Abstract: A wafer manufacturing method, an epitaxial wafer manufacturing method, and a wafer and epitaxial wafer manufactured thereby, are provided. The wafer manufacturing method enables the manufacture of a wafer with a low density of micropipe defects and minimum numbers of particles and scratches. The epitaxial wafer manufacturing method enables the manufacture of an epitaxial wafer that has low densities of defects such as downfall, triangular, and carrot defects, exhibits excellent device characteristics, and improves the yield of devices.

Abstract: A display device may include a first electrode, a second electrode, an emission layer, an intervening layer, and a first encapsulation layer. The second electrode may overlap the first electrode. The emission layer may be disposed between the first electrode and the second electrode, may overlap the first electrode, and may include a light emitting material. The intervening layer may directly contact the second electrode, may be spaced from each of the first electrode and the emission layer, and may include a fluorine compound. A first section of the first encapsulation layer may overlap the emission layer. The intervening layer may be positioned between the second electrode and a second section of the first encapsulation layer.

Abstract: A wafer manufacturing method, an epitaxial wafer manufacturing method, and a wafer and epitaxial wafer manufactured thereby, are provided. The wafer manufacturing method enables the manufacture of a wafer with a low density of micropipe defects and minimum numbers of particles and scratches. The epitaxial wafer manufacturing method enables the manufacture of an epitaxial wafer that has low densities of defects such as downfall, triangular, and carrot defects, exhibits excellent device characteristics, and improves the yield of devices.

Abstract: A sensor tube according to the present invention comprises: a tubular body for connecting two connection pipes to each other, wherein the two connection pipes are connected to a humidity sensor, so that the connection pipes transfer steam to the humidity sensor by using circulating air or air discharged from the humidity sensor flow in the connection pipes; and a cover surrounding at least a part of the outer surface of the body to prevent foreign substances having a predetermined size or larger from passing, wherein the body is formed as a porous sintered body which allows stream to be introduced from the outside of the body into the body and be transferred by the circulating air.

Abstract: A sensor tube according to the present disclosure includes a body including a body extension having opposite ends connected to measurement air connection pipes and an opening, the measurement air connecting pipes being connected to a humidity sensor to deliver moisture to the humidity sensor using measurement air or allow the measurement air released from the humidity sensor to flow therethrough, and the opening being formed in the body extension to cause an interior space of the body extension and the outside to be in communication with each other such that the moisture is introduced into the interior space of the body extension from the outside through the opening, and an opening/closing part that selectively opens or closes the opening by being operated by a difference in pressure between the interior space of the body extension and the outside.

Abstract: A method and device for removing decay heat from a liquid metal reactor using a thermosyphon so as to cool the reactor is disclosed. The method and device of this invention uses a thermosyphon heating part in place of a conventional air separator, thus improving its decay heat removal capacity. In the method of this invention, decay heat from the reactor is absorbed at the flowing air and additionally at the evaporator section of the thermosyphon. The absorbed heat at the evaporator section is, thereafter, dissipated to the atmosphere from the condenser section of the thermosyphon. In the liquid metal reactor installed at a position between a containment and a reactor support concrete wall, the thermosyphon is installed at a position between the concrete wall and the containment vessel.