Patents by Inventor Yeo Ju CHO

Yeo Ju CHO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic component and board for mounting the same
    Patent number: 11955281
    Abstract: An electronic component includes: a multilayer capacitor including a capacitor body and a pair of external electrodes, respectively disposed on external surfaces of the capacitor body in a first direction; and an interposer disposed below the multilayer capacitor and including an interposer body, a pair of via holes penetrating through the interposer body, and a pair of via electrodes, respectively disposed in the via holes to be connected to the pair of external electrodes, respectively. 0.24T?t?0.3T, where “T” is a maximum height of the multilayer capacitor and “t” is a maximum height of the interposer.
    Type: Grant
    Filed: May 17, 2021
    Date of Patent: April 9, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Hoon Kim, Chang Hee Lee, Jea Hoon Lee, Hye Jin Kim, Yeo Ju Cho
  • ELECTRONIC COMPONENT AND BOARD FOR MOUNTING THE SAME
    Publication number: 20220165493
    Abstract: An electronic component includes: a multilayer capacitor including a capacitor body and a pair of external electrodes, respectively disposed on external surfaces of the capacitor body in a first direction; and an interposer disposed below the multilayer capacitor and including an interposer body, a pair of via holes penetrating through the interposer body, and a pair of via electrodes, respectively disposed in the via holes to be connected to the pair of external electrodes, respectively. 0.24T?t?0.3T, where “T” is a maximum height of the multilayer capacitor and “t” is a maximum height of the interposer.
    Type: Application
    Filed: May 17, 2021
    Publication date: May 26, 2022
    Inventors: Jae Hoon KIM, Chang Hee LEE, Jea Hoon LEE, Hye Jin KIM, Yeo Ju CHO
  • Multilayer electronic component
    Patent number: 10388459
    Abstract: A multilayer electronic component has a structure in which an internal electrode connected to a positive (+) terminal of a circuit and an internal electrode connected to a ground of the circuit are implemented together on one dielectric layer and external electrodes commonly use a multi-terminal connected to the ground of the circuit.
    Type: Grant
    Filed: January 22, 2018
    Date of Patent: August 20, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Gyoung Heon Ko, Young Jong Yoo, Jea Hoon Lee, Yeo Ju Cho
  • MULTILAYER ELECTRONIC COMPONENT
    Publication number: 20180286592
    Abstract: A multilayer electronic component has a structure in which an internal electrode connected to a positive (+) terminal of a circuit and an internal electrode connected to a ground of the circuit are implemented together on one dielectric layer and external electrodes commonly use a multi-terminal connected to the ground of the circuit.
    Type: Application
    Filed: January 22, 2018
    Publication date: October 4, 2018
    Inventors: Gyoung Heon KO, Young Jong YOO, Jea Hoon LEE, Yeo Ju CHO