Patents by Inventor Yeong Deuk SEO
Yeong Deuk SEO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240059890Abstract: A thermoplastic resin composition of the present invention comprises: approximately 100 parts by weight of a polyester resin; approximately 5-30 parts by weight of a polycarbonate resin; approximately 50-150 parts by weight of a flat glass fiber; approximately 2-10 parts by an epoxy-modified olefin-based copolymer; and approximately 2-10 parts by weight of a maleic anhydride-modified ethylene-propylene-diene monomer terpolymer, wherein the weight ratio of the epoxy-modified olefin-based copolymer and the maleic anhydride-modified ethylene-propylene-diene monomer terpolymer is approximately 1:0.5 to 1:2. The thermoplastic resin composition has excellent metal bonding property, impact resistance, stiffness, retention heat stability, balance of physical properties thereof, and the like.Type: ApplicationFiled: December 1, 2021Publication date: February 22, 2024Inventors: Yeong Deuk SEO, Min Soo LEE, Ye Seul SHIN, Bong Jae LEE
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Publication number: 20230203302Abstract: A thermoplastic resin composition includes about 100 parts by weight of a polybutylene terephthalate resin, about 3 parts by weight to about 33 parts by weight of a polycarbonate resin, about 60 parts by weight to about 120 parts by weight of glass fiber, and about 0.01 parts by weight to about 1.6 parts by weight of talc having an average particle diameter of about 3 µm to about 6 µm, wherein the glass fiber and the talc are present in a weight ratio of about 50:1 to about 5,000:1. The thermoplastic resin composition can have good properties in terms of glass adhesion, metal bonding, fluidity, impact resistance, and balance therebetween.Type: ApplicationFiled: December 19, 2022Publication date: June 29, 2023Inventors: Chan Moo PARK, Mi Sung KANG, Yang Il KIM, Yeong Deuk SEO, Min Soo LEE, Sang Hwa LEE, Bong Jae LEE
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Patent number: 11655335Abstract: A thermoplastic resin composition of the present invention comprises: about 45 wt % to about 65 wt % of an aromatic polyamide resin comprising at least one of a repeat unit represented by Formula 1, a repeat unit represented by Formula 2, and a repeat unit represented by Formula 3; about 1 wt % to about 20 wt % of an olefin copolymer; about 15 wt % to about 35 wt % of calcium carbonate; and about 5 wt % to about 25 wt % of zinc oxide, wherein the weight ratio of the calcium carbonate and the zinc oxide (calcium carbonate:zinc oxide) is about 5:1 to about 1:1. The thermoplastic resin composition and a molded article formed therefrom have good properties in terms of plating adhesion, appearance, heat resistance, etc.Type: GrantFiled: December 31, 2018Date of Patent: May 23, 2023Assignee: Lotte Chemical CorporationInventors: Yeong Deuk Seo, Kyoung Tae Youm, Sang Hwa Lee, Sang Hyun Hong
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Patent number: 11578206Abstract: A polyamide resin composition and a molded article including the same are disclosed. The polyamide resin composition includes: (A) an aromatic polyamide resin; (B) an aliphatic polyamide resin; (C) a modified polyolefin resin; and (D) calcium carbonate. The polyamide resin composition can have good properties in terms of heat resistance, impact resistance, plating adhesion, and the like.Type: GrantFiled: October 25, 2018Date of Patent: February 14, 2023Assignee: Lotte Advanced Materials Co., Ltd.Inventors: Kyung Rae Kim, Yeong Deuk Seo, Sang Hyun Hong
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Patent number: 11577496Abstract: A polyamide resin composition and a molded article manufactured using the same. The polyamide resin composition includes: about 40 wt % to about 60 wt % of a polyamide resin including a repeat unit represented by Formula 1 and a repeat unit represented by Formula 2 as defined in the specification; about 1 wt % to about 10 wt % of a maleic anhydride-modified olefin-based copolymer; about 5 wt % to about 20 wt % of calcium carbonate subjected to surface treatment with a silane compound; and about 20 wt % to about 40 wt % of glass fibers, wherein the silane compound includes a functional group comprising an amino group, an epoxy group, and/or a (meth)acryloxy group. The polyamide resin composition and the molded article produced using the same can have good properties in terms of plating adhesion, impact resistance, thermal resistance, and/or appearance, and the like.Type: GrantFiled: December 27, 2018Date of Patent: February 14, 2023Assignee: Lotte Chemical CorporationInventors: Sang Hwa Lee, Yeong Deuk Seo, Sang Hyun Hong
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Patent number: 11565513Abstract: A polyamide resin composition and a molded article manufactured using the same. The polyamide resin composition includes: about 15 wt % to about 49 wt % of an aromatic polyamide resin including a repeat unit represented by Formula 1 and a repeat unit represented by Formula 2 as defined in the specification; about 1 wt % to about 30 wt % of a polyamide resin having a glass transition temperature of about 40° C. to about 120° C.; about 1 wt % to about 20 wt % of an olefin-based copolymer; and about 30 wt % to about 50 wt % of calcium carbonate. The polyamide resin composition and the molded article produced using the same can have good properties in terms of plating adhesion, impact resistance, thermal resistance, fluidity, and/or appearance, and the like.Type: GrantFiled: December 28, 2018Date of Patent: January 31, 2023Assignee: Lotte Chemical CorporationInventors: Sang Hwa Lee, Yeong Deuk Seo, Kyoung Tae Youm, Sang Hyun Hong
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Patent number: 11524492Abstract: A polyamide resin composition and a molded article manufactured using the same. The polyamide resin composition includes: about 15 wt % to about 49 wt % of an aromatic polyamide resin including a repeat unit represented by Formula 1 and a repeat unit represented by Formula 2 as defined in the specification; about 1 wt % to about 30 wt % of a polyamide resin having a glass transition temperature of about 40° C. to about 120° C.; about 1 wt % to about 20 wt % of an olefin-based copolymer; and about 30 wt % to about 50 wt % of calcium carbonate. The polyamide resin composition and the molded article produced using the same can have good properties in terms of plating adhesion, impact resistance, thermal resistance, fluidity, and/or appearance, and the like.Type: GrantFiled: December 28, 2018Date of Patent: December 13, 2022Assignee: Lotte Chemical CorporationInventors: Sang Hwa Lee, Yeong Deuk Seo, Kyoung Tae Youm, Sang Hyun Hong
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Publication number: 20220186026Abstract: A polyamide resin composition of the present invention comprises: approximately 100 parts by weight of a polyamide resin comprising approximately 5 to 40 weight % of an aromatic polyamide resin and approximately 60 to 95 weight % of an aliphatic polyamide resin; approximately 30 to 70 parts by weight of an inorganic filler; and approximately 0.5 to 5 parts by weight of modified polyalkylene glycol. The modified polyalkylene glycol comprises an isocyanate group, a succinimide group or an epoxy group at one terminal of polyalkylene glycol. The polyamide resin composition exhibits excellent adhesiveness with other materials, excellent antifouling properties, impact resistance, stiffness, injection moldability and the like.Type: ApplicationFiled: March 25, 2020Publication date: June 16, 2022Inventors: Sang Hwa LEE, Ho Geun PARK, Yeong Deuk SEO
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Patent number: 11274205Abstract: A polyamide resin composition includes an aromatic polyamide resin, an aliphatic polyamide resin, a polyacrylic acid, and glass fibers. The polyamide resin composition can have good properties in terms of heat resistance, long-term heat resistance stability, and/or appearance characteristics.Type: GrantFiled: November 19, 2019Date of Patent: March 15, 2022Assignee: Lotte Advanced Materials Co., Ltd.Inventors: Sang Hwa Lee, Yeong Deuk Seo, Sang Hyun Hong
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Patent number: 11208554Abstract: A thermally-conductive resin composition according to the present invention comprises: approximately 10-50 wt % polycarbonate resin; approximately 1-10 wt % glycol-modified polyester resin; approximately 1-15 wt % glass transition temperature depressing agent; approximately 5-20 wt % additive for laser direct structuring; approximately 10-35 wt % boron nitride having average particle size (D50) of approximately 10 ?m or greater; and approximately 10-30 wt % glass fiber having a non-circular cross-sectional surface.Type: GrantFiled: December 27, 2017Date of Patent: December 28, 2021Assignee: Lotte Advanced Materials Co., Ltd.Inventors: Jee Kwon Park, Yeong Deuk Seo, Jung Ki Kim, Yoo Jin Jung, Sang Hyun Hong
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Patent number: 11091634Abstract: The present invention relates to a thermoplastic resin composition and a molded product produced therefrom. In one embodiment, the thermoplastic resin composition comprises: a base resin including a polyphenylene ether resin and a rubber-reinforced polystyrene resin; a styrene-based block copolymer resin; and a hydrocarbon-based oil.Type: GrantFiled: December 29, 2017Date of Patent: August 17, 2021Assignee: Lotte Advanced Materials Co., Ltd.Inventors: Kyoung Tae Youm, Yeong Deuk Seo, Sang Hyun Hong
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Publication number: 20210214555Abstract: The polyamide resin composition of the present invention comprises: about 15 to about 49 wt % of an aromatic polyamide resin containing a repeating unit represented by chemical formula 1 and a repeating unit represented by chemical formula 2; about 1 to about 30 wt % of a polyamide resin having a glass transition temperature of about 40 to about 120° C.; about 1 to about 20 wt % of an olefin-based copolymer; about 5 to about 40 wt % of calcium carbonate; and about 5 to about 40 wt % of talc. The polyamide resin composition and the molded product formed therefrom are excellent in plating adhesion, impact resistance, stiffness, heat resistance, flowability, appearance characteristics, and the like.Type: ApplicationFiled: May 21, 2019Publication date: July 15, 2021Inventors: Yeong Deuk SEO, Sang Hwa LEE, Sang Hyun HONG
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Publication number: 20210070935Abstract: A thermoplastic resin composition of the present invention comprises: about 45 wt % to about 65 wt % of an aromatic polyamide resin comprising at least one of a repeat unit represented by Formula 1, a repeat unit represented by Formula 2, and a repeat unit represented by Formula 3; about 1 wt % to about 20 wt % of an olefin copolymer; about 15 wt % to about 35 wt % of calcium carbonate; and about 5 wt % to about 25 wt % of zinc oxide, wherein the weight ratio of the calcium carbonate and the zinc oxide (calcium carbonate:zinc oxide) is about 5:1 to about 1:1. The thermoplastic resin composition and a molded article formed therefrom have good properties in terms of plating adhesion, appearance, heat resistance, etc.Type: ApplicationFiled: December 31, 2018Publication date: March 11, 2021Inventors: Yeong Deuk SEO, Kyoung Tae YOUM, Sang Hwa LEE, Sang Hyun HONG
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Publication number: 20210070997Abstract: A polyamide resin composition of the present invention comprises: about 40 wt % to about 60 wt % of a polyamide resin comprising a repeat unit represented by Formula 1 and a repeat unit represented by Formula 2; about 0.5 wt % to about 10 wt % of an olefin copolymer; about 0.5 wt % to about 10 wt % of a maleic anhydride-modified olefin copolymer; about 5 wt % to about 15 wt % of calcium carbonate; and about 20 wt % to about 40 wt % of glass fibers. The polyamide resin composition and a molded article formed therefrom have good properties in terms of plating adhesion, impact resistance, heat resistance, appearance properties, and the like.Type: ApplicationFiled: December 28, 2018Publication date: March 11, 2021Inventors: Sang Hwa LEE, Yeong Deuk SEO, Kyoung Tae YOUM, Sang Hyun HONG
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Publication number: 20200208031Abstract: A polyamide resin composition includes: about 5% by weight (wt %) to about 50 wt % of an aromatic polyamide resin; about 10 wt % to about 60 wt % of an aliphatic polyamide resin; about 20 wt % to about 60 wt % of inorganic fillers; and about 0.5 wt % to about 5 wt % of a polyetheresteramide block copolymer, wherein the polyetheresteramide block copolymer is a polymer of a reaction mixture including about 5 wt % to about 95 wt % of an amino carboxylic acid, lactam or diamine-dicarboxylic acid salt and about 5 wt % to about 95 wt % of polyalkylene glycol. The polyamide resin composition can exhibit good adhesion with respect to other materials and anti-contamination (antifouling) properties.Type: ApplicationFiled: December 26, 2019Publication date: July 2, 2020Inventors: Sang Hwa LEE, Ho Geun PARK, Yeong Deuk SEO, Sang Hyun HONG
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Publication number: 20200165449Abstract: A polyamide resin composition includes an aromatic polyamide resin, an aliphatic polyamide resin, a polyacrylic acid, and glass fibers. The polyamide resin composition can have good properties in terms of heat resistance, long-term heat resistance stability, and/or appearance characteristics.Type: ApplicationFiled: November 19, 2019Publication date: May 28, 2020Inventors: Sang Hwa LEE, Yeong Deuk SEO, Sang Hyun HONG
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Publication number: 20200123378Abstract: The present invention relates to a thermoplastic resin composition and a molded product produced therefrom. In one embodiment, the thermoplastic resin composition comprises: a base resin including a polyphenylene ether resin and a rubber-reinforced polystyrene resin; a styrene-based block copolymer resin; and a hydrocarbon-based oil.Type: ApplicationFiled: December 29, 2017Publication date: April 23, 2020Inventors: Kyoung Tae YOUM, Yeong Deuk SEO, Sang Hyun HONG
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Patent number: 10501623Abstract: Disclosed herein is a polycarbonate resin composition. The polycarbonate resin composition includes: (A) 100 parts by weight of a polycarbonate resin; (B) about 1 part by weight to about 5 parts by weight of a core-shell type impact modifier having an average particle diameter (D50) of about 70 nm to about 130 nm; and (C) about 0.1 parts by weight to about 1 parts by weight of an olefin-(meth) acrylate copolymer, wherein the core-shell type impact modifier (B) includes a unit derived from a C1 to C6 alkyl (meth)acrylate and has a unimodal particle size distribution.Type: GrantFiled: December 28, 2017Date of Patent: December 10, 2019Assignee: Lotte Advanced Materials Co., Ltd.Inventors: Mi Rae Jang, Jung Ki Kim, Yeong Deuk Seo, Sang Hyun Hong
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Publication number: 20190338117Abstract: A thermally-conductive resin composition according to the present invention comprises: approximately 10-50 wt % polycarbonate resin; approximately 1-10 wt % glycol-modified polyester resin; approximately 1-15 wt % glass transition temperature depressing agent; approximately 5-20 wt % additive for laser direct structuring; approximately 10-35 wt % boron nitride having average particle size (D50) of approximately 10 ?m or greater; and approximately 10-30 wt % glass fiber having a non-circular cross-sectional surface.Type: ApplicationFiled: December 27, 2017Publication date: November 7, 2019Applicant: LOTTE ADVANCED MATERIALS CO., LTD.Inventors: Jee Kwon PARK, Yeong Deuk SEO, Jung Ki KIM, Yoo Jin JUNG, Sang Hyun HONG
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Publication number: 20190203046Abstract: A polyamide resin composition and a molded article manufactured using the same. The polyamide resin composition includes: about 15 wt % to about 49 wt % of an aromatic polyamide resin including a repeat unit represented by Formula 1 and a repeat unit represented by Formula 2 as defined in the specification; about 1 wt % to about 30 wt % of a polyamide resin having a glass transition temperature of about 40° C. to about 120° C.; about 1 wt % to about 20 wt % of an olefin-based copolymer; and about 30 wt % to about 50 wt % of calcium carbonate. The polyamide resin composition and the molded article produced using the same can have good properties in terms of plating adhesion, impact resistance, thermal resistance, fluidity, and/or appearance, and the like.Type: ApplicationFiled: December 28, 2018Publication date: July 4, 2019Inventors: Sang Hwa LEE, Yeong Deuk SEO, Kyoung Tae YOUM, Sang Hyun HONG