Patents by Inventor Yeon-Wook KIM

Yeon-Wook KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240145531
    Abstract: A method for fabricating a semiconductor device includes: forming a first oxide layer containing a first element over a first electrode layer; forming a second oxide layer containing a second element over the first oxide layer; forming a stacked structure in which a plurality of first oxide layers and a plurality of second oxide layers are alternately stacked by repeating the forming of the first oxide layer and the forming of the second oxide layer a plurality of times; and forming a second electrode layer over the stacked structure, wherein a thickness of a lowermost first oxide layer among the plurality of first oxide layers is greater than a thickness of each of other first oxide layers.
    Type: Application
    Filed: April 14, 2023
    Publication date: May 2, 2024
    Inventors: Jung Wook WOO, Sei Yon KIM, Min Chul SUNG, Yeon Gyu LEE, Do Hee KIM, Ja Yong KIM
  • Publication number: 20240145346
    Abstract: A semiconductor device includes a substrate with a conductive pattern. A semiconductor die is electrically connected to the substrate and both the semiconductor die and the substrate are at least partially covered by a package body. In some examples, through-mold vias are formed in the package body to provide electrical signal paths from an exterior surface thereof to the conductive pattern of the substrate. In some examples, through-mold vias are included in the package body to provide electrical signal paths between the semiconductor die and an exterior surface of the package body. In some examples, an interposer is electrically connected to the through-mold vias and may be covered by the package body and/or disposed in spaced relation thereto. In some examples, the interposer may not be electrically connected to the through-mold vias but may have one or more semiconductor dies of the semiconductor device electrically connected thereto.
    Type: Application
    Filed: January 8, 2024
    Publication date: May 2, 2024
    Applicant: Amkor Technology Singapore Holding Pte. Ltd
    Inventors: Dong Joo PARK, Jin Seong KIM, Ki Wook LEE, Dae Byoung KANG, Ho CHOI, Kwang Ho KIM, Jae Dong KIM, Yeon Soo JUNG, Sung Hwan CHO
  • Patent number: 10314709
    Abstract: Disclosed is a bone regeneration device which forms an electric field on a scaffold inserted into a bone damage site. The present bone regeneration device comprises: a battery; a first electric conductor to be connected to a first electrode of the battery and inserted into a bone located on one side of the scaffold; and a second electric conductor to be connected to a second electrode of the battery and inserted into a bone located on the other side of the scaffold, wherein the battery forms an electric field on the scaffold by applying voltage to the first electric conductor and the second electric conductor.
    Type: Grant
    Filed: November 18, 2014
    Date of Patent: June 11, 2019
    Assignee: INDUSTRY-ACADEMIC COOPERATION FOUNDATION GYEONGSANG NATIONAL UNIVERSITY
    Inventors: Tae-Hyeon Nam, Ji-Wook Lee, Yeon-Wook Kim, Gyu-Bong Cho, Jung-Pil Noh
  • Publication number: 20170245996
    Abstract: Disclosed is a bone regeneration device which forms an electric field on a scaffold inserted into a bone damage site. The present bone regeneration device comprises: a battery; a first electric conductor to be connected to a first electrode of the battery and inserted into a bone located on one side of the scaffold; and a second electric conductor to be connected to a second electrode of the battery and inserted into a bone located on the other side of the scaffold, wherein the battery forms an electric field on the scaffold by applying voltage to the first electric conductor and the second electric conductor.
    Type: Application
    Filed: November 18, 2014
    Publication date: August 31, 2017
    Inventors: Tae-Hyeon NAM, Ji-Wook LEE, Yeon-Wook KIM, Gyu-Bong CHO, Jung-Pil NOH
  • Patent number: D978778
    Type: Grant
    Filed: March 8, 2021
    Date of Patent: February 21, 2023
    Inventors: Min Hyun Choi, Yeon Wook Kim