Patents by Inventor Yency Chen

Yency Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060213648
    Abstract: A method for manufacturing a heat dissipation apparatus comprises the following steps: A substrate is provided. A pressure is exerted on the substrate by a roller mold to form a plurality of grooves on one surface of the substrate. A sealed chamber is formed out of the substrate so that the grooves are formed on an inner wall of the sealed chamber.
    Type: Application
    Filed: July 27, 2005
    Publication date: September 28, 2006
    Inventors: Yency Chen, Hsin-Chang Tsai, Horng-Jou Wang, Chi-Feng Lin, Chin-Ming Chen
  • Publication number: 20060081360
    Abstract: A heat dissipation apparatus. The heat-dissipation apparatus comprises a chamber, a working fluid, an evaporation section and a condensing section. The chamber has an inner wall, and the working fluid is sealed in the chamber. The evaporation section and the condensing section are located at the inner wall. The first grooves are disposed on the inner wall and connected to the evaporation section and the condensing section. The working fluid is vaporized at the evaporation section when absorbing heat from the heat source and condenses to a liquid phase and releases the heat at the condensing section, and the first groove provides a capillary force to drive the working fluid from the condensing section back to the evaporation section.
    Type: Application
    Filed: February 25, 2005
    Publication date: April 20, 2006
    Inventors: Yency Chen, Chi-Feng Lin, Chin-Ming Chen, Hsin-Chang Tsai, Horng-Jou Wang
  • Publication number: 20060037737
    Abstract: A heat dissipation apparatus and a vapor chamber thereof. The heat dissipation apparatus comprises a heat sink and a vapor chamber for dissipating heat from a heat source of an electric device. The vapor chamber comprises a heat-absorption region, a heat-dissipation region, a working fluid, a wick structure and at least one buffer region. The working fluid in the heat-absorption region is vaporized while absorbing heat in the heat-absorption region from the heat source, and the vaporized working fluid condenses in the heat-dissipation region after latent heat thereof is released. The capillarity of the wick structure drives the working fluid returning to the heat-absorption region from the heat-dissipation region, and the buffer regions include a reservoir for accessing the working fluid. The heat-dissipation apparatus equipped with a vapor chamber having buffer regions can reduce entire weight and shorten distance during heat conduction so that heat dissipation efficiency is increased.
    Type: Application
    Filed: March 16, 2005
    Publication date: February 23, 2006
    Inventors: Yency Chen, Chi-Feng Lin, Chin-Ming Chen
  • Publication number: 20060000581
    Abstract: A cylindrical heat pipe. The heat pipe includes a hollow body, a cover, and a tube. The hollow body includes a sealed bottom, a top portion and an inner wall. The cover includes an elevated portion near the top portion. The tube penetrates the cover. The cover seals the hollow body and guides working fluid passing therethrough into the heat pipe. After working fluid is added and vacuums, the tube is sealed, thus the elevated portion enlarges heat-dissipation region of the heat pipe.
    Type: Application
    Filed: October 28, 2004
    Publication date: January 5, 2006
    Inventors: Yency Chen, Chi-Feng Lin, Chin-Ming Chen