Abstract: An MRAM memory cell includes a substrate and a transistor. The transistor includes: first and second source regions; a drain region between the first and second source regions; a first channel region between the drain region and the first source region; a second channel region between the drain region and the second source region; a first gate structure over the first channel region; and a second gate structure over the second channel region. A magnetic tunnel junction is overlying the transistor. The drain region is coupled to the magnetic tunnel junction. A first metal layer is overlying the transistor, and a second metal layer is overlying the first metal layer. The second and first metal layers couple a common source line signal to the first and second source regions of the MRAM memory cell and to those of a neighboring MRAM memory cell.

Abstract: An MRAM memory cell includes a substrate and a transistor. The transistor includes: first and second source regions; a drain region between the first and second source regions; a first channel region between the drain region and the first source region; a second channel region between the drain region and the second source region; a first gate structure over the first channel region; and a second gate structure over the second channel region. A magnetic tunnel junction is overlying the transistor. The drain region is coupled to the magnetic tunnel junction. A first metal layer is overlying the transistor, and a second metal layer is overlying the first metal layer. The second and first metal layers couple a common source line signal to the first and second source regions of the MRAM memory cell and to those of a neighboring MRAM memory cell.

Abstract: This specification describes systems and methods for using Zero Echo Time (ZTE) magnetic resonance imaging (MRI) sequences for applications to functional MRI (fMRI). In some examples, a system for functional magnetic resonance imaging includes a magnetic resonance imaging (MRI) scanner and a control console implemented on at least one processor. The control console is configured for executing, using the MRI scanner, a zero echo time (ZTE) pulse sequence; acquiring, using the MRI scanner, magnetic resonance data in response to the ZTE pulse sequence; and constructing at least one MRI image using the magnetic resonance data and measuring tissue oxygenation (PtO2)-related T1 changes as a proxy of neural activity changes of a subject using the at least one MRI image.

Abstract: This specification describes systems and methods for using Zero Echo Time (ZTE) magnetic resonance imaging (MRI) sequences for applications to functional MRI (fMRI). In some examples, a system for functional magnetic resonance imaging includes a magnetic resonance imaging (MRI) scanner and a control console implemented on at least one processor. The control console is configured for executing, using the MRI scanner, a zero echo time (ZTE) pulse sequence; acquiring, using the MRI scanner, magnetic resonance data in response to the ZTE pulse sequence; and constructing at least one MRI image using the magnetic resonance data and measuring tissue oxygenation (PtO2)-related T1 changes as a proxy of neural activity changes of a subject using the at least one MRI image.

Abstract: An MRAM memory cell includes a substrate and a transistor. The transistor includes: first and second source regions; a drain region between the first and second source regions; a first channel region between the drain region and the first source region; a second channel region between the drain region and the second source region; a first gate structure over the first channel region; and a second gate structure over the second channel region. A magnetic tunnel junction is overlying the transistor. The drain region is coupled to the magnetic tunnel junction. A first metal layer is overlying the transistor, and a second metal layer is overlying the first metal layer. The second and first metal layers couple a common source line signal to the first and second source regions of the MRAM memory cell and to those of a neighboring MRAM memory cell.

Abstract: An MRAM memory cell includes a substrate and a transistor. The transistor includes: first and second source regions; a drain region between the first and second source regions; a first channel region between the drain region and the first source region; a second channel region between the drain region and the second source region; a first gate structure over the first channel region; and a second gate structure over the second channel region. A magnetic tunnel junction is overlying the transistor. The drain region is coupled to the magnetic tunnel junction. A first metal layer is overlying the transistor, and a second metal layer is overlying the first metal layer. The second and first metal layers couple a common source line signal to the first and second source regions of the MRAM memory cell and to those of a neighboring MRAM memory cell.

Abstract: This specification describes systems and methods for using Zero Echo Time (ZTE) magnetic resonance imaging (MRI) sequences for applications to functional MRI (fMRI). In some examples, a system for functional magnetic resonance imaging includes a magnetic resonance imaging (MRI) scanner and a control console implemented on at least one processor. The control console is configured for executing, using the MRI scanner, a zero echo time (ZTE) pulse sequence; acquiring, using the MRI scanner, magnetic resonance data in response to the ZTE pulse sequence; and constructing at least one MRI image using the magnetic resonance data and measuring tissue oxygenation (PtO2)-related T1 changes as a proxy of neural activity changes of a subject using the at least one MRI image.

Abstract: An MRAM memory cell includes a substrate and a transistor. The transistor includes: first and second source regions; a drain region between the first and second source regions; a first channel region between the drain region and the first source region; a second channel region between the drain region and the second source region; a first gate structure over the first channel region; and a second gate structure over the second channel region. A magnetic tunnel junction is overlying the transistor. The drain region is coupled to the magnetic tunnel junction. A first metal layer is overlying the transistor, and a second metal layer is overlying the first metal layer. The second and first metal layers couple a common source line signal to the first and second source regions of the MRAM memory cell and to those of a neighboring MRAM memory cell.

Abstract: The present disclosure provides a system and method for forming a reduced area MRAM memory cell including a substrate, a transistor overlying the substrate and a magnetic tunnel junction overlying the transistor. The transistor includes a first and second source regions, a drain region between the first and second source regions, at least one first channel region between the drain region and the first source region, at least one second channel region between the drain region and the second source region, a first gate structure overlying the at least one first channel region, and a second gate structure overlying the at least one second channel region. First and second metal layers overlie the transistor. The first and second metal layers are configured to couple a common source line signal to the first and second source regions.

Abstract: The present disclosure provides a system and method for forming a reduced area MRAM memory cell including a substrate, a transistor overlying the substrate and a magnetic tunnel junction overlying the transistor. The transistor includes a first and second source regions, a drain region between the first and second source regions, at least one first channel region between the drain region and the first source region, at least one second channel region between the drain region and the second source region, a first gate structure overlying the at least one first channel region, and a second gate structure overlying the at least one second channel region. First and second metal layers overlie the transistor. The first and second metal layers are configured to couple a common source line signal to the first and second source regions.