the fan.

Abstract: A power supply and a housing structure with the power supply are disclosed. The power supply includes a power supply housing, a cooling fan, a circuit structure, and a plurality of lighting elements. One side of the power supply housing has a first wall, and the first wall has air inlet holes. Another side of the power supply housing has a second wall, and the second wall has air outlet holes. The cooling fan is located in the power supply housing and corresponds to the air inlet holes. The circuit structure is combined with the first wall and adjacent to the air inlet holes. The lighting elements are located at one side of the circuit structure to emit light to outside of the power supply housing. When the housing structure is installed with the power supply, the housing structure has a function of illuminating the interior of the housing structure.

Abstract: A power supply includes a power supply casing, a fan module, a PCB module and a power-output element. The power supply casing has a first opening portion and a second opening portion. The fan module passes through the first opening portion in order to detachably combine with the power supply casing. The PCB module is disposed inside the power supply casing, and the PCB module has a PCB (Printed Circuit Board) and a plurality of electronic elements electrically disposed on the PCB. The power-output element is electrically connected to the PCB module in order to output power to supply external electronic device.

Abstract: A heat-dissipation apparatus for a computer host is provided, particularly a heat-dissipation apparatus disposed on the housing, wherein a fan module and a plurality of lighting components are included. In one embodiment, a flexible circuit board is interconnected therebetween, and disposed surrounded the framework of the fan module. Users may utilize a control switching module to control the fan module and the lighting components.

Abstract: An installation structure for a fan includes a housing, a fastening frame, and a protection structure. The housing has an opening. The fastening frame is combined with the housing and has a fan receiving area. The fan receiving area links to the opening. The protection structure is combined with the fastening frame. Thereby, after the user disassembled the fan from the fastening frame, it can prevent the electronic components in the housing from being damaged due to external force.