Patents by Inventor Yeon-Duck Ryu

Yeon-Duck Ryu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cap Wafer for Wafer Bonded Packaging and Method for Manufacturing the Same
    Publication number: 20080081398
    Abstract: The present invention relates to semiconductor device manufacturing techniques, and specifically to a field of device packaging techniques at wafer level. More specifically, it relates to a cap wafer for wafer bonding application that is bonded to top part of a device wafer. The method of the present invention excludes the use of deep reactive ion etching of silicon to form a through silicon via. The present invention provides a method for the preparation of cap wafer for wafer bonding application with a simple process of through silicon via interconnection and a wafer level packaging method using the same.
    Type: Application
    Filed: October 2, 2007
    Publication date: April 3, 2008
    Applicant: FIONIX INC.
    Inventors: Sang-Hwan Lee, Yeon-Duck Ryu, Jae-Yong An, Hyun-Jin Choi, Myoung-Seon Shin
  • Optical coupling device having silicon optical bench and optical fiber with angled end face
    Patent number: 7050680
    Abstract: The present invention relates to an optical transmittance device including an optical fiber having a tilted incident plane and a silicon optical bench (SiOB) with a mirror plane. In accordance with the present invention, there provided an optical device, including: a substrate having a groove with a tilted surface, wherein the groove has a mirror plane on the tilted surface; a light emitting means aligned to the substrate; and an optical fiber including a tilted incident plane, wherein a reflected light from the mirror plane is incident to the tilted incident plane.
    Type: Grant
    Filed: December 31, 2002
    Date of Patent: May 23, 2006
    Assignees: Fionix Inc., Institute of Information Assessment
    Inventors: Sung-Hwan Hwang, Yeon-Duck Ryu, Sang-Hwan Lee, Myeong-Hyun Kim, Hyun-Jin Choi, Woo-Chang Choi
  • Optical coupling device having silicon optical bench and optical fiber with angled end face
    Publication number: 20040202428
    Abstract: The present invention relates to an optical transmittance device including an optical fiber having a tilted incident plane and a silicon optical bench (SiOB) with a mirror plane. In accordance with the present invention, there provided an optical device, including: a substrate having a groove with a tilted surface, wherein the groove has a mirror plane on the tilted surface; a light emitting means aligned to the substrate; and an optical fiber including a tilted incident plane, wherein a reflected light from the mirror plane is incident to the tilted incident plane.
    Type: Application
    Filed: December 31, 2002
    Publication date: October 14, 2004
    Inventors: Sung-Hwan Hwang, Yeon-Duck Ryu, Sang-Hwan Lee, Myeong-Hyun Kim, Hyun-Jin Choi, Woo-Chang Choi
  • Method for fabricating fiber blocks using solder as bonding material
    Publication number: 20030235388
    Abstract: The present invention provides a method for fabricating an optical fiber block capable of preventing degradations due to an outgassing effect provided from an epoxy material.
    Type: Application
    Filed: October 31, 2002
    Publication date: December 25, 2003
    Inventors: Sang-Hwan Lee, Yong-Soo Lee, Yeon-Duck Ryu, Hyun-Jin Choi, Myeong-Hyun Kim, Sung-Hwan Hwang