Patents by Inventor Yeon Song KANG

Yeon Song KANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11901130
    Abstract: A multilayer electronic component, in which the external electrode may be thinned to secure capacitance per unit volume, while securing the external electrode at a corner in a specific thickness or higher with improved reliability for moisture resistance.
    Type: Grant
    Filed: January 17, 2023
    Date of Patent: February 13, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Soo Park, Myung Jun Park, Hyun Hee Gu, Bum Soo Kim, Yeon Song Kang, Duk Hyun Chun, Chung Eun Lee
  • Publication number: 20230154684
    Abstract: A multilayer electronic component, in which the external electrode may be thinned to secure capacitance per unit volume, while securing the external electrode at a corner in a specific thickness or higher with improved reliability for moisture resistance.
    Type: Application
    Filed: January 17, 2023
    Publication date: May 18, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Soo PARK, Myung Jun PARK, Hyun Hee GU, Bum Soo KIM, Yeon Song KANG, Duk Hyun CHUN, Chung Eun LEE
  • Patent number: 11587735
    Abstract: A multilayer electronic component, in which the external electrode may be thinned to secure capacitance per unit volume, while securing the external electrode at a corner in a specific thickness or higher with improved reliability for moisture resistance.
    Type: Grant
    Filed: May 13, 2020
    Date of Patent: February 21, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Soo Park, Myung Jun Park, Hyun Hee Gu, Bum Soo Kim, Yeon Song Kang, Duk Hyun Chun, Chung Eun Lee
  • Publication number: 20220392707
    Abstract: A multilayer capacitor includes a capacitor body including an active region having a dielectric layer, and first and second internal electrodes, and an upper cover region and a lower cover region respectively disposed above and below the active region, and including first to sixth surfaces; and first and second external electrodes disposed on both end portions of the capacitor body in the second direction, respectively, and connected to the first and second internal electrodes, respectively. The first and second external electrodes include first and second conductive layers disposed on the third and fourth surfaces, respectively; first and second conductive resin layers disposed on the first and second conductive layers, respectively; and first and second plating layers disposed on the first and second conductive resin layers, respectively, and contacting the first and second conductive layers in the upper or lower cover region, respectively.
    Type: Application
    Filed: April 29, 2022
    Publication date: December 8, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kangha LEE, Yoona PARK, Jinsoo PARK, Eun-Jin KIM, Yeon Song KANG, Myung Jun PARK
  • Patent number: 11476051
    Abstract: A multilayer ceramic electronic component includes a ceramic body having a capacitance forming portion including dielectric layers and first and second internal electrodes laminated with respective dielectric layers interposed therebetween, a first external electrode connected to the first internal electrode and including a first conductive layer and a first band portion, and a second external electrode connected to the second internal electrode and including a second conductive layer and a second band portion. Tb/Tc is 0.85 or more, where Tc is a maximum thickness of each of the first and second conductive layers and Tb is a maximum thickness of each of the first and second band portions.
    Type: Grant
    Filed: April 16, 2020
    Date of Patent: October 18, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Bum Soo Kim, Jin Soo Park, Duk Hyun Chun, Myung Jun Park, Yeon Song Kang, Jong Ho Lee, Hyun Hee Gu
  • Publication number: 20220208462
    Abstract: A multilayer electronic component, includes: a body including a dielectric layer, and first and second internal electrodes alternately disposed in a first direction with the dielectric layer interposed therebetween; a first connection portion including a first conductive layer disposed on the third surface and connected to the first internal electrode, and a first insulating layer disposed on the first conductive layer; a second connection portion including a second conductive layer disposed on the fourth surface and connected to the second internal electrode, and a second insulating layer disposed on the second conductive layer; a first external electrode including a first electrode layer connected to the first conductive layer, wherein the first external electrode is disposed on any one of the first, second, fifth, and sixth surfaces; and a second external electrode including a second electrode layer connected to the second conductive layer.
    Type: Application
    Filed: November 10, 2021
    Publication date: June 30, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jun Hyeong KIM, Myung Jun PARK, Jin Soo PARK, Yeon Song KANG, Eun Jin KIM, Kyu Sik PARK, Kang Ha LEE
  • Publication number: 20210265114
    Abstract: A multilayer electronic component, in which the external electrode may be thinned to secure capacitance per unit volume, while securing the external electrode at a corner in a specific thickness or higher with improved reliability for moisture resistance.
    Type: Application
    Filed: May 13, 2020
    Publication date: August 26, 2021
    Inventors: Jin Soo PARK, Myung Jun PARK, Hyun Hee GU, Bum Soo KIM, Yeon Song KANG, Duk Hyun CHUN, Chung Eun LEE
  • Publication number: 20210217560
    Abstract: A multilayer ceramic electronic component includes a ceramic body having a capacitance forming portion including dielectric layers and first and second internal electrodes laminated with respective dielectric layers interposed therebetween, a first external electrode connected to the first internal electrode and including a first conductive layer and a first band portion, and a second external electrode connected to the second internal electrode and including a second conductive layer and a second band portion. Tb/Tc is 0.85 or more, where Tc is a maximum thickness of each of the first and second conductive layers and Tb is a maximum thickness of each of the first and second band portions.
    Type: Application
    Filed: April 16, 2020
    Publication date: July 15, 2021
    Inventors: Bum Soo KIM, Jin Soo PARK, Duk Hyun CHUN, Myung Jun PARK, Yeon Song KANG, Jong Ho LEE, Hyun Hee GU