Abstract: Described herein is a composition for selectively etching a layer including a silicon germanium alloy (SiGe) in the presence of a silicon-containing layer, particularly a layer comprising a-Si, SiOx, SiON, SiN, or a combination thereof, the composition including: (a) an oxidizing agent, (b) an acid selected from an inorganic acid and an organic acid, (c) an etchant including a source of fluoride ions, (d) a polyvinylpyrrolidone (PVP), and (e) water.

Abstract: The use of an organic compound as cleavable additive, preferably as cleavable surfactant, in the modification and/or treatment of at least one surface of a semiconductor substrate is described. Moreover, it is described a method of making a semiconductor substrate, comprising contacting at least one surface thereof with an organic compound, or with a composition comprising it, to treat or modify said surface, cleaving said organic compound into a set of fragments and removing said set of fragments from the contacted surface. More in particular, a method of cleaning or rinsing a semiconductor substrate or an intermediate semiconductor substrate is described. In addition, a compound is described which is suitable for the uses and methods pointed out above and which preferably is a cleavable surfactant.

Abstract: The present invention relates to the use of liquid aqueous polymer compositions containing an aqueous polymer latex and at least one inorganic particulate material for providing flexible roof coatings. The present invention also relates to a method for providing flexible roof coatings, which comprises applying said liquid aqueous polymer compositions to a flat roof. The liquid aqueous polymer composition contain, a. an aqueous polymer latex, where the polymer in the polymer latex is made of polymerized monomers M, where the polymerized ethylenically unsaturated monomers M comprise a combination of) at least two different monoethylenically unsaturated, non-ionic monomers M1, whose homopolymers have a theoretical glass transition temperature Tg(th) of at least 25° C. and ii) at least two different monoethylenically unsaturated, non-ionic monomers M2, whose homopolymers have a theoretical glass transition temperature Tg(th) of at less than 25° C.

Abstract: A composition comprising a monomer of the general formula (M1) wherein M is a metal or semimetal of main group 3 or 4 of the periodic table; XM1, XM2 are each O; RM1, RM2 are the same or different and are each an —CRaRb—Ar—O—Rc; Ar is a C6 to C30 carbocyclic ring system; Ra, Rb are the same or different and are each H or C1 to C6 alkyl; Rc is C1-C22-alkyl, benzyl or phenyl; q according to the valency and charge of M is 0 or 1; XM3, XM4 are the same or different and are each O, C6 to C10 aryl, or —CH2—; RM3, RM4 are the same or different and are each RM1, H, C1-C22 alkyl, or a polymer selected from a polyalkylene, a polysiloxane, or a polyether.

Abstract: The invention relates to a composition for selectively etching a layer comprising a silicon germanium alloy (SiGe) in the presence of a silicon-containing layer, particularly a layer comprising a-Si, SiOx, SiON, SiN, or a combination thereof, the composition comprising: (a) an oxidizing agent, (b) an acid selected from an inorganic acid and an organic acid, 10 (c) an etchant comprising a source of fluoride ions, (d) a polyvinylpyrrolidone (PVP), and (e) water.

Abstract: Described herein is a non-aqueous composition including (a) an organic solvent, and (b) at least one additive of formulae I, where R1, R2, R3, and R4 are independently selected from C1 to C10 alkyl, C1 to C11 alkylcarbonyl, C6 to C12 aryl, C7 to C14 alkylaryl, and C7 to C14 arylalkyl; and n is 0 or 1.

Abstract: A resin composition, comprising (a) at least one epoxy resin, and (b) at least one siloxane-type curing agent of formula C22 or C31 (C22) (C31) wherein the resin composition does essentially not contain any fluoride or bromide.

Abstract: The invention relates to the use of a non-aqueous composition comprising an organic solvent and at least one particular siloxane-type additive for treating substrates comprising patterns having line-space dimensions of 50 nm or below and aspect ratios of 4 or more as well as a method for manufacturing integrated circuit devices, optical devices, micromachines and mechanical precision devices, the said method comprising the steps of (1) providing a substrate having patterned material layers having line-space dimensions of 50 nm, aspect ratios of greater or equal 4, or a combination thereof, (2) contacting the substrate at least once with a non-aqueous composition, and (3) removing the non-aqueous composition from the contact with the substrate, wherein the non-aqueous composition comprising an organic solvent and at least one of such siloxane-type additives.

Abstract: The invention relates to the use of a composition comprising a C1 to C6 alkanol and a carboxylic acid ester of formula (I) wherein R1 is selected from a C1 to C6 alkyl, which may be unsubstituted or substituted by OH or F, and —X21—[O—X22]n—H; R2 is selected from a C1 to C6 alkyl, which may be unsubstituted or substituted by OH or F, and —X21—[O—X22]n—H; X21, X22 are independently selected from C1 to C6 alkandiyl, which may be unsubstituted or substituted by OH or F; n is an integer from 1 to 5. wherein, the C1 to C6 alkanol and the carboxylic acid ester are selected so as to form an azeotropic mixture and are present in an amount from 20% by weight below to 20% by weight above such azeotropic mixture.

Abstract: The use of an organic compound as cleavable additive, preferably as cleavable surfactant, in the modification and/or treatment of at least one surface of a semiconductor substrate is described. Moreover, it is described a method of making a semiconductor substrate, comprising contacting at least one surface thereof with an organic compound, or with a composition comprising it, to treat or modify said surface, cleaving said organic compound into a set of fragments and removing said set of fragments from the contacted surface. More in particular, a method of cleaning or rinsing a semiconductor substrate or an intermediate semiconductor substrate is described. In addition, a compound is described which is suitable for the uses and methods pointed out above and which preferably is a cleavable surfactant.

Abstract: The present invention relates to the use of liquid aqueous polymer compositions containing an aqueous polymer latex and at least one inorganic particulate material for providing flexible roof coatings. The present invention also relates to a method for providing flexible roof coatings, which comprises applying said liquid aqueous polymer compositions to a flat roof. The liquid aqueous polymer composition contain, a an aqueous polymer latex, where the polymer in the polymer latex is made of polymerized monomers M, where the polymerized ethylenically unsaturated monomers M comprise a combination of) at least two different monoethylenically unsaturated, non-ionic monomers M1, whose homopolymers have a theoretical glass transition temperature Tg(th) of at least 25° C. and ii) at least two different monoethylenically unsaturated, non-ionic monomers M2, whose homopolymers have a theoretical glass transition temperature Tg(th) of at less than 25° C.

Abstract: The invention relates to the use of a non-aqueous composition comprising an organic solvent and at least one particular siloxane-type additive for treating substrates comprising patterns having line-space dimensions of 50 nm or below and aspect ratios of 4 or more as well as a method for manufacturing integrated circuit devices, optical devices, micromachines and mechanical precision devices, the said method comprising the steps of (1) providing a substrate having patterned material layers having line-space dimensions of 50 nm, aspect ratios of greater or equal 4, or a combination thereof, (2) contacting the substrate at least once with a non-aqueous composition, and (3) removing the non-aqueous composition from the contact with the substrate, wherein the non-aqueous composition comprising an organic solvent and at least one of such siloxane-type additives.

Abstract: The present invention provides an aqueous polyurethane (PU)-polyacrylate hybrid dispersion obtainable by free radical polymerization of at least one acrylate polymer (A1) in the presence of at least one polyurethane (P1), a process for preparing these aqueous polyurethane-polyacrylate hybrid dispersions, wherein said process comprises a) preparing an aqueous polyurethane dispersion and b) using the polyurethane dispersion thus prepared as raw material for the further synthesis of a polyacrylate dispersion, and the use of the hybrid dispersion thus obtained as binder in filled coating materials, particularly as a binder for flexible roof coatings.

Abstract: The present invention provides an aqueous polyurethane (PU)-polyacrylate hybrid dispersion obtainable by free radical polymerization of at least one acrylate polymer (A1) in the presence of at least one polyurethane (P1), a process for preparing these aqueous polyurethane-polyacrylate hybrid dispersions, wherein said process comprises a) preparing an aqueous polyurethane dispersion and b) using the polyurethane dispersion thus prepared as raw material for the further synthesis of a polyacrylate dispersion, and the use of the hybrid dispersion thus obtained as binder in filled coating materials, particularly as a binder for flexible roof coatings.

Abstract: A process for preparing an aqueous polymer dispersion of a polymer P by radically initiated aqueous emulsion polymerization of ethylenically unsaturated compounds, which comprises radically initiated aqueous emulsion polymerizing a monomer composition. The use of the aqueous polymer in tile adhesives is also provided.

Abstract: Process for preparing an aqueous polymer dispersion and use thereof in tile adhesives.