Patents by Inventor Yeon Kyoung Jung

Yeon Kyoung Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11445645
    Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.
    Type: Grant
    Filed: January 30, 2019
    Date of Patent: September 13, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Keon Kuk, Il-ju Mun, Ji-woon Yeom, Yeon-kyoung Jung, Kyong-il Kim
  • Patent number: 10913201
    Abstract: An object forming apparatus and a controlling method thereof are provided. The object forming apparatus includes an injector configured to inject an object forming material based on object data, a base part in which an object is formed through stacking of the injected object forming material, a sensor configured to detect a height of the object stacked on the base part, and a controller configured to control the injector based on a signal output from the sensor.
    Type: Grant
    Filed: August 5, 2016
    Date of Patent: February 9, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Keon Kuk, Eun-bong Han, Young-dae Ko, Hyeon-hyang Kim, O-hyun Beak, Jun-hee Lee, Yeon-kyoung Jung
  • Patent number: 10710297
    Abstract: A three-dimensional printer and an operating method are provided. The three-dimensional printer includes at least one print head and a stage in which chemical ink injected from the print head may be layered. The three-dimensional printer includes a print head including a head chip injecting the chemical ink, wherein the head chip may include an ink chamber receiving the chemical ink, a heater generating a bubble in the ink chamber by applying heat to the chemical ink of the ink chamber, and a nozzle injecting the chemical ink according to an internal pressure of the ink chamber increased by the generated bubble.
    Type: Grant
    Filed: December 24, 2014
    Date of Patent: July 14, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ohyun Beak, Keon Kuk, Yeon Kyoung Jung, Eun Bong Han
  • Patent number: 10566293
    Abstract: A circuit element package, a manufacturing method thereof, and a manufacturing apparatus thereof are provided. The circuit element package includes a circuit element disposed on a printed circuit board, an insulating layer covering the circuit element, a first shielding layer covering a side surface of the insulating layer, and a second shielding layer covering an upper surface of the insulating layer and electrically connected to the first shielding layer.
    Type: Grant
    Filed: March 4, 2016
    Date of Patent: February 18, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Keon Kuk, Young-dae Ko, O-hyun Beak, Eun-bong Han, Hyeon-hyang Kim, Yeon-kyoung Jung, Il-ju Mun
  • Patent number: 10477737
    Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.
    Type: Grant
    Filed: December 21, 2016
    Date of Patent: November 12, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Keon Kuk, Il-ju Mun, Ji-woon Yeom, Yeon-kyoung Jung, Kyong-il Kim
  • Patent number: 10426067
    Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.
    Type: Grant
    Filed: December 21, 2016
    Date of Patent: September 24, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Keon Kuk, Il-ju Mun, Ji-woon Yeom, Yeon-kyoung Jung, Kyong-il Kim
  • Patent number: 10356965
    Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.
    Type: Grant
    Filed: December 21, 2016
    Date of Patent: July 16, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Keon Kuk, Il-ju Mun, Ji-woon Yeom, Yeon-kyoung Jung, Kyong-il Kim
  • Publication number: 20190166731
    Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.
    Type: Application
    Filed: January 30, 2019
    Publication date: May 30, 2019
    Inventors: Keon KUK, Il-ju MUN, Ji-woon YEOM, Yeon-kyoung JUNG, Kyong-il KIM
  • Patent number: 10292318
    Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.
    Type: Grant
    Filed: December 21, 2016
    Date of Patent: May 14, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Keon Kuk, Il-ju Mun, Ji-woon Yeom, Yeon-kyoung Jung, Kyong-il Kim
  • Patent number: 10231368
    Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.
    Type: Grant
    Filed: December 21, 2016
    Date of Patent: March 12, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Keon Kuk, Il-ju Mun, Ji-woon Yeom, Yeon-kyoung Jung, Kyong-il Kim
  • Publication number: 20170349770
    Abstract: The present invention relates to an ink composition for 3D printing, a 3D printer and a method of controlling the 3D printer. An ink composition for 3D printing according to an aspect of the present invention may include surface-modified inorganic particles, a photocurable material crosslinked with the surface-modified inorganic particles and a photoinitiator which cures the photocurable material.
    Type: Application
    Filed: December 24, 2015
    Publication date: December 7, 2017
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yeon Kyoung JUNG, Keon KUK, Oh Hyun BEAK
  • Publication number: 20170325365
    Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.
    Type: Application
    Filed: December 21, 2016
    Publication date: November 9, 2017
    Inventors: Keon KUK, Il-ju MUN, Ji-woon YEOM, Yeon-kyoung JUNG, Kyong-il KIM
  • Publication number: 20170057161
    Abstract: An object forming apparatus and a controlling method thereof are provided. The object forming apparatus includes an injector configured to inject an object forming material based on object data, a base part in which an object is formed through stacking of the injected object forming material, a sensor configured to detect a height of the object stacked on the base part, and a controller configured to control the injector based on a signal output from the sensor.
    Type: Application
    Filed: August 5, 2016
    Publication date: March 2, 2017
    Inventors: Keon KUK, Eun-bong HAN, Young-dae KO, Hyeon-hyang KIM, O-hyun BEAK, Jun-hee LEE, Yeon-kyoung JUNG
  • Publication number: 20160262292
    Abstract: A circuit element package, a manufacturing method thereof, and a manufacturing apparatus thereof are provided. The circuit element package includes a circuit element disposed on a printed circuit board, an insulating layer covering the circuit element, a first shielding layer covering a side surface of the insulating layer, and a second shielding layer covering an upper surface of the insulating layer and electrically connected to the first shielding layer.
    Type: Application
    Filed: March 4, 2016
    Publication date: September 8, 2016
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Keon KUK, Young-dae KO, O-hyun BEAK, Eun-bong HAN, Hyeon-hyang KIM, Yeon-kyoung JUNG, Il-ju MUN
  • Patent number: 9434838
    Abstract: A multi-color ink for 3D printing, a 3D printer, and a method of controlling the 3D printer are provided. The multi-color ink for 3D printing including a first ink composition that includes a photocurable material, a photoinitiator configured to cure the photocurable material, a first colorant, and an anti-intercolor bleed agent configured to prevent intercolor bleeding occurring when the plurality of ink compositions come into contact with each other, and a second ink composition that includes a photocurable material, a photoinitiator configured to cure the photocurable material, and a second colorant having an acid moiety involved in a reaction with the anti-intercolor bleed agent to cause aggregation. The multi-color ink for 3D printing may enable a clear image by inhibiting intercolor bleeding that occurs when ink compositions with different colors are printed to be adjacent to each other before curing during 3D printing.
    Type: Grant
    Filed: September 30, 2014
    Date of Patent: September 6, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yeon Kyoung Jung, O Hyun Beak, Keon Kuk, Eun Bong Han, Yong Hyun Lim, Jong Youb Ryu
  • Patent number: 9217073
    Abstract: A polyester resin composition having improved transparency, flame retardancy and hardness, and a method for preparation thereof are provided. The composition includes organo-modified nanoclay and a phosphorous-based flame retardant added to a polyester resin. The nanoclay is homogeneously dispersed in the polyester by melt compounding.
    Type: Grant
    Filed: December 15, 2011
    Date of Patent: December 22, 2015
    Assignees: SAMSUNG ELECTRONICS CO., LTD., SHINIL CHEMICAL INDUSTRY CO., LTD.
    Inventors: Ji Young Lee, In Kim, Yeon Kyoung Jung, Manwar Hussain, Pil Joong Yoon, Keum Suk Seo
  • Publication number: 20150183163
    Abstract: A three-dimensional printer and an operating method are provided. The three-dimensional printer includes at least one print head and a stage in which chemical ink injected from the print head may be layered. The three-dimensional printer includes a print head including a head chip injecting the chemical ink, wherein the head chip may include an ink chamber receiving the chemical ink, a heater generating a bubble in the ink chamber by applying heat to the chemical ink of the ink chamber, and a nozzle injecting the chemical ink according to an internal pressure of the ink chamber increased by the generated bubble.
    Type: Application
    Filed: December 24, 2014
    Publication date: July 2, 2015
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Ohyun BEAK, Keon Kuk, Yeon Kyoung Jung, Eun Bong Han
  • Publication number: 20150183162
    Abstract: A three dimensional (3D) printer sprays and solidifies liquid ink to build a 3D object prevents implementation of unintended color due to a mix of different color ink, and increases 3D printing speed by enhancing the process of spraying and solidifying the ink. The control method of the 3D printer for building a 3D object by laminating a plurality of layers includes forming first areas not adjacent to each other in one of the plurality of layers and solidifying the first areas; and forming second areas adjacent to the solidified first areas and solidifying the second areas.
    Type: Application
    Filed: July 22, 2014
    Publication date: July 2, 2015
    Applicant: SAMSUNG ELECTRONICS CO.,LTD.
    Inventors: Keon KUK, O Hyun BEAK, Jong Woon PARK, Yeon Kyoung JUNG, Eun Bong HAN
  • Publication number: 20150140347
    Abstract: A film formation composition for surface treatment of a metal object includes at least one salt selected from a hydrofluoric acid salt, a phosphate, and a nitrate, and at least one hydrogen antifoaming agent selected from a hydrogen foaming inhibitor, a hydrogen bubble adhesion inhibitor, and a base for pH adjustment, a film formed using the film formation composition, and an electronic product including the film formed using the film formation composition.
    Type: Application
    Filed: August 11, 2014
    Publication date: May 21, 2015
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jun Cheol BAE, Chul BAlK, Pil Gu KWON, Moon Su SEO, Yeon Kyoung JUNG, Cheol HAM
  • Publication number: 20150094394
    Abstract: A multi-color ink for 3D printing, a 3D printer, and a method of controlling the 3D printer are provided. The multi-color ink for 3D printing including a first ink composition that includes a photocurable material, a photoinitiator configured to cure the photocurable material, a first colorant, and an anti-intercolor bleed agent configured to prevent intercolor bleeding occurring when the plurality of ink compositions come into contact with each other, and a second ink composition that includes a photocurable material, a photoinitiator configured to cure the photocurable material, and a second colorant having an acid moiety involved in a reaction with the anti-intercolor bleed agent to cause aggregation. The multi-color ink for 3D printing may enable a clear image by inhibiting intercolor bleeding that occurs when ink compositions with different colors are printed to be adjacent to each other before curing during 3D printing.
    Type: Application
    Filed: September 30, 2014
    Publication date: April 2, 2015
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Yeon Kyoung JUNG, O Hyun Beak, Keon KUK, Eun Bong HAN, Yong Hyun LIM, Jong Youb RYU