Patents by Inventor Yeon Hwan Bae

Yeon Hwan Bae has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10443191
    Abstract: The present invention relates to a rope for an elevator. The rope for the elevator comprises: a center strand formed by twisting a plurality of wires; inner layer strands formed by twisting the plurality of wires and arranged along the outer periphery of the center strand; and outer layer strands formed by twisting the plurality of wires and arranged along the outer periphery of the inner layer strands, wherein ten of each of the inner layer strands and the outer layer strands are prepared, the diameter of the center strand, the diameter of the inner layer strand and the diameter of the outer layer strand are respectively 0.33-0.35 times, 0.13-0.15 times and 0.22-0.24 times as large as the diameter of a first imaginary circle circumscribed around the outer layer strands, and a fill factor is 64-67%.
    Type: Grant
    Filed: June 18, 2015
    Date of Patent: October 15, 2019
    Assignee: Kiswire Ltd.
    Inventors: Sung Hee Hong, Yeon Hwan Bae
  • Publication number: 20170129742
    Abstract: The present invention relates to a rope for an elevator. The rope for the elevator comprises: a center strand formed by twisting a plurality of wires; inner layer strands formed by twisting the plurality of wires and arranged along the outer periphery of the center strand; and outer layer strands formed by twisting the plurality of wires and arranged along the outer periphery of the inner layer strands, wherein ten of each of the inner layer strands and the outer layer strands are prepared, the diameter of the center strand, the diameter of the inner layer strand and the diameter of the outer layer strand are respectively 0.33-0.35 times, 0.13-0.15 times and 0.22-0.24 times as large as the diameter of a first imaginary circle circumscribed around the outer layer strands, and a fill factor is 64-67%.
    Type: Application
    Filed: June 18, 2015
    Publication date: May 11, 2017
    Applicant: Kiswire Ltd.
    Inventors: Sung Hee Hong, Yeon Hwan Bae