Patents by Inventor Yen-Wen Tseng

Yen-Wen Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PACKAGE STRUCTURE AND CARRIER STRUCTURE
    Publication number: 20080185698
    Abstract: A semiconductor package structure is disclosed. The structure comprises a die pad, a chip, leads, a recess, and an encapsulant. The chip is disposed on the die pad. The leads are disposed on a periphery of the die pad and electrically connected to the chip. The recess is formed on the top surface of at least one of the leads and extends to the outside surface thereof. The encapsulant is used for encapsulating the die pad, the chip, the leads, and the recess.
    Type: Application
    Filed: November 19, 2007
    Publication date: August 7, 2008
    Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yen-Wen Tseng, Mei-Lin Hsieh, Chih-Hung Hsu, Kuang-Hsiung Chen