Patents by Inventor Yeon Lim

Yeon Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060271396
    Abstract: A method of certificating a message, terminal thereof and system thereof are disclosed. By the present invention, in transmitting various messages via a prescribed communication service, a validity of the message is certificated. By the present invention, without checking contents of a message, a recipient can confirm whether a received message is sent from a valid originator or whether the received message is a valid message.
    Type: Application
    Filed: May 30, 2006
    Publication date: November 30, 2006
    Inventors: Seung Lee, Yeon Lim
  • Publication number: 20060030128
    Abstract: A structure and method of a semiconductor device with liner air gaps next to interconnects and dielectric layers. A dielectric layer is formed over a lower dielectric layer and a lower interconnect over a substrate. We form an interconnect opening in the dielectric layer. The opening has sidewalls of the dielectric layer. A sacrificial liner is formed over the sidewalls of the interconnect opening. An upper interconnect is formed that fills the opening. We remove the sacrificial liner/spacers to form (air) liner gaps.
    Type: Application
    Filed: August 3, 2004
    Publication date: February 9, 2006
    Inventors: Xiaomei Bu, Alex See, Tae Lee, Fan Zhang, Yeon Lim, Liang Hsia