Abstract: A disk brake having a double self-cooling structure to suppress thermal deformation may include a brake disk having a double cooling structure, which is capable of securing cooling performance of the disk while reducing cost and weight of a vehicle compared with the prior art by configuring a self-cooling structure of the disk that can suppress thermal deformation due to excessive frictional heat during braking a vehicle.

Abstract: A carbon ceramic brake disc according to the present invention includes: a support body having cooling channels at the center portion; and friction layers directly attached to the top and the bottom of the support body without a bonding layer and having components different from the components of the support body, in which the support body is composed of a plurality of layers having components similar to the friction layers, gradually toward the friction layers from the cooling channels as the center. Accordingly, the support body can perform thermomechanical shock absorbing that is an original function and the friction layers and the support body can be prevented from separating while the carbon ceramic brake disc is manufactured.

Abstract: A carbon ceramic brake disc according to the present invention includes: a support body having cooling channels at the center portion; and friction layers directly attached to the top and the bottom of the support body without a bonding layer and having components different from the components of the support body, in which the support body is composed of a plurality of layers having components similar to the friction layers, gradually toward the friction layers from the cooling channels as the center. Accordingly, the support body can perform thermomechanical shock absorbing that is an original function and the friction layers and the support body can be prevented from separating while the carbon ceramic brake disc is manufactured.

Abstract: A liquid crystal display device and a method for driving the same are disclosed. The device includes a gamma voltage generation circuit for generating first to ith positive gamma reference voltages having different levels, and first to ith negative gamma reference voltages having different levels, and a plurality of data drive chips, each of the data drive chips converting digital data input thereto into a positive data voltage and a negative data voltage and supplying the positive data voltage and negative data voltage to a liquid crystal display panel, and adjusting a level of the positive data voltage based on a positive gamma reference voltage supplied thereto, among the first to ith positive gamma reference voltages, and adjusting a level of the negative data voltage based on a negative gamma reference voltage supplied thereto, among the first to ith negative gamma reference voltages.

Abstract: A brake disc manufactured by a method of manufacturing a brake disc according to the present invention includes a carbon fiber Cf, silicon Si, silicon carbide Sic, and a silicon-copper alloy SixCuy. The carbon fiber Cf, silicon Si, carbon C, and silicon carbide SiC make a disc light and provide high thermal shock resistance, anti-oxidation, wear resistance, strength, and friction coefficient. The copper Cu and silicon-copper alloy SixCuy increase heat capacity at constant volume of a disc, so a large increase in temperature of the disc is prevented and a changing range of the friction coefficient is reduced in braking. Accordingly, the brake disc according to the present invention has all of the advantage of a brake disc made of a carbon fiber-reinforced ceramic composites without thermal deformation and deterioration of a pad, a hat part, and a caliper.

Abstract: A liquid crystal display device for automatically selecting a common voltage adaptive for a scan line system to supply it to a common electrode of liquid crystal cells is disclosed. In the liquid crystal display device, a controller is selectively controls a supply of a first common voltage or a second common voltage in accordance with a scan line system of an image signal displayed at a liquid crystal display panel. A first common voltage generator supplies the first common voltage in accordance with a control of the controller to the common electrode of the liquid crystal cells. And, a second common voltage generator supplies the second common voltage in accordance with a control of the controller to the common electrode of the liquid crystal cells.

Abstract: A semiconductor package which includes a generally planar die paddle defining multiple peripheral edge segments and a plurality of leads which are segregated into at least two concentric rows. Connected to the top surface of the die paddle is at least one semiconductor die which is electrically connected to at least some of the leads of each row. At least portions of the die paddle, the leads, and the semiconductor die are encapsulated by a package body, the bottom surfaces of the die paddle and the leads of at least one row thereof being exposed in a common exterior surface of the package body.

Abstract: In accordance with the present invention, there is provided a semiconductor package (e.g., a QFP package) including a uniquely configured leadframe sized and configured to maximize the available number of exposed leads in the semiconductor package. More particularly, the semiconductor package of the present invention includes a generally planar die pad or die paddle defining multiple peripheral edge segments. In addition, the semiconductor package includes a plurality of leads. Some of these leads include exposed bottom surface portions which are provided in at least two concentric rows or rings which at least partially circumvent the die pad, with other leads including portions which protrude from respective side surfaces of a package body of the semiconductor package. Connected to the top surface of the die pad is at least one semiconductor die which is electrically connected to at least some of the leads.

Abstract: In accordance with the present invention, there is provided a semiconductor package (e.g., a QFP package) including a uniquely configured leadframe sized and configured to maximize the available number of exposed leads in the semiconductor package. More particularly, the semiconductor package of the present invention includes a generally planar die pad or die paddle defining multiple peripheral edge segments. In addition, the semiconductor package includes a plurality of leads. Some of these leads include exposed bottom surface portions which are provided in at least one row or ring which at least partially circumvents the die pad, with other leads including portions which protrude from respective side surfaces of a package body of the semiconductor package. Connected to the top surface of the die pad is at least one semiconductor die which is electrically connected to at least some of the leads.

Abstract: In accordance with the present invention, there is provided a semiconductor package (e.g., a QFP package) including a uniquely configured leadframe sized and configured to maximize the available number of exposed leads in the semiconductor package. More particularly, the semiconductor package includes a generally planar die pad or die paddle defining multiple peripheral edge segments. In addition, the semiconductor package includes a plurality of leads. Some of these leads include bottom surface portions which, in the completed semiconductor package, are exposed and at least partially circumvent the die pad, with other leads including portions which protrude from respective side surfaces of a package body in the completed semiconductor package. The semiconductor package also includes one or more power bars and/or one or more ground rings which are integral portions of the original leadframe used to fabricate the same.

Abstract: A bonded abrasive article includes, on a total weight basis: 30 to 37 percent of ceramic-coated blue fused aluminum oxide particles; 30 to 37 percent of non-seeded sol-gel alumina-based abrasive particles, wherein the non-seeded sol-gel alumina-based abrasive particles are composed of crystallites of alpha alumina, magnesium alumina spinel, and rare earth hexagonal aluminate; a phenolic binder that comprises a reaction product of 8 to 12 percent by weight of curable novolac phenolic resin and 2.1 to 5.1 percent by weight of curable resole phenolic resin; 3 to 6 percent by weight of metal fibers having a length of 5 millimeters or less; 8 to 11 percent by weight of cryolite; and 0.1 to 0.3 percent by weight of electrically conductive particles. Methods of making and using the bonded abrasive article are also disclosed.

Abstract: The present invention relates to a method of more precisely and easily realizing cooling channels constituting a ceramic brake disk rotor. In order to achieve an object of the invention, there is provided a method of manufacturing a ceramic brake disk rotor having internal cooling channels, comprising the steps of: (a) producing loading portions 110, 210, frictional surfaces 120, 220, and vanes 300 of the disk rotor respectively through separate processes using a carbon fiber reinforced carbon-carbon composite; (b) fabricating the loading portions 110, 210, frictional surfaces 120, 220, and vanes 300 respectively produced through separate processes into one structure and (c) performing a liquid silicon-melt infiltration process for the fabricated one structure.

Abstract: In accordance with the present invention, there is provided a semiconductor package (e.g., a QFP package) including a uniquely configured leadframe sized and configured to maximize the available number of exposed leads in the semiconductor package. More particularly, the semiconductor package of the present invention includes a generally planar die pad or die paddle defining multiple peripheral edge segments. In addition, the semiconductor package includes a plurality of leads. Some of these leads include exposed bottom surface portions which are provided in at least two concentric rows or rings which at least partially circumvent the die pad, with other leads including portions which protrude from respective side surfaces of a package body of the semiconductor package. Connected to the top surface of the die pad is at least one semiconductor die which is electrically connected to at least some of the leads.

Abstract: A semiconductor package which includes a generally planar die paddle defining multiple peripheral edge segments and a plurality of leads which are segregated into at least two concentric rows. Connected to the top surface of the die paddle is at least one semiconductor die which is electrically connected to at least some of the leads of each row. At least portions of the die paddle, the leads, and the semiconductor die are encapsulated by a package body, the bottom surfaces of the die paddle and the leads of at least one row thereof being exposed in a common exterior surface of the package body.

Abstract: In accordance with the present invention, there is provided a semiconductor package (e.g., a QFP package) including a uniquely configured leadframe sized and configured to maximize the available number of exposed leads in the semiconductor package. More particularly, the semiconductor package includes a generally planar die pad or die paddle defining multiple peripheral edge segments. In addition, the semiconductor package includes a plurality of leads. Some of these leads include bottom surface portions which, in the completed semiconductor package, are exposed and at least partially circumvent the die pad, with other leads including portions which protrude from respective side surfaces of a package body in the completed semiconductor package. The semiconductor package also includes one or more power bars and/or one or more ground rings which are integral portions of the original leadframe used to fabricate the same.

Abstract: In accordance with the present invention, there is provided a semiconductor package (e.g., a QFP package) including a uniquely configured leadframe sized and configured to maximize the available number of exposed leads in the semiconductor package. More particularly, the semiconductor package of the present invention includes a generally planar die pad or die paddle defining multiple peripheral edge segments. In addition, the semiconductor package includes a plurality of leads. Some of these leads include exposed bottom surface portions which are provided in at least one row or ring which at least partially circumvents the die pad, with other leads including portions which protrude from respective side surfaces of a package body of the semiconductor package. Connected to the top surface of the die pad is at least one semiconductor die which is electrically connected to at least some of the leads.

Abstract: A liquid crystal display (LCD) device includes a gate driver for supplying gate signals and a timing controller for generating a gate control signal to the gate driver. The LCD device further includes an automatic reset circuit which detects abnormal condition of the gate control signal and generates a reset signal.

Abstract: Disclosed is a mounting unit including a bushing having a main part having a penetration hole extending in a lengthwise direction thereof and a flange portion expanding from an upper end of the main part, a stripper bolt having a head portion, a body portion having an insert portion to be inserted into or received in the penetration hole, and a male screw-threaded portion at a leading end of the insert portion Also disclosed is a brake unit assembled using the mounting unit that has good thermal and mechanical stability at a coupling portion between a disk rotor and a rotor hat.

Abstract: A liquid crystal display device and a method for driving the same are disclosed. The device includes a gamma voltage generation circuit for generating first to ith positive gamma reference voltages having different levels, and first to ith negative gamma reference voltages having different levels, and a plurality of data drive chips, each of the data drive chips converting digital data input thereto into a positive data voltage and a negative data voltage and supplying the positive data voltage and negative data voltage to a liquid crystal display panel, and adjusting a level of the positive data voltage based on a positive gamma reference voltage supplied thereto, among the first to ith positive gamma reference voltages, and adjusting a level of the negative data voltage based on a negative gamma reference voltage supplied thereto, among the first to ith negative gamma reference voltages.

Abstract: A liquid crystal display (LCD) device includes a gate driver for supplying gate signals and a timing controller for generating a gate control signal to the gate driver. The LCD device further includes an automatic reset circuit which detects abnormal condition of the gate control signal and generates a reset signal.