Abstract: Disclosed are a semiconductor manufacturing facility and a shower head coating method using the same. The semiconductor manufacturing facility includes an index block, a processing block including a substrate processing apparatus, and a substrate transferring block. The substrate processing apparatus includes a chamber including a processing space defined therein, a substrate support unit disposed in the processing space and including a first heating member configured to heat the substrate coated with the precursor, a gas supply unit configured to supply gas to the processing space, a plasma generation unit configured to convert the supplied gas into plasma, a shower head configured to supply the supplied gas to the processing space, and a controller. The controller controls the first heating member to heat the substrate supported by the substrate support unit so that the precursor applied to the substrate is vaporized and a coating layer is formed on the shower head.

Abstract: A display device includes a pixel circuit part including a first oxide semiconductor layer, a first gate driver electrically connected to the pixel circuit part, and including a second oxide semiconductor layer at a same layer as the first oxide semiconductor layer, and a first line part electrically connected to the first gate driver, and defining at least one first dummy contact hole adjacent to the second oxide semiconductor layer.

Abstract: A display device comprises a base substrate, a lower interlayer dielectric layer, an oxide semiconductor layer including a first channel region, a first drain region disposed on one side of the first channel region, and a first source region, a first gate insulating layer, a first upper gate electrode, an upper interlayer dielectric layer, and a first source electrode and a first drain electrode, wherein the lower interlayer dielectric layer includes a first lower interlayer dielectric layer disposed on the base substrate, and a second lower interlayer dielectric layer disposed on the first lower interlayer dielectric layer, wherein the first lower interlayer dielectric layer includes silicon nitride and the second lower interlayer dielectric layer comprises silicon oxide, and wherein a composition ratio of nitrogen to silicon in the first lower interlayer dielectric layer ranges from 0.8 to 0.89.

Abstract: A display device may include a first active layer disposed on a substrate, a scan line disposed on the first active layer, a lower gate signal line disposed on the scan line, an oxide semiconductor pattern disposed on the lower gate signal line, and including a channel part that overlaps the lower gate signal line and a low-resistance part formed on a side portion of the channel part, a metal pattern disposed on at least one surface of the low-resistance part, and an upper gate signal line disposed on the oxide semiconductor pattern to overlap the channel part.

Abstract: A display device includes a first thin film transistor disposed on a substrate. A first insulating interlayer covers the first thin film transistor. An active pattern is disposed on the first insulating interlayer. The active pattern includes indium-gallium-zinc oxide (IGZO) having a thickness in a range of about 150 ? to about 400 ?. A gate insulation layer covers the active pattern. A gate pattern is disposed on the gate insulation layer. A second insulating interlayer covers the gate pattern.

Abstract: A display device comprises a base substrate, a lower interlayer dielectric layer, an oxide semiconductor layer including a first channel region, a first drain region disposed on one side of the first channel region, and a first source region, a first gate insulating layer, a first upper gate electrode, an upper interlayer dielectric layer, and a first source electrode and a first drain electrode, wherein the lower interlayer dielectric layer includes a first lower interlayer dielectric layer disposed on the base substrate, and a second lower interlayer dielectric layer disposed on the first lower interlayer dielectric layer, wherein the first lower interlayer dielectric layer includes silicon nitride and the second lower interlayer dielectric layer comprises silicon oxide, and wherein a composition ratio of nitrogen to silicon in the first lower interlayer dielectric layer ranges from 0.8 to 0.89.

Abstract: A display device includes a polycrystalline semiconductor including a channel, a first electrode, and a second electrode of a driving transistor, a first gate insulating layer, a gate electrode of a driving transistor, a first electrode of a boost capacitor, a second gate insulating layer, a first interlayer insulating layer, an oxide semiconductor including a channel, a first electrode, and a second electrode of a second transistor, a channel, a first electrode, and a second electrode of a third transistor, and a second electrode of a boost capacitor, a third gate insulating layer disposed on the oxide semiconductor, a gate electrode of the second transistor overlapping the channel of the second transistor, a gate electrode of the third transistor overlapping the channel of the third transistor, and a second interlayer insulating layer disposed on the gate electrode of the second transistor and the gate electrode of the third transistor.

Abstract: A display device may include a first active layer disposed on a substrate, a scan line disposed on the first active layer, a lower gate signal line disposed on the scan line, an oxide semiconductor pattern disposed on the lower gate signal line, and including a channel part that overlaps the lower gate signal line and a low-resistance part formed on a side portion of the channel part, a metal pattern disposed on at least one surface of the low-resistance part, and an upper gate signal line disposed on the oxide semiconductor pattern to overlap the channel part.

Abstract: A display device includes a first thin film transistor disposed on a substrate. A first insulating interlayer covers lire first thin film transistor. An active pattern is disposed on the first insulating interlayer. The active pattern includes indium-gallium-zinc oxide (IGZO) having a thickness in a range of about 150 ? to about 400 ?. A gate insulation layer covers the active pattern A gate pattern is disposed on the gate insulation layer. A second insulating interlayer covers the gate pattern.

Abstract: A display device includes a polycrystalline semiconductor including a channel, a first electrode, and a second electrode of a driving transistor, a first gate insulating layer, a gate electrode of a driving transistor, a first electrode of a boost capacitor, a second gate insulating layer, a first interlayer insulating layer, an oxide semiconductor including a channel, a first electrode, and a second electrode of a second transistor, a channel, a first electrode, and a second electrode of a third transistor, and a second electrode of a boost capacitor, a third gate insulating layer disposed on the oxide semiconductor, a gate electrode of the second transistor overlapping the channel of the second transistor, a gate electrode of the third transistor overlapping the channel of the third transistor, and a second interlayer insulating layer disposed on the gate electrode of the second transistor and the gate electrode of the third transistor.

Abstract: Provided are an oxide semiconductor device and a method for manufacturing same, wherein the oxide semiconductor device according to an embodiment of the inventive concept includes a substrate, and an oxide semiconductor layer on the substrate having different concentration of oxygen vacancy in the thickness direction.

Abstract: Provided are an oxide semiconductor device and a method for manufacturing same, wherein the oxide semiconductor device according to an embodiment of the inventive concept includes a substrate, and an oxide semiconductor layer on the substrate having different concentration of oxygen vacancy in the thickness direction.