Patents by Inventor YeoChan Ko
YeoChan Ko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11670618Abstract: A semiconductor device includes a substrate with an opening formed through the substrate. A first electronic component is disposed over the substrate outside a footprint of the first opening. A second electronic component is disposed over the substrate opposite the first electrical component. A third electronic component is disposed over the substrate adjacent to the first electronic component. The substrate is disposed in a mold including a second opening of the mold over a first side of the substrate. The mold contacts the substrate between the first electronic component and the third electronic component. An encapsulant is deposited into the second opening. The encapsulant flows through the first opening to cover a second side of the substrate. In some embodiments, a mold film is disposed in the mold, and an interconnect structure on the substrate is embedded in the mold film.Type: GrantFiled: September 1, 2020Date of Patent: June 6, 2023Assignee: STATS ChipPAC Pte. Ltd.Inventors: DeokKyung Yang, YongMin Kim, JaeHyuk Choi, YeoChan Ko, HeeSoo Lee
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Publication number: 20200402955Abstract: A semiconductor device includes a substrate with an opening formed through the substrate. A first electronic component is disposed over the substrate outside a footprint of the first opening. A second electronic component is disposed over the substrate opposite the first electrical component. A third electronic component is disposed over the substrate adjacent to the first electronic component. The substrate is disposed in a mold including a second opening of the mold over a first side of the substrate. The mold contacts the substrate between the first electronic component and the third electronic component. An encapsulant is deposited into the second opening. The encapsulant flows through the first opening to cover a second side of the substrate. In some embodiments, a mold film is disposed in the mold, and an interconnect structure on the substrate is embedded in the mold film.Type: ApplicationFiled: September 1, 2020Publication date: December 24, 2020Applicant: STATS ChipPAC Pte. Ltd.Inventors: DeokKyung Yang, YongMin Kim, JaeHyuk Choi, YeoChan Ko, HeeSoo Lee
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Patent number: 10797024Abstract: A semiconductor device includes a substrate with an opening formed through the substrate. A first electronic component is disposed over the substrate outside a footprint of the first opening. A second electronic component is disposed over the substrate opposite the first electrical component. A third electronic component is disposed over the substrate adjacent to the first electronic component. The substrate is disposed in a mold including a second opening of the mold over a first side of the substrate. The mold contacts the substrate between the first electronic component and the third electronic component. An encapsulant is deposited into the second opening. The encapsulant flows through the first opening to cover a second side of the substrate. In some embodiments, a mold film is disposed in the mold, and an interconnect structure on the substrate is embedded in the mold film.Type: GrantFiled: March 21, 2020Date of Patent: October 6, 2020Assignee: STATS ChipPAC Pte. Ltd.Inventors: DeokKyung Yang, YongMin Kim, JaeHyuk Choi, YeoChan Ko, HeeSoo Lee
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Publication number: 20200219847Abstract: A semiconductor device includes a substrate with an opening formed through the substrate. A first electronic component is disposed over the substrate outside a footprint of the first opening. A second electronic component is disposed over the substrate opposite the first electrical component. A third electronic component is disposed over the substrate adjacent to the first electronic component. The substrate is disposed in a mold including a second opening of the mold over a first side of the substrate. The mold contacts the substrate between the first electronic component and the third electronic component. An encapsulant is deposited into the second opening. The encapsulant flows through the first opening to cover a second side of the substrate. In some embodiments, a mold film is disposed in the mold, and an interconnect structure on the substrate is embedded in the mold film.Type: ApplicationFiled: March 21, 2020Publication date: July 9, 2020Applicant: STATS ChipPAC Pte. Ltd.Inventors: DeokKyung Yang, YongMin Kim, JaeHyuk Choi, YeoChan Ko, HeeSoo Lee
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Patent number: 10636765Abstract: A semiconductor device includes a substrate with an opening formed through the substrate. A first electronic component is disposed over the substrate outside a footprint of the first opening. A second electronic component is disposed over the substrate opposite the first electrical component. A third electronic component is disposed over the substrate adjacent to the first electronic component. The substrate is disposed in a mold including a second opening of the mold over a first side of the substrate. The mold contacts the substrate between the first electronic component and the third electronic component. An encapsulant is deposited into the second opening. The encapsulant flows through the first opening to cover a second side of the substrate. In some embodiments, a mold film is disposed in the mold, and an interconnect structure on the substrate is embedded in the mold film.Type: GrantFiled: March 14, 2017Date of Patent: April 28, 2020Assignee: STATS ChipPAC Pte. Ltd.Inventors: DeokKyung Yang, YongMin Kim, JaeHyuk Choi, YeoChan Ko, HeeSoo Lee
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Publication number: 20180269181Abstract: A semiconductor device includes a substrate with an opening formed through the substrate. A first electronic component is disposed over the substrate outside a footprint of the first opening. A second electronic component is disposed over the substrate opposite the first electrical component. A third electronic component is disposed over the substrate adjacent to the first electronic component. The substrate is disposed in a mold including a second opening of the mold over a first side of the substrate. The mold contacts the substrate between the first electronic component and the third electronic component. An encapsulant is deposited into the second opening. The encapsulant flows through the first opening to cover a second side of the substrate. In some embodiments, a mold film is disposed in the mold, and an interconnect structure on the substrate is embedded in the mold film.Type: ApplicationFiled: March 14, 2017Publication date: September 20, 2018Applicant: STATS ChipPAC Pte. Ltd.Inventors: DeokKyung Yang, YongMin Kim, JaeHyuk Choi, YeoChan Ko, HeeSoo Lee
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Patent number: 9859200Abstract: A system and method of manufacture of an integrated circuit packaging system includes: a base substrate, the base substrate includes a base terminal; an integrated circuit device on the base substrate; a bottom conductive joint on the base terminal; a conductive ball on the bottom conductive joint, the conductive ball includes a core body; and an interposer over the conductive ball.Type: GrantFiled: July 6, 2015Date of Patent: January 2, 2018Assignee: STATS ChipPAC Pte. Ltd.Inventors: SooSan Park, KyuSang Kim, YeoChan Ko, KeoChang Lee, HeeJo Chi, HeeSoo Lee
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Publication number: 20160190054Abstract: A system and method of manufacture of an integrated circuit packaging system includes: a base substrate, the base substrate includes a base terminal; an integrated circuit device on the base substrate; a bottom conductive joint on the base terminal; a conductive ball on the bottom conductive joint, the conductive ball includes a core body; and an interposer over the conductive ball.Type: ApplicationFiled: July 6, 2015Publication date: June 30, 2016Inventors: SooSan Park, KyuSang Kim, YeoChan Ko, KeoChang Lee, HeeJo Chi, HeeSoo Lee