Patents by Inventor Yeong-Cherng Chiou

Yeong-Cherng Chiou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110117427
    Abstract: A battery. A electrode plate assembly is disposed in a casing and includes at least one current collection tab. At least one conductive primer is fit in the current collection tab of the electrode plate assembly and includes an inner threaded portion. At least one sealing cover is connected to the casing. At least one metal washer is disposed between the conductive primer and the sealing cover. At least one first insulation washer is fit on the sealing cover. At least one hollow conductive terminal is riveted to the first insulation washer and metal washer. At least one bolt is fastened to the inner threaded portion of the conductive primer via the hollow conductive terminal, first insulation washer, sealing cover, and metal washer and abuts the hollow conductive terminal. A laser welding treatment is applied between the bolt and the hollow conductive terminal, providing a sealing effect therebetween.
    Type: Application
    Filed: December 16, 2009
    Publication date: May 19, 2011
    Applicant: NAN YA PCB CORP.
    Inventors: Chih-Yen Lin, Ping-Sung Hung, Yeong-Cherng Chiou, Chiang-Wen Lai
  • Patent number: 4762747
    Abstract: Described is a single component aqueous adhesive composition especially suitable for flexible printed circuits. The composition consists of water and a homogeneous film-forming acrylic polymer. The acrylic polymer is a polymerization product of (A) acrylonitrile or methacrylonitrile, or mixture thereof, (B) an alkyl acrylate or methacrylate having 1-12 carbon atoms in the alkyl group, or mixture thereof, (C) an oxirane-containing polymerizing ethylenic monomer and (D) a hydroxyl- or amide-containing acrylate or methacrylate.The adhesive composition is useful for bonding metal foils to polyimide films in the manufacture of flexible printed circuits.
    Type: Grant
    Filed: July 29, 1986
    Date of Patent: August 9, 1988
    Assignee: Industrial Technology Research Institute
    Inventors: Jonq-Min Liu, Fu-Lung Chen, Yeong-Cherng Chiou