Patents by Inventor Yen-Yu LIU

Yen-Yu LIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11966241
    Abstract: A circuit includes a voltage divider circuit configured to generate a feedback voltage according to an output voltage, an operational amplifier configured to output a driving signal according to the feedback voltage and a reference voltage and a pass gate circuit including multiple current paths. The current paths are controlled by the driving signal and connected in parallel between the voltage divider circuit and a power reference node.
    Type: Grant
    Filed: February 11, 2022
    Date of Patent: April 23, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Huan-Neng Chen, Yen-Lin Liu, Chia-Wei Hsu, Jo-Yu Wu, Chang-Fen Hu, Shao-Yu Li, Bo-Ting Chen
  • Patent number: 11966381
    Abstract: Embodiments maintain a data pool that includes heterogeneous data sets, and receiving a first data batch of a data set from a data source into the data pool. Embodiments determine a current state of the data set based on a data set state diagram including a plurality of data set states, and identify a condition of the first data batch. Embodiments further set a data batch state for the first data batch, based on a data batch state diagram, and update the data batch state of a prior data batch received before the first data batch, based on the condition of the first data batch. Embodiments additionally transition the data set state diagram, based on the condition of the first data batch, to an updated data set state. Embodiments maintain a data state repository storing the data set state for each of the plurality of heterogeneous data sets.
    Type: Grant
    Filed: November 9, 2021
    Date of Patent: April 23, 2024
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Liangzhao Zeng, Ting Yu Cliff Leung, Yat On Lau, Jimmy Hong, Chuang Yao, Yen-Ting Liu, Ting-Kuan Wu
  • Patent number: 11953877
    Abstract: Manufacturing of a shoe or a portion of a shoe is enhanced by executing various shoe-manufacturing processes in an automated fashion. For example, information describing a shoe part may be determined, such as an identification, an orientation, a color, a surface topography, an alignment, a size, etc. Based on the information describing the shoe part, automated shoe-manufacturing apparatuses may be instructed to apply various shoe-manufacturing processes to the shoe part, such as a pickup and placement of the shoe part with a pickup tool.
    Type: Grant
    Filed: October 20, 2022
    Date of Patent: April 9, 2024
    Assignee: NILE, Inc.
    Inventors: Dragan Jurkovic, Patrick Conall Regan, Chih-Chi Chang, Chang-chu Liao, Ming-Feng Jean, Kuo-Hung Lee, Yen-Hsi Liu, Hung-Yu Wu
  • Patent number: 11953839
    Abstract: In a method of cleaning a lithography system, during idle mode, a stream of air is directed, through a first opening, into a chamber of a wafer table of an EUV lithography system. One or more particles is extracted by the directed stream of air from surfaces of one or more wafer chucks in the chamber of the wafer table. The stream of air and the extracted one or more particle are drawn, through a second opening, out of the chamber of the wafer table.
    Type: Grant
    Filed: December 5, 2022
    Date of Patent: April 9, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shih-Yu Tu, Shao-Hua Wang, Yen-Hao Liu, Chueh-Chi Kuo, Li-Jui Chen, Heng-Hsin Liu
  • Patent number: 11948949
    Abstract: In some embodiments, the present disclosure relates to a device having a semiconductor substrate including a frontside and a backside. On the frontside of the semiconductor substrate are a first source/drain region and a second source/drain region. A gate electrode is arranged on the frontside of the semiconductor substrate and includes a horizontal portion, a first vertical portion, and a second vertical portion. The horizontal portion is arranged over the frontside of the semiconductor substrate and between the first and second source/drain regions. The first vertical portion extends from the frontside towards the backside of the semiconductor substrate and contacts the horizontal portion of the gate electrode structure. The second vertical portion extends from the frontside towards the backside of the semiconductor substrate, contacts the horizontal portion of the gate electrode structure, and is separated from the first vertical portion by a channel region of the substrate.
    Type: Grant
    Filed: July 15, 2022
    Date of Patent: April 2, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Yuan Chen, Ching-Chun Wang, Hsiao-Hui Tseng, Jen-Cheng Liu, Jhy-Jyi Sze, Shyh-Fann Ting, Wei Chuang Wu, Yen-Ting Chiang, Chia Ching Liao, Yen-Yu Chen
  • Publication number: 20240106104
    Abstract: An electronic device includes a device body and an antenna module disposed in the device body and including a conductive structure and a coaxial cable including a core wire, a shielding layer wrapping the core wire, and an outer jacket wrapping the shielding layer. The conductive structure includes a structure body and a slot formed on the structure body and penetrating the structure body in a thickness direction of the structure body. A section of the shielding layer extends from the outer jacket and is connected to the structure body. A physical portion of the structure body and the section of the shielding layer are respectively located on two opposite sides of the slot in a width direction of the slot. A section of the core wire extends from the section of the shielding layer and overlaps the slot and the physical portion in the thickness direction.
    Type: Application
    Filed: September 8, 2023
    Publication date: March 28, 2024
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Hung-Yu Yeh, Shih-Chia Liu, Yen-Hao Yu, Li-Chun Lee, Chih-Heng Lin, Jui-Hung Lai
  • Patent number: 11737466
    Abstract: The present invention provides a method of improving the ability of plants to resistance diseases, comprising using a strain of Bacillus amyloliquefaciens and a Bidens plant extract; and the Bidens plant extract enhances the ability of the Bacillus amyloliquefaciens to inhibit the growth of the Acidovorax avenae subsp. citrulli, increases the metabolic activity of the Bacillus amyloliquefaciens, increases the amount of the biofilm formation of the Bacillus amyloliquefaciens, and maintains the alive number of the Bacillus amyloliquefaciens.
    Type: Grant
    Filed: December 10, 2019
    Date of Patent: August 29, 2023
    Assignees: NATIONAL TAIWAN UNIVERSITY, ACADEMIA SINICA
    Inventors: Chi-Te Liu, Wen-Chin Yang, Yen-Yu Liu, Chu-Ning Huang, Chan-Pin Lin
  • Patent number: 10921070
    Abstract: The present disclosure describes a connector assembly for a liquid manifold within a server rack. The connector assembly includes a pipe configured to connect to the liquid manifold. The pipe has a flexible portion configured to accommodate at least one of lateral or vertical manipulation of the pipe while the pipe remains connected to the liquid manifold. The connector assembly further includes a first connector and a second connector configured to form a liquid-tight connection when coupled together. One of the first connector and the second connector is connected to a distal end of the pipe. The other of the first connector and the second connector is configured to connect to a component within the server rack, for supplying coolant from the liquid manifold to the component.
    Type: Grant
    Filed: March 7, 2019
    Date of Patent: February 16, 2021
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Chih-Hsiang Lee, Chih-Ming Chen, Yen-Yu Liu
  • Patent number: 10892557
    Abstract: An antenna structure capable of operating in several modes includes first and second metal patches and a substrate (which can be an air-filled void) positioned between them. The second patch is substantially an isosceles trapezoidal patch. The second patch includes a first bottom edge, a second bottom edge parallel to and spaced from the first bottom edge, a first side edge, a second side edge, a first shorting wall, and a second short circuit patch. The first side edge and the second side edge are connected to the first bottom edge and the second bottom edge. The first shorting wall and the second shorting wall are formed between the first patch and the second patch. The second patch further defines a V-shaped slot.
    Type: Grant
    Filed: June 19, 2019
    Date of Patent: January 12, 2021
    Assignee: AMBIT MICROSYSTEMS (SHANGHAI) LTD.
    Inventor: Yen-Yu Liu
  • Publication number: 20200403318
    Abstract: An antenna structure capable of operating in several modes includes first and second metal patches and a substrate (which can be an air-filled void) positioned between them. The second patch is substantially an isosceles trapezoidal patch. The second patch includes a first bottom edge, a second bottom edge parallel to and spaced from the first bottom edge, a first side edge, a second side edge, a first shorting wall, and a second short circuit patch. The first side edge and the second side edge are connected to the first bottom edge and the second bottom edge. The first shorting wall and the second shorting wall are formed between the first patch and the second patch. The second patch further defines a V-shaped slot.
    Type: Application
    Filed: June 19, 2019
    Publication date: December 24, 2020
    Inventor: YEN-YU LIU
  • Publication number: 20200390105
    Abstract: The present invention provides a method of improving the ability of plants to resistance diseases, comprising using a strain of Bacillus amyloliquefaciens and a Bidens plant extract; and the Bidens plant extract enhances the ability of the Bacillus amyloliquefaciens to inhibit the growth of the Acidovorax avenae subsp. citrulli, increases the metabolic activity of the Bacillus amyloliquefaciens, increases the amount of the biofilm formation of the Bacillus amyloliquefaciens, and maintains the alive number of the Bacillus amyloliquefaciens.
    Type: Application
    Filed: December 10, 2019
    Publication date: December 17, 2020
    Inventors: Chi-Te Liu, Wen-Chin Yang, Yen-Yu Liu, Chu-Ning Huang, Chan-Pin Lin
  • Publication number: 20200191504
    Abstract: The present disclosure describes a connector assembly for a liquid manifold within a server rack. The connector assembly includes a pipe configured to connect to the liquid manifold. The pipe has a flexible portion configured to accommodate at least one of lateral or vertical manipulation of the pipe while the pipe remains connected to the liquid manifold. The connector assembly further includes a first connector and a second connector configured to form a liquid-tight connection when coupled together. One of the first connector and the second connector is connected to a distal end of the pipe. The other of the first connector and the second connector is configured to connect to a component within the server rack, for supplying coolant from the liquid manifold to the component.
    Type: Application
    Filed: March 7, 2019
    Publication date: June 18, 2020
    Inventors: Chao-Jung CHEN, Chih-Hsiang LEE, Chih-Ming CHEN, Yen-Yu LIU