Abstract: Provided is an apparatus and method for a testing multi-stack integrated circuit package. The apparatus may include a vacuum pump and a socket. The socket may include a plurality of internal pins, a plurality of external pins, a socket body, and at least one first air inlet. The plurality of external pins may be electrically connected to the plurality of internal pins. The at least one first air inlet may communicate with the atmosphere between the plurality of internal pins. When the multi-stack integrated circuit package including a plurality of packages is tested, a plurality of package pins of the multi-stack integrated circuit package may be inserted (or placed) into the plurality of internal pins of the socket. The multi-stack integrated circuit package may be pulled (or positioned) by applying a vacuum through the first air inlet of the socket using the vacuum pump.

Abstract: A semiconductor device includes an integrated circuit and a pad coupled to the integrated circuit. The pad has a probing area and a bonding area, and a material of the pad has multiple heights from the probing area to the bonding area. Such heights allow for easy recognition for probing at the probing area, and any damage at the probing area does not degrade quality of wire bonding in the bonding area.

Abstract: Disclosed is an overload protector with a hermetically sealed structure, the overload protector comprising a housing that has an outer peripheral flange and an external connecting terminal and that accommodates a bimetal element having a movable contact and a fixed contact; a conducting plate that is installed to an upper portion of the housing and that has an external connecting terminal and a contact connected to the movable contact of the bimetal element; and an insulating gasket disposed between the housing and the conducting plate, grooves or ribs being formed on the entire flange, and ribs or grooves being formed on a portion of the conducting plate corresponding to the grooves or ribs formed on the flange in such a way that the ribs or grooves of the conducting plate are engaged with the groves or ribs of the flange.

Abstract: Disclosed is an overload protector with a hermetically sealed structure, the overload protector comprising a housing that has an outer peripheral flange and an external connecting terminal and that accommodates a bimetal element having a movable contact and a fixed contact; a conducting plate that is installed to an upper portion of the housing and that has an external connecting terminal and a contact connected to the movable contact of the bimetal element; and an insulating gasket disposed between the housing and the conducting plate, grooves or ribs being formed on the entire flange, and ribs or grooves being formed on a portion of the conducting plate corresponding to the grooves or ribs formed on the flange in such a way that the ribs or grooves of the conducting plate are engaged with the groves or ribs of the flange.