Abstract: A simulation system includes an application, a chip model and an off-chip model. The application is configured to generate a corresponding instruction set in accordance with an application situation of a simulation circuit, wherein the simulation circuit includes a chip. The chip model receives the instruction set as an input to simulate operation of at least one intellectual property core of the chip via high-level languages in accordance with the at least one intellectual property core of the chip and to generate a power consumption and an I/O logic signal of the chip. The off-chip model constructs one or more orders of RLCG circuit cascading models in accordance with all or part of the off-chip model abstracted by the S parameter. The application program and the RLCG circuit cascading model are integrated for simulating and analyzing power integrity and signal integrity of the simulation system.

Abstract: An embodiment of a thermal estimation device including a temperature model generator, a temperature gradient calculator, and a thermal sensing analyzer is disclosed. The temperature model generator generates a temperature model based on an initial power consumption, an initial area and an initial coordination of a circuit module. The temperature gradient calculator substitutes at least one of a testing area, a testing power or a testing coordinate of the circuit module into the temperature model for correspondingly estimating an temperature estimation function. The thermal sensing analyzer differentiates the temperature estimation function. When an absolute value of a differential result of the temperature estimation function resulted from a constant is closest to zero or is zero, outputting the constant as an optimized parameter.

Abstract: An embodiment of a thermal estimation device including a temperature model generator, a temperature gradient calculator, and a thermal sensing analyzer is disclosed. The temperature model generator generates a temperature model based on an initial power consumption, an initial area and an initial coordination of a circuit module. The temperature gradient calculator substitutes at least one of a testing area, a testing power or a testing coordinate of the circuit module into the temperature model for correspondingly estimating an temperature estimation function. The thermal sensing analyzer differentiates the temperature estimation function. When an absolute value of a differential result of the temperature estimation function resulted from a constant is closest to zero or is zero, outputting the constant as an optimized parameter.

Abstract: An apparatus for jitter measurement includes a first delay circuit, a second delay circuit, and a control circuit. The first delay circuit imposes a preliminary phase delay on an input signal to generate a delayed input signal. The second delay circuit operates with the first delay circuit to impose a fine phase delay on the delayed input signal. The control circuit controls amounts of delays imposed by the first and second delay circuits, and fine tunes the phase delay of the delayed input signal according to the amounts of delays respectively imposed by delay elements of the first and second delay circuits, and estimates or calculates a jitter window for the input signal according to adjustment results of the first and second delay circuits.

Abstract: A thermal simulation device is applied to a transaction-level designed chip which includes a plurality of intellectual properties. The thermal simulation device includes a plurality of thermal-aware transaction-level power model circuits, a simulator, a translator and a thermal emulator. The thermal-aware transaction-level power model circuits corresponds to the respective intellectual properties, and are configured to a corresponding power information for each of the intellectual properties, and dynamically adjusts the power information according to temperature information. The simulator is configured to generate the corresponding temperature information of the intellectual properties according to compatible information. The translator is configured to generate the compatible information which is compatible with the simulator. The thermal emulator is configured to trigger the simulator and transmit the temperature information to the intellectual properties.

Abstract: A thermal simulation device is applied to a transaction-level designed chip which includes a plurality of intellectual properties. The thermal simulation device includes a plurality of thermal-aware transaction-level power model circuits, a simulator, a translator and a thermal emulator. The thermal-aware transaction-level power model circuits corresponds to the respective intellectual properties, and are configured to a corresponding power information for each of the intellectual properties, and dynamically adjusts the power information according to temperature information. The simulator is configured to generate the corresponding temperature information of the intellectual properties according to compatible information. The translator is configured to generate the compatible information which is compatible with the simulator. The thermal emulator is configured to trigger the simulator and transmit the temperature information to the intellectual properties.

Abstract: An apparatus for jitter measurement includes a first delay circuit, a second delay circuit, and a control circuit. The first delay circuit imposes a preliminary phase delay on an input signal to generate a delayed input signal. The second delay circuit operates with the first delay circuit to impose a fine phase delay on the delayed input signal. The control circuit controls amounts of delays imposed by the first and second delay circuits, and fine tunes the phase delay of the delayed input signal according to the amounts of delays respectively imposed by delay elements of the first and second delay circuits, and estimates or calculates a jitter window for the input signal according to adjustment results of the first and second delay circuits.

Abstract: A semiconductor package structure includes a package substrate, at least a chip, solder balls, a light emitting/receiving device, a optical intermediary device and an optical transmission device. The package substrate has a first surface, a second surface, a circuit and solder ball pads, wherein each solder ball pad is electrically connected to the circuit. The chip is disposed on the first surface and electrically connected to the circuit. The solder balls are respectively disposed on the solder ball pads. The light emitting/receiving device is disposed on the package substrate and electrically connected to the circuit. The optical intermediary device is disposed above the light emitting/receiving device. The optical transmission device is inserted in the optical intermediary device, wherein a light emitting by the light emitting/receiving device is emitted to the optical transmission device via the optical intermediary device so that an optical signal is transmitted through the optical transmission device.

Abstract: A semiconductor package structure includes a package substrate, at least a chip, solder balls, a light emitting/receiving device, a optical intermediary device and an optical transmission device. The package substrate has a first surface, a second surface, a circuit and solder ball pads, wherein each solder ball pad is electrically connected to the circuit. The chip is disposed on the first surface and electrically connected to the circuit. The solder balls are respectively disposed on the solder ball pads. The light emitting/receiving device is disposed on the package substrate and electrically connected to the circuit. The optical intermediary device is disposed above the light emitting/receiving device. The optical transmission device is inserted in the optical intermediary device, wherein a light emitting by the light emitting/receiving device is emitted to the optical transmission device via the optical intermediary device so that an optical signal is transmitted through the optical transmission device.

Abstract: Provided is a measurement circuit for measuring a jitter of a clock signal. Delay elements delay the clock signal into delayed clock signal. Latches latch the delayed clock signals to indicate whether transition edges of the clock signal is within a window value which is corresponding to delays of the delay elements. Based on the latch result from the latches, a finite state machine generates control signals for controlling the delay elements. If the latch result indicates that the transition edges of the clock signal is not within the window value, the control signals adjust the delays of the delay elements and the window value. The jitter of the clock signal is measured based on the delays of the delay elements and the window value.

Abstract: A jitter measurement circuit and a method for calibrating the jitter measurement circuit are disclosed. The jitter measurement circuit includes a synchronous dual-phase detector and a decision circuit. In a test mode, a probability distribution function (PDF) of the jitter of a clock signal output by a circuit under test is obtained. In a calibration mode, a random clock, which is externally generated or generated by a free-run oscillator in the circuit under test, is used to calibrate the synchronous dual-phase detector. The decision circuit performs logic operations, data latching and counting on a phase relationship detected by the synchronous dual-phase detector in order to obtain a counting value and a PDF relative to the jitter of the clock signal.

Abstract: We propose an opposite-phase scheme for peak current reduction. The basic idea is to divide the clock buffers at each level of the clock tree into two sets: one half of the clock buffers operate at the same phase as the clock source, and the other half of the clock buffers operate at the opposite phase to the clock source. Consequently, our approach can effectively reduce the peak current of the clock tree. The method enables the opposite-phase scheme to combine with the electronic design automation (EDA) tools that are commonly used in modern industries.

Abstract: An instruction-based programmable memory built-in self test (P-MBIST) circuit and an address generator thereof are provided. The P-MBIST circuit generates control signals according to the decoding of compact test instructions provided by an external automatic test equipment (ATE). The address generator generates memory addresses according to the control signals. The control signals and the memory addresses are sent to an embedded memory to perform the MBIST. The algorithm-specific design of the P-MBIST circuit and the address generator enables them to support multiple test algorithms at full clock speed and occupy smaller chip area.

Abstract: A programmable memory built-in self-test circuit and a clock switching circuit thereof are provided. The memory built-in self-test circuit is able to provide more self-test functions preset by a user, simplify the redundant circuit in the prior art and reduce chip area and lower the cost by means of an instruction decoder and a built-in self-test controller. The present invention also provides some peripheral control circuits of a memory. The control circuits occupies less area and enables the memory to be tested more flexibly. The present invention further provides a clock switching circuit enabling a chip to be correctly tested under different clock speeds, which benefits to advance the testability and the analyzability of the memory embedded in a chip and thereby increase fault coverage.

Abstract: Method and technique for analogue circuit synthesis. An analogue circuit usually includes many circuit components, and characteristics and functions of each circuit component are controlled by many corresponding parameters. In the presented invention, selected key design parameters of selected critical circuit components, as well as optimization targets, design specification or/and design constraint, are transformed into an optimization plan, and an optimization engine iterates circuit level or system level numerical simulations by changing values of the selected key design parameters recorded in the optimization plan, so as to find optimized parameters and circuit components which allow the analogue circuit to match the design specification/constraint and to approach the optimization target. Thus a systematic automation for analogue circuit synthesis/design/optimization is achieved.

Abstract: Provided is a measurement circuit for measuring a jitter of a clock signal. Delay elements delay the clock signal into delayed clock signal. Latches latch the delayed clock signals to indicate whether transition edges of the clock signal is within a window value which is corresponding to delays of the delay elements. Based on the latch result from the latches, a finite state machine generates control signals for controlling the delay elements. If the latch result indicates that the transition edges of the clock signal is not within the window value, the control signals adjust the delays of the delay elements and the window value. The jitter of the clock signal is measured based on the delays of the delay elements and the window value.

Abstract: A BIST circuit for testing both an analog-to-digital converter and a phase lock loop includes a controllable delay circuit, a NAND gate, a dividing circuit, a NOR gate and a charge/discharge circuit. The invention reduces the period of the signal under test, converts its pulse width to voltage and measures the output via an ADC. The clock jitter becomes sensitive through a delay cancellation method, thus, the accuracy is improved. The invention further comprises all testing procedure for period jitters of a PLL and static characteristics of an ADC. The test error caused by process variation can be corrected by a controllable delay circuit such that the error determination of the test result is prevented.

Abstract: A controllable delay line includes an anti-jitter unit, a dependent current source, a first current mirror, a second current mirror, a regulation capacitor, a compensation capacitor and an output buffer unit. The anti-jitter unit receives a first bias voltage and produces a second bias voltage based on the first bias voltage. When the voltage source used in the controllable delay line has a variation, the second bias voltage varies therewith. The regulation capacitor is used for reducing the variation of the voltage difference between the voltage source and a node voltage of the first current source. The compensation capacitor is used for reducing the influence of a transition of the input signal of the output buffer unit on the node voltage, so as to lower the jitter amount of the output signal of the output buffer unit.

Abstract: A programmable memory built-in self-test circuit and a clock switching circuit thereof are provided. The memory built-in self-test circuit is able to provide more self-test functions preset by a user, simplify the redundant circuit in the prior art and reduce chip area and lower the cost by means of an instruction decoder and a built-in self-test controller. The present invention also provides some peripheral control circuits of a memory. The control circuits occupies less area and enables the memory to be tested more flexibly. The present invention further provides a clock switching circuit enabling a chip to be correctly tested under different clock speeds, which benefits to advance the testability and the analyzability of the memory embedded in a chip and thereby increase fault coverage.

Abstract: A jitter measurement circuit and a method for calibrating the jitter measurement circuit are disclosed. The jitter measurement circuit includes a synchronous dual-phase detector and a decision circuit. In a test mode, a probability distribution function (PDF) of the jitter of a clock signal output by a circuit under test is obtained. In a calibration mode, a random clock, which is externally generated or generated by a free-run oscillator in the circuit under test, is used to calibrate the synchronous dual-phase detector. The decision circuit performs logic operations, data latching and counting on a phase relationship detected by the synchronous dual-phase detector in order to obtain a counting value and a PDF relative to the jitter of the clock signal.