Patents by Inventor Yeong Lim KWON

Yeong Lim KWON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230110409
    Abstract: A multilayer electronic component includes a plurality of capacitance forming portions including a first dielectric layer and an internal electrode disposed in a first direction, and an intermediate layer disposed between capacitance forming portions adjacent to each other and including a second dielectric layer, a body including first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; and an external electrode disposed on the body and connected to the internal electrode. The second dielectric layer includes graphene. The first dielectric layer does not include graphene, or includes graphene in a content less than a content of graphene included in the second dielectric layer.
    Type: Application
    Filed: September 30, 2022
    Publication date: April 13, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yeong Lim KWON, Soo Hwan SON, Jung Min PARK, Se Hun PARK
  • Patent number: 11610740
    Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and first and second internal electrodes with the dielectric layer interposed therebetween, the dielectric layer and the first and second internal electrodes arranged to be stacked, and a first cover portion disposed on the capacitance portion, and a second cover portion disposed on the capacitance portion, a first external electrode connected to the first internal electrode, and a second external electrode connected to the second internal electrode. The first cover portion and the second cover portion include a cover reinforcing layer including graphene.
    Type: Grant
    Filed: July 8, 2021
    Date of Patent: March 21, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yeong Lim Kwon, Jung Min Park, Se Hun Park, Young Ghyu Ahn, Soo Hwan Son, Seung Yong Lee, Yu Ra Shin
  • Patent number: 11328870
    Abstract: An electronic component includes a multilayer capacitor including a capacitor body having first to sixth surfaces, and first and second external electrodes; and an interposer including an interposer body and first and second external terminals; and the capacitor body includes a plurality of dielectric layers and a plurality of first and second internal electrodes, the first and second internal electrodes are exposed through the third and fourth surfaces of the capacitor body, respectively, and the interposer further includes first and second solder fillet limiting layers disposed on upper sides of both surfaces of each of the first and second external terminals in the first direction, respectively.
    Type: Grant
    Filed: April 20, 2020
    Date of Patent: May 10, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ho Yoon Kim, Yeong Lim Kwon
  • Publication number: 20220051854
    Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and first and second internal electrodes with the dielectric layer interposed therebetween, the dielectric layer and the first and second internal electrodes arranged to be stacked, and a first cover portion disposed on the capacitance portion, and a second cover portion disposed on the capacitance portion, a first external electrode connected to the first internal electrode, and a second external electrode connected to the second internal electrode. The first cover portion and the second cover portion include a cover reinforcing layer including graphene.
    Type: Application
    Filed: July 8, 2021
    Publication date: February 17, 2022
    Inventors: Yeong Lim KWON, Jung Min PARK, Se Hun PARK, Young Ghyu AHN, Soo Hwan SON, Seung Yong LEE, Yu Ra SHIN
  • Publication number: 20210202174
    Abstract: An electronic component includes a multilayer capacitor including a capacitor body having first to sixth surfaces, and first and second external electrodes; and an interposer including an interposer body and first and second external terminals; and the capacitor body includes a plurality of dielectric layers and a plurality of first and second internal electrodes, the first and second internal electrodes are exposed through the third and fourth surfaces of the capacitor body, respectively, and the interposer further includes first and second solder fillet limiting layers disposed on upper sides of both surfaces of each of the first and second external terminals in the first direction, respectively.
    Type: Application
    Filed: April 20, 2020
    Publication date: July 1, 2021
    Inventors: Ho Yoon KIM, Yeong Lim KWON