Patents by Inventor Yeong-Jyn T. Lii

Yeong-Jyn T. Lii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Interconnect structure and method for forming
    Publication number: 20040002210
    Abstract: An interconnect structure with a via (66) embedded in a first low dielectric constant material (44) and a trench (66) embedded in a second low dielectric constant material (48), which is a different material than the first low dielectric constant material (44), is formed. In one embodiment, the second low dielectric constant material (48) is used as a mask for etching the first low dielectric constant material (44). Also, in one embodiment, the first low dielectric constant material (44) may be used as an etch stop layer for etching the second low dielectric constant material. The second low dielectric constant material (48) may include silicon and oxygen and the first low dielectric constant material (44) may be organic.
    Type: Application
    Filed: June 28, 2002
    Publication date: January 1, 2004
    Inventors: Cindy K. Goldberg, Yeong-Jyn T. Lii