Patents by Inventor Yeong-Iyeol Park

Yeong-Iyeol Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer processing method and method of manufacturing semiconductor device by using the same
    Patent number: 9070729
    Abstract: A wafer processing method, by which a device wafer may be aligned and bonded to a carrier wafer to perform a back grinding process for the device wafer and may be separated from the carrier wafer after performing the back grinding process, and a method of manufacturing a semiconductor device by using the wafer processing method are provided. The wafer processing method includes: disposing a first magnetic material on a front side of a wafer and disposing a second magnetic material on a carrier wafer, wherein a surface of the first magnetic material and a surface of the second magnetic material, which face each other, have opposite polarities; aligning and bonding the wafer to the carrier wafer by magnetic attraction between the first magnetic material and the second magnetic material; grinding a back side of the wafer to make the wafer thin; and separating the wafer from the carrier wafer.
    Type: Grant
    Filed: September 26, 2014
    Date of Patent: June 30, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sang-wook Ji, Hyoung-yol Mun, Yeong-Iyeol Park, Tae-je Cho
  • WAFER PROCESSING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY USING THE SAME
    Publication number: 20150093880
    Abstract: A wafer processing method, by which a device wafer may be aligned and bonded to a carrier wafer to perform a back grinding process for the device wafer and may be separated from the carrier wafer after performing the back grinding process, and a method of manufacturing a semiconductor device by using the wafer processing method are provided. The wafer processing method includes: disposing a first magnetic material on a front side of a wafer and disposing a second magnetic material on a carrier wafer, wherein a surface of the first magnetic material and a surface of the second magnetic material, which face each other, have opposite polarities; aligning and bonding the wafer to the carrier wafer by magnetic attraction between the first magnetic material and the second magnetic material; grinding a back side of the wafer to make the wafer thin; and separating the wafer from the carrier wafer.
    Type: Application
    Filed: September 26, 2014
    Publication date: April 2, 2015
    Inventors: Sang-wook Ji, Hyoung-yol Mun, Yeong-Iyeol Park, Tae-je Cho