Patents by Inventor Yencheng KUO

Yencheng KUO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PACKAGE DEVICE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20230005841
    Abstract: A semiconductor package device and a method of manufacturing a semiconductor package device are provided. The semiconductor package device includes a substrate, a first electronic component, a first dielectric layer, and a first hole. The substrate has a first surface and a second surface opposite to the first surface. The first electronic component is disposed on the first surface. The first dielectric layer is disposed on the second surface and has a third surface away from the substrate. The first hole extends from the first dielectric layer and the substrate. The first hole is substantially aligned with the first electronic component.
    Type: Application
    Filed: September 12, 2022
    Publication date: January 5, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yencheng KUO, Shao-Lun YANG
  • Semiconductor package device and method for manufacturing the same
    Patent number: 11444032
    Abstract: A semiconductor package device and a method of manufacturing a semiconductor package device are provided. The semiconductor package device includes a substrate, a first electronic component, a first dielectric layer, and a first hole. The substrate has a first surface and a second surface opposite to the first surface. The first electronic component is disposed on the first surface. The first dielectric layer is disposed on the second surface and has a third surface away from the substrate. The first hole extends from the first dielectric layer and the substrate. The first hole is substantially aligned with the first electronic component.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: September 13, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yencheng Kuo, Shao-Lun Yang
  • SEMICONDUCTOR PACKAGE DEVICE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20210407910
    Abstract: A semiconductor package device and a method of manufacturing a semiconductor package device are provided. The semiconductor package device includes a substrate, a first electronic component, a first dielectric layer, and a first hole. The substrate has a first surface and a second surface opposite to the first surface. The first electronic component is disposed on the first surface. The first dielectric layer is disposed on the second surface and has a third surface away from the substrate. The first hole extends from the first dielectric layer and the substrate. The first hole is substantially aligned with the first electronic component.
    Type: Application
    Filed: June 30, 2020
    Publication date: December 30, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yencheng KUO, Shao-Lun YANG