Patents by Inventor Yeong Im Yu

Yeong Im Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dicing die-bonding film
    Patent number: 11404301
    Abstract: The present invention relates to a dicing die-bonding film including: a substrate; an antistatic layer formed on the substrate and including an aliphatic or alicyclic polyurethane resin and a conductive filler; a cohesive layer formed on the antistatic layer; and an adhesive layer formed on the cohesive layer, and a dicing method of a semiconductor wafer using the dicing die-bonding film.
    Type: Grant
    Filed: August 30, 2018
    Date of Patent: August 2, 2022
    Assignee: LG CHEM, LTD.
    Inventors: Ji Ho Han, Se Ra Kim, Mun Seop Song, Kwang Joo Lee, Yeong Im Yu
  • DICING DIE-BONDING FILM
    Publication number: 20200211889
    Abstract: The present invention relates to a dicing die-bonding film including: a substrate; an antistatic layer formed on the substrate and including an aliphatic or alicyclic polyurethane resin and a conductive filler; a cohesive layer formed on the antistatic layer; and an adhesive layer formed on the cohesive layer, and a dicing method of a semiconductor wafer using the dicing die-bonding film.
    Type: Application
    Filed: August 30, 2018
    Publication date: July 2, 2020
    Applicant: LG CHEM, LTD.
    Inventors: Ji Ho HAN, Se Ra KIM, Mun Seop SONG, Kwang Joo LEE, Yeong Im YU
  • Manufacturing method of polyaspartic acid using maleic anhydride
    Patent number: 8729218
    Abstract: The present invention relates to a manufacturing method of polyaspartic acid. More particularly, the present invention relates to a manufacturing method of polyaspartic acid comprising steps of carrying out condensation polymerization of maleic anhydride and ammonia in the presence of a polar solvent without active hydrogen to give polysuccinimide and hydrolyzing the resulting polysuccinimide to obtain polyaspartic acid. Specifically, the present invention is characterized in that the quality of the synthetic product, polysuccinimide and polyaspartic acid, is improved by minimizing the decomposition and the degradation of the maleic acid during the process of the polymerization resulted from the introduction of substituent to maleic acid.
    Type: Grant
    Filed: April 17, 2007
    Date of Patent: May 20, 2014
    Assignee: Aekyung Petrochemical Co., Ltd.
    Inventors: Jeong Gon Kim, Jong Hwa Lee, Sung Duck Seo, Yeong Im Yu
  • Manufacturing Method of Polyaspartic Acid Using Maleic Anhydride
    Publication number: 20100076161
    Abstract: The present invention relates to a manufacturing method of polyaspartic acid. More particularly, the present invention relates to a manufacturing method of polyaspartic acid comprising steps of carrying out condensation polymerization of maleic anhydride and ammonia in the presence of a polar solvent without active hydrogen to give polysuccinimide and hydrolyzing the resulting polysuccinimide to obtain polyaspartic acid. Specifically, the present invention is characterized in that the quality of the synthetic product, polysuccinimide and polyaspartic acid, is improved by minimizing the decomposition and the degradation of the maleic acid during the process of the polymerization resulted from the introduction of substituent to maleic acid.
    Type: Application
    Filed: April 17, 2007
    Publication date: March 25, 2010
    Applicant: AEKYUNG PETROCHEMICAL CO., LTD.
    Inventors: Jeong Gon Kim, Jong Hwa Lee, Sung Duck Seo, Yeong Im Yu