Patents by Inventor Yen-Yao Chi
Yen-Yao Chi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11854784Abstract: A semiconductor package structure includes a semiconductor die, a redistribution layer (RDL) structure, a protective insulating layer, and a conductive structure. The semiconductor die has a first surface, a second surface opposite the first surface, and a third surface adjoined between the first surface and the second surface. The RDL structure is on the first surface of the semiconductor die and is electrically coupled to the semiconductor die. The protective insulating layer covers the RDL structure, the second surface and the third surface of the semiconductor die. The conductive structure passes through the protective insulating layer and is electrically coupled to the RDL structure.Type: GrantFiled: November 17, 2022Date of Patent: December 26, 2023Assignee: MediaTek Inc.Inventors: Yen-Yao Chi, Nai-Wei Liu, Ta-Jen Yu, Tzu-Hung Lin, Wen-Sung Hsu, Shih-Chin Lin
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Patent number: 11824020Abstract: An electronic device that has an antenna device that includes a conductive pattern layer comprising a first antenna element, the conductive pattern layer formed in an insulating substrate and adjacent to a first surface of the insulating substrate, and a second antenna element formed on a second surface of the insulating substrate opposite the first surface. The electronic device further has a semiconductor package that includes a redistribution layer (RDL) structure bonded and electrically connected to the conductive pattern layer, a first electronic component electrically connected to the RDL structure, and an encapsulating layer formed on the RDL structure and surrounding the first electronic component.Type: GrantFiled: October 13, 2022Date of Patent: November 21, 2023Assignee: MEDIATEK INC.Inventors: Yen-Yao Chi, Nai-Wei Liu, Tzu-Hung Lin
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Patent number: 11791266Abstract: A semiconductor package structure including a semiconductor die having a first surface, a second surface opposite the first surface, and a third surface adjoined between the first surface and the second surface. A first protective insulating layer covers the first and third surfaces of the semiconductor die. A redistribution layer (RDL) structure is electrically coupled to the semiconductor die and surrounded by the first protective insulating layer on the first surface of the semiconductor die. A first passivation layer covers the first protective insulating layer and the RDL structure. At least one conductive structure passes through the first passivation layer and is electrically coupled to the RDL structure. A method of forming the semiconductor package is also provided.Type: GrantFiled: August 12, 2022Date of Patent: October 17, 2023Assignee: MediaTek Inc.Inventors: Yen-Yao Chi, Nai-Wei Liu, Ta-Jen Yu, Tzu-Hung Lin, Wen-Sung Hsu
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Patent number: 11742564Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a semiconductor die surrounded by a first molding compound layer. A redistribution layer (RDL) structure is formed on a non-active surface of the semiconductor die and the first molding compound layer. A second molding compound layer is formed on the RDL structure. An insulating capping layer covers the second molding compound layer. An antenna is electrically coupled to the semiconductor die and includes a first antenna element formed in the RDL structure and a second antenna element formed between the second molding compound layer and the insulating capping layer.Type: GrantFiled: May 17, 2021Date of Patent: August 29, 2023Assignee: MediaTek Inc.Inventors: Nai-Wei Liu, Yen-Yao Chi, Tzu-Hung Lin, Wen-Sung Hsu
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Patent number: 11652273Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a redistribution layer (RDL) structure formed on a non-active surface of a semiconductor die. An antenna structure includes a first antenna element formed in the RDL structure, a first insulating layer covering the RDL structure, a second insulating layer formed on the first insulating layer, and a second antenna element formed on and in direct contact with the second insulating layer.Type: GrantFiled: February 18, 2022Date of Patent: May 16, 2023Assignee: MediaTek Inc.Inventors: Nai-Wei Liu, Yen-Yao Chi, Yeh-Chun Kao, Shih-Huang Yeh, Tzu-Hung Lin, Wen-Sung Hsu
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Publication number: 20230073399Abstract: A semiconductor package structure includes a semiconductor die, a redistribution layer (RDL) structure, a protective insulating layer, and a conductive structure. The semiconductor die has a first surface, a second surface opposite the first surface, and a third surface adjoined between the first surface and the second surface. The RDL structure is on the first surface of the semiconductor die and is electrically coupled to the semiconductor die. The protective insulating layer covers the RDL structure, the second surface and the third surface of the semiconductor die. The conductive structure passes through the protective insulating layer and is electrically coupled to the RDL structure.Type: ApplicationFiled: November 17, 2022Publication date: March 9, 2023Applicant: MediaTek Inc.Inventors: Yen-Yao Chi, Nai-Wei Liu, Ta-Jen Yu, Tzu-Hung Lin, Wen-Sung Hsu, Shih-Chin Lin
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Publication number: 20230056550Abstract: An electronic device that has an antenna device that includes a conductive pattern layer comprising a first antenna element, the conductive pattern layer formed in an insulating substrate and adjacent to a first surface of the insulating substrate, and a second antenna element formed on a second surface of the insulating substrate opposite the first surface. The electronic device further has a semiconductor package that includes a redistribution layer (RDL) structure bonded and electrically connected to the conductive pattern layer, a first electronic component electrically connected to the RDL structure, and an encapsulating layer formed on the RDL structure and surrounding the first electronic component.Type: ApplicationFiled: October 13, 2022Publication date: February 23, 2023Inventors: Yen-Yao CHI, Nai-Wei LIU, Tzu-Hung LIN
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Patent number: 11574881Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a first redistribution layer (RDL) structure formed on a non-active surface of a semiconductor die. A second RDL structure is formed on and electrically coupled to an active surface of the semiconductor die. A ground layer is formed in the first RDL structure. A first molding compound layer is formed on the first RDL structure. A first antenna includes a first antenna element formed in the second RDL structure and a second antenna element formed on the first molding compound layer. Each of the first antenna element and the second antenna element has a first portion overlapping the semiconductor die as viewed from a top-view perspective.Type: GrantFiled: June 28, 2021Date of Patent: February 7, 2023Assignee: MediaTek Inc.Inventors: Nai-Wei Liu, Yen-Yao Chi, Yeh-Chun Kao, Shih-Huang Yeh, Tzu-Hung Lin, Wen-Sung Hsu
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Publication number: 20220392839Abstract: A semiconductor package structure including a semiconductor die having a first surface, a second surface opposite the first surface, and a third surface adjoined between the first surface and the second surface. A first protective insulating layer covers the first and third surfaces of the semiconductor die. A redistribution layer (RDL) structure is electrically coupled to the semiconductor die and surrounded by the first protective insulating layer on the first surface of the semiconductor die. A first passivation layer covers the first protective insulating layer and the RDL structure. At least one conductive structure passes through the first passivation layer and is electrically coupled to the RDL structure. A method of forming the semiconductor package is also provided.Type: ApplicationFiled: August 12, 2022Publication date: December 8, 2022Applicant: MediaTek Inc.Inventors: Yen-Yao Chi, Nai-Wei Liu, Ta-Jen Yu, Tzu-Hung Lin, Wen-Sung Hsu
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Patent number: 11508678Abstract: A semiconductor package structure is provided. The semiconductor package structure includes an antenna device and semiconductor package. The antenna device includes a conductive pattern layer including a first antenna element, formed in an insulating substrate and adjacent to a first surface of the insulating substrate. The antenna device also includes a second antenna element formed on a second surface of the insulating substrate opposite the first surface. The semiconductor package includes a redistribution layer (RDL) structure bonded and electrically connected to the conductive pattern layer. The semiconductor package also includes a first semiconductor die electrically connected to the RDL structure, and an encapsulating layer formed on the RDL structure and surrounding the first semiconductor die.Type: GrantFiled: June 24, 2020Date of Patent: November 22, 2022Assignee: MEDIATEK INC.Inventors: Yen-Yao Chi, Nai-Wei Liu, Tzu-Hung Lin
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Patent number: 11450606Abstract: A semiconductor package structure including a semiconductor die having a first surface, a second surface opposite the first surface, and a third surface adjoined between the first surface and the second surface. A first protective insulating layer covers the first and third surfaces of the semiconductor die. A redistribution layer (RDL) structure is electrically coupled to the semiconductor die and surrounded by the first protective insulating layer on the first surface of the semiconductor die. A first passivation layer covers the first protective insulating layer and the RDL structure. At least one conductive structure passes through the first passivation layer and is electrically coupled to the RDL structure. A method of forming the semiconductor package is also provided.Type: GrantFiled: June 3, 2019Date of Patent: September 20, 2022Assignee: MediaTek Inc.Inventors: Yen-Yao Chi, Nai-Wei Liu, Tzu-Hung Lin, Ta-Jen Yu, Wen-Sung Hsu
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Publication number: 20220173497Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a redistribution layer (RDL) structure formed on a non-active surface of a semiconductor die. An antenna structure includes a first antenna element formed in the RDL structure, a first insulating layer covering the RDL structure, a second insulating layer formed on the first insulating layer, and a second antenna element formed on and in direct contact with the second insulating layer.Type: ApplicationFiled: February 18, 2022Publication date: June 2, 2022Applicant: Media Tek Inc.Inventors: Nai-Wei Liu, Yen-Yao Chi, Yeh-Chun Kao, Shih-Huang Yeh, Tzu-Hung Lin, Wen-Sung Hsu
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Publication number: 20210327835Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a first redistribution layer (RDL) structure formed on a non-active surface of a semiconductor die. A second RDL structure is formed on and electrically coupled to an active surface of the semiconductor die. A ground layer is formed in the first RDL structure. A first molding compound layer is formed on the first RDL structure. A first antenna includes a first antenna element formed in the second RDL structure and a second antenna element formed on the first molding compound layer. Each of the first antenna element and the second antenna element has a first portion overlapping the semiconductor die as viewed from a top-view perspective.Type: ApplicationFiled: June 28, 2021Publication date: October 21, 2021Applicant: MediaTek Inc.Inventors: Nai-Wei Liu, Yen-Yao Chi, Yeh-Chun Kao, Shih-Huang Yeh, Tzu-Hung Lin, Wen-Sung Hsu
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Publication number: 20210273317Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a semiconductor die surrounded by a first molding compound layer. A redistribution layer (RDL) structure is formed on a non-active surface of the semiconductor die and the first molding compound layer. A second molding compound layer is formed on the RDL structure. An insulating capping layer covers the second molding compound layer. An antenna is electrically coupled to the semiconductor die and includes a first antenna element formed in the RDL structure and a second antenna element formed between the second molding compound layer and the insulating capping layer.Type: ApplicationFiled: May 17, 2021Publication date: September 2, 2021Applicant: MediaTek Inc.Inventors: Nai-Wei Liu, Yen-Yao Chi, Tzu-Hung Lin, Wen-Sung Hsu
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Patent number: 11081453Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a first redistribution layer (RDL) structure formed on a non-active surface of a semiconductor die. A second RDL structure is formed on and electrically coupled to an active surface of the semiconductor die. A ground layer is formed in the first RDL structure. A first molding compound layer is formed on the first RDL structure. A first antenna includes a first antenna element formed in the second RDL structure and a second antenna element formed on the first molding compound layer. Each of the first antenna element and the second antenna element has a first portion overlapping the semiconductor die as viewed from a top-view perspective.Type: GrantFiled: June 25, 2019Date of Patent: August 3, 2021Assignee: MediaTek Inc.Inventors: Nai-Wei Liu, Yen-Yao Chi, Yeh-Chun Kao, Shih-Huang Yeh, Tzu-Hung Lin, Wen-Sung Hsu
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Patent number: 11043730Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a semiconductor die surrounded by a first molding compound layer. A redistribution layer (RDL) structure is formed on a non-active surface of the semiconductor die and the first molding compound layer. A second molding compound layer is formed on the RDL structure. An insulating capping layer covers the second molding compound layer. An antenna is electrically coupled to the semiconductor die and includes a first antenna element formed in the RDL structure and a second antenna element formed between the second molding compound layer and the insulating capping layer.Type: GrantFiled: April 17, 2019Date of Patent: June 22, 2021Assignee: MediaTek Inc.Inventors: Nai-Wei Liu, Yen-Yao Chi, Tzu-Hung Lin, Wen-Sung Hsu
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Patent number: 11024954Abstract: A method of forming a semiconductor package structure includes providing a first wafer-level package structure having a die region surrounded by a scribe line region. The first wafer-level package structure includes a first encapsulating layer, a first redistribution layer (RDL) structure formed on the first encapsulating layer, a first antenna element formed in the first RDL structure and corresponding to the die region, and a semiconductor die in the first encapsulating layer and corresponding to the die region. A second wafer-level package structure is bonded onto the first RDL structure using a first adhesive layer. The second wafer-level package structure includes a second encapsulating layer attached to the first adhesive layer, and a second antenna element formed on the second encapsulating layer. The second antenna element and the first antenna element form a pitch antenna after the bonding of the second wafer-level package structure.Type: GrantFiled: April 30, 2019Date of Patent: June 1, 2021Assignee: MediaTek Inc.Inventors: Nai-Wei Liu, Yen-Yao Chi, Tzu-Hung Lin, Wen-Sung Hsu
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Patent number: 10943873Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate. The semiconductor device structure includes a conductive structure over the substrate. The semiconductor device structure includes first metal oxide fibers over the conductive structure. The semiconductor device structure includes a dielectric layer over the substrate and covering the conductive structure and the first metal oxide fibers. The dielectric layer fills gaps between the first metal oxide fibers.Type: GrantFiled: December 7, 2018Date of Patent: March 9, 2021Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Jing-Cheng Lin, Chen-Hua Yu, Szu-Wei Lu, Yen-Yao Chi
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Publication number: 20210035930Abstract: A semiconductor package structure is provided. The semiconductor package structure includes an antenna device and semiconductor package. The antenna device includes a conductive pattern layer including a first antenna element, formed in an insulating substrate and adjacent to a first surface of the insulating substrate. The antenna device also includes a second antenna element formed on a second surface of the insulating substrate opposite the first surface. The semiconductor package includes a redistribution layer (RDL) structure bonded and electrically connected to the conductive pattern layer. The semiconductor package also includes a first semiconductor die electrically connected to the RDL structure, and an encapsulating layer formed on the RDL structure and surrounding the first semiconductor die.Type: ApplicationFiled: June 24, 2020Publication date: February 4, 2021Inventors: Yen-Yao CHI, Nai-Wei LIU, Tzu-Hung LIN
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Publication number: 20200312732Abstract: A semiconductor package structure includes a semiconductor die, a redistribution layer (RDL) structure, a protective insulating layer, and a conductive structure. The semiconductor die has a first surface, a second surface opposite the first surface, and a third surface adjoined between the first surface and the second surface. The RDL structure is on the first surface of the semiconductor die and is electrically coupled to the semiconductor die. The protective insulating layer covers the RDL structure, the second surface and the third surface of the semiconductor die. The conductive structure passes through the protective insulating layer and is electrically coupled to the RDL structure.Type: ApplicationFiled: June 17, 2020Publication date: October 1, 2020Inventors: Yen-Yao CHI, Nai-Wei LIU, Ta-Jen YU, Tzu-Hung LIN, Wen-Sung HSU, Shih-Chin LIN