Patents by Inventor Yeon Kheng Lim

Yeon Kheng Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Structure and method of liner air gap formation
    Patent number: 7094669
    Abstract: A structure and method of a semiconductor device with liner air gaps next to interconnects and dielectric layers. A dielectric layer is formed over a lower dielectric layer and a lower interconnect over a substrate. We form an interconnect opening in the dielectric layer. The opening has sidewalls of the dielectric layer. A sacrificial liner is formed over the sidewalls of the interconnect opening. An upper interconnect is formed that fills the opening. We remove the sacrificial liner/spacers to form (air) liner gaps.
    Type: Grant
    Filed: August 3, 2004
    Date of Patent: August 22, 2006
    Assignee: Chartered Semiconductor Manufacturing LTD
    Inventors: Xiaomei Bu, Alex See, Tae Jong Lee, Fan Zhang, Yeon Kheng Lim, Liang Choo Hsia