Patents by Inventor Yeo Ju Kim

Yeo Ju Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11955281
    Abstract: An electronic component includes: a multilayer capacitor including a capacitor body and a pair of external electrodes, respectively disposed on external surfaces of the capacitor body in a first direction; and an interposer disposed below the multilayer capacitor and including an interposer body, a pair of via holes penetrating through the interposer body, and a pair of via electrodes, respectively disposed in the via holes to be connected to the pair of external electrodes, respectively. 0.24T?t?0.3T, where “T” is a maximum height of the multilayer capacitor and “t” is a maximum height of the interposer.
    Type: Grant
    Filed: May 17, 2021
    Date of Patent: April 9, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Hoon Kim, Chang Hee Lee, Jea Hoon Lee, Hye Jin Kim, Yeo Ju Cho
  • Publication number: 20230391999
    Abstract: The present disclosure relates to thermoplastic resin composition including: a graft polymer comprising a diene-based rubber polymer onto which a (meth)acrylate-based monomer unit and a vinyl aromatic monomer unit are grafted; a non-grafted polymer comprising a (meth)acrylate-based monomer unit and a vinyl aromatic monomer unit; and 3 to 30% by weight of waste artificial marble.
    Type: Application
    Filed: May 2, 2022
    Publication date: December 7, 2023
    Applicant: LG CHEM, LTD.
    Inventors: Sang Hoo PARK, Jeong Su CHOI, Won Seok LEE, Roo Da LEE, Yeo Ju KIM, Jong Ju LEE
  • Patent number: 11795348
    Abstract: The present invention relates to an adhesive composition and a protective film including an adhesive layer formed by using the same, wherein the adhesive composition includes an acrylic copolymer formed by polymerizing a monomer mixture, the monomer mixture including a monomer represented by [Formula 1], a (meth)acrylic monomer including a carboxy group, a (meth)acrylic monomer including a cross-linkable functional group, and an alkyl(meth)acrylate-based monomer, wherein the acrylic copolymer has a polymerization conversion rate of 99 wt % or higher.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: October 24, 2023
    Inventors: Yeo Ju Kim, Han Soo Kim, Kee Young Kim, Yoon Jung Kim, Sang Hyun Hong
  • Publication number: 20220135843
    Abstract: The present disclosure relates to an acrylic emulsion pressure-sensitive adhesive composition, and more particularly, to an acrylic emulsion pressure-sensitive adhesive composition which can realize excellent adhesive properties and hardly occurs residues during peeling, and thus, can be used for paper labels, etc.
    Type: Application
    Filed: December 16, 2019
    Publication date: May 5, 2022
    Applicant: LG Chem, Ltd.
    Inventors: Hyo Min Kim, Seung Hun Yang, Sungjong Seo, Yeo Ju Kim
  • Publication number: 20200377763
    Abstract: The present invention relates to an adhesive composition and a protective film including an adhesive layer formed by using the same, wherein the adhesive composition includes an acrylic copolymer formed by polymerizing a monomer mixture, the monomer mixture including a monomer represented by [Formula 1], a (meth)acrylic monomer including a carboxy group, a (meth)acrylic monomer including a cross-linkable functional group, and an alkyl(meth)acrylate-based monomer, wherein the acrylic copolymer has a polymerization conversion rate of 99 wt % or higher.
    Type: Application
    Filed: December 21, 2018
    Publication date: December 3, 2020
    Applicant: LG Chem, Ltd.
    Inventors: Yeo Ju Kim, Han Soo Kim, Kee Young Kim, Yoon Jung Kim, Sang Hyun Hong