Patents by Inventor Yeon Soo JUNG
Yeon Soo JUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240145346Abstract: A semiconductor device includes a substrate with a conductive pattern. A semiconductor die is electrically connected to the substrate and both the semiconductor die and the substrate are at least partially covered by a package body. In some examples, through-mold vias are formed in the package body to provide electrical signal paths from an exterior surface thereof to the conductive pattern of the substrate. In some examples, through-mold vias are included in the package body to provide electrical signal paths between the semiconductor die and an exterior surface of the package body. In some examples, an interposer is electrically connected to the through-mold vias and may be covered by the package body and/or disposed in spaced relation thereto. In some examples, the interposer may not be electrically connected to the through-mold vias but may have one or more semiconductor dies of the semiconductor device electrically connected thereto.Type: ApplicationFiled: January 8, 2024Publication date: May 2, 2024Applicant: Amkor Technology Singapore Holding Pte. LtdInventors: Dong Joo PARK, Jin Seong KIM, Ki Wook LEE, Dae Byoung KANG, Ho CHOI, Kwang Ho KIM, Jae Dong KIM, Yeon Soo JUNG, Sung Hwan CHO
-
Publication number: 20240125996Abstract: A method for replicating a holographic optical element and a holographic optical element replicated thereby are provided. The holographic optical element is larger than a master. The master has a holographic grating pattern generated on the master by interference of the reflected, diffracted or transmitted beam generated by irradiating the master having a specific diffraction grating pattern formed thereon with a laser beam.Type: ApplicationFiled: August 25, 2021Publication date: April 18, 2024Applicant: LG Chem, Ltd.Inventors: Bo Ra Jung, Joon Young Lee, Min Soo Song, Do Kyeong Kwon, Yeon Jae Yoo
-
Publication number: 20240126074Abstract: The present disclosure provides a waveguide display apparatus. The waveguide waveguide display apparatus of the present disclosure is a waveguide display apparatus for correcting curved surface reflection distortion, the waveguide display apparatus including a waveguide for guiding light inputted from the outside; a first diffractive optical element disposed at the waveguide, and diffracting the light inputted from the outside to the inside of the waveguide; and a second diffractive optical element disposed at the waveguide, and diffracting the light guided by the waveguide to output a plurality of diffracted lights in a direction of a curved surface reflector located outside, wherein the second diffractive optical element has a structure of a diffraction grating corresponding to a curvature of the curved surface reflector such that the diffracted lights are reflected at different locations of the curved surface reflector in directions parallel to each other.Type: ApplicationFiled: September 30, 2022Publication date: April 18, 2024Applicant: LG Chem, Ltd.Inventors: Jae Jin Kim, Bo Ra Jung, Hye Won Hwang, Yeon Jae Yoo, Joon Young Lee, Bu Gon Shin, Min Soo Song
-
Patent number: 11869829Abstract: In accordance with the present description, there is provided multiple embodiments of a semiconductor device. In each embodiment, the semiconductor device comprises a substrate having a conductive pattern formed thereon. In addition to the substrate, each embodiment of the semiconductor device includes at least one semiconductor die which is electrically connected to the substrate, both the semiconductor die and the substrate being at least partially covered by a package body of the semiconductor device. In certain embodiments of the semiconductor device, through-mold vias are formed in the package body to provide electrical signal paths from an exterior surface thereof to the conductive pattern of the substrate. In other embodiments, through mold vias are also included in the package body to provide electrical signal paths between the semiconductor die and an exterior surface of the package body.Type: GrantFiled: July 10, 2020Date of Patent: January 9, 2024Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Dong Joo Park, Jin Seong Kim, Ki Wook Lee, Dae Byoung Kang, Ho Choi, Kwang Ho Kim, Jae Dong Kim, Yeon Soo Jung, Sung Hwan Cho
-
Publication number: 20200343163Abstract: In accordance with the present description, there is provided multiple embodiments of a semiconductor device. In each embodiment, the semiconductor device comprises a substrate having a conductive pattern formed thereon. In addition to the substrate, each embodiment of the semiconductor device includes at least one semiconductor die which is electrically connected to the substrate, both the semiconductor die and the substrate being at least partially covered by a package body of the semiconductor device. In certain embodiments of the semiconductor device, through-mold vias are formed in the package body to provide electrical signal paths from an exterior surface thereof to the conductive pattern of the substrate. In other embodiments, through mold vias are also included in the package body to provide electrical signal paths between the semiconductor die and an exterior surface of the package body.Type: ApplicationFiled: July 10, 2020Publication date: October 29, 2020Applicant: Amkor Technology Singapore Holding Pte. LtdInventors: Dong Joo PARK, Jin Seong KIM, Ki Wook LEE, Dae Byoung KANG, Ho CHOI, Kwang Ho KIM, Jae Dong KIM, Yeon Soo JUNG, Sung Hwan CHO
-
Patent number: 10811341Abstract: In accordance with the present description, there is provided multiple embodiments of a semiconductor device. In each embodiment, the semiconductor device comprises a substrate having a conductive pattern formed thereon. In addition to the substrate, each embodiment of the semiconductor device includes at least one semiconductor die which is electrically connected to the substrate, both the semiconductor die and the substrate being at least partially covered by a package body of the semiconductor device. In certain embodiments of the semiconductor device, through-mold vias are formed in the package body to provide electrical signal paths from an exterior surface thereof to the conductive pattern of the substrate. In other embodiments, through mold vias are also included in the package body to provide electrical signal paths between the semiconductor die and an exterior surface of the package body.Type: GrantFiled: July 2, 2018Date of Patent: October 20, 2020Assignee: Amkor Technology Singapore Holding Pte Ltd.Inventors: Dong Joo Park, Jin Seong Kim, Ki Wook Lee, Dae Byoung Kang, Ho Choi, Kwang Ho Kim, Jae Dong Kim, Yeon Soo Jung, Sung Hwan Cho
-
Publication number: 20180308788Abstract: In accordance with the present description, there is provided multiple embodiments of a semiconductor device. In each embodiment, the semiconductor device comprises a substrate having a conductive pattern formed thereon. In addition to the substrate, each embodiment of the semiconductor device includes at least one semiconductor die which is electrically connected to the substrate, both the semiconductor die and the substrate being at least partially covered by a package body of the semiconductor device. In certain embodiments of the semiconductor device, through-mold vias are formed in the package body to provide electrical signal paths from an exterior surface thereof to the conductive pattern of the substrate. In other embodiments, through mold vias are also included in the package body to provide electrical signal paths between the semiconductor die and an exterior surface of the package body.Type: ApplicationFiled: July 2, 2018Publication date: October 25, 2018Applicant: AMKOR TECHNOLOGY, INC.Inventors: Dong Joo PARK, Jin Seong KIM, Ki Wook LEE, Dae Byoung KANG, Ho CHOI, Kwang Ho KIM, Jae Dong KIM, Yeon Soo JUNG, Sung Hwan CHO
-
Publication number: 20170117214Abstract: In accordance with the present invention, there is provided multiple embodiments of a semiconductor device. In each embodiment, the semiconductor device comprises a substrate having a conductive pattern formed thereon. In addition to the substrate, each embodiment of the semiconductor device includes at least one semiconductor die which is electrically connected to the substrate, both the semiconductor die and the substrate being at least partially covered by a package body of the semiconductor device. In certain embodiments of the semiconductor device, through-mold vias are formed in the package body to provide electrical signal paths from an exterior surface thereof to the conductive pattern of the substrate. In other embodiments, through mold vias are also included in the package body to provide electrical signal paths between the semiconductor die and an exterior surface of the package body.Type: ApplicationFiled: December 26, 2016Publication date: April 27, 2017Applicant: AMKOR TECHNOLOGY, INC.Inventors: Dong Joo PARK, Jin Seong KIM, Ki Wook LEE, Dae Byoung KANG, Ho CHOI, Kwang Ho KIM, Jae Dong KIM, Yeon Soo JUNG, Sung Hwan CHO