Patents by Inventor Yenloan H. Nguyen

Yenloan H. Nguyen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for preventing adhesive bleed onto surfaces
    Patent number: 6420253
    Abstract: A method and structure is provided for preventing wetting or bleed of an adhesive, such as an epoxy, onto noble metal wire bond pads on the surface of a dielectric substrate when attaching an I/C chip to the substrate. The method includes treating the wire bond pads with a chemical composition which prevents bleeding onto the surfaces of the wire bond pads by a component of the epoxy. The chemical composition is a chemical which will provide “Self-Assembled Monolayers” (SAMs) on the surface of the gold. These compositions are characterized by a molecule having at least one group, such as a mercaptan or disulfide, connected to a hydrocarbon moiety, such as a (CH2)x chain. The affinity of the thiol or sulfur-containing portion of the molecule chemically bonding with the noble metal provides a relatively strong attachment of the molecule to the metal surface.
    Type: Grant
    Filed: June 14, 2001
    Date of Patent: July 16, 2002
    Assignee: International Business Machines Corporation
    Inventors: Bernd K. Appelt, Gary A. Johansson, Gerald W. Jones, Luis J. Matienzo, Yenloan H. Nguyen, Konstantinos I. Papathomas
  • Method and structure for preventing adhesive bleed onto surfaces
    Publication number: 20010028117
    Abstract: A method and structure is provided for preventing wetting or bleed of an adhesive, such as an epoxy, onto noble metal wire bond pads on the surface of a dielectric substrate when attaching an I/C chip to the substrate. The method includes treating the wire bond pads with a chemical composition which prevents bleeding onto the surfaces of the wire bond pads by a component of the epoxy. The chemical composition is a chemical which will provide “Self-Assembled Monolayers” (SAMs) on the surface of the gold. These compositions are characterized by a molecule having at least one group, such as a mercaptan or disulfide, connected to a hydrocarbon moiety, such as a (CH2)x chain. The affinity of the thiol or sulfur-containing portion of the molecule chemically bonding with the noble metal provides a relatively strong attachment of the molecule to the metal surface.
    Type: Application
    Filed: June 14, 2001
    Publication date: October 11, 2001
    Applicant: International Business Machines Corporation
    Inventors: Bernd K. Appelt, Gary A. Johansson, Gerald W. Jones, Luis J. Matienzo, Yenloan H. Nguyen, Konstantinos I. Papathomas
  • Structure for preventing adhesive bleed onto surfaces
    Patent number: 6252307
    Abstract: A method and structure is provided for preventing wetting or bleed of an adhesive, such as an epoxy, onto noble metal wire bond pads on the surface of a dielectric substrate when attaching an I/C chip to the substrate. The method includes treating the wire bond pads with a chemical composition which prevents bleeding onto the surfaces of the wire bond pads by a component of the epoxy. The chemical composition is a chemical which will provide “Self-Assembled Monolayers” (SAMs) on the surface of the gold. These compositions are characterized by a molecule having at least one group, such as a mercaptan or disulfide, connected to a hydrocarbon moiety, such as a (CH2)x chain. The affinity of the thiol or sulfur-containing portion of the molecule chemically bonding with the noble metal provides a relatively strong attachment of the molecule to the metal surface.
    Type: Grant
    Filed: March 28, 2000
    Date of Patent: June 26, 2001
    Assignee: International Business Machines Corporation
    Inventors: Bernd K. Appelt, Gary A. Johansson, Gerald W. Jones, Luis J. Matienzo, Yenloan H. Nguyen, Konstantinos I. Papathomas