Abstract: The present disclosure in some embodiments provides a product inspection method and a system based on deep learning for detecting a product defect. The present disclosure provides a product inspection method and system for detecting product defects by linking a predeveloped deep learning-based classification model to interwork with the existing product inspection system while fine-tuning the classification model to be maintained or supplemented by instantly correcting errors of the classification model, thereby improving the accuracy of product quality inspection.

Abstract: The present disclosure in some embodiments provides a product inspection method and a system based on deep learning for detecting a product defect. The present disclosure provides a product inspection method and system for detecting product defects by linking a predeveloped deep learning-based classification model to interwork with the existing product inspection system while fine-tuning the classification model to be maintained or supplemented by instantly correcting errors of the classification model, thereby improving the accuracy of product quality inspection.

Abstract: Provided is a semiconductor package including a de-coupling capacitor. The semiconductor package includes a substrate, on an upper surface of which a semiconductor chip is mounted; a plurality of first conductive bumps that are disposed on a lower surface of the substrate and that electrically connect the substrate to an external device; and a de-coupling capacitor that is disposed on the lower surface of the substrate and includes an electrode portion and at least one dielectric layer, wherein the electrode portion of the de-coupling capacitor includes second conductive bumps that electrically connect the substrate to an external device.