Patents by Inventor Yeong-Seon PARK

Yeong-Seon PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240177185
    Abstract: A system and method for blockchain-based data crowdsourcing and distribution source supply of data suitable for a purpose to a plurality of crowd providers according to a request from a purchaser, and automatically calculate and pay a different royalty for each subject of a provider, a processor, an inspector, and an immediately previous purchaser according to quality of provided data, a rate of data loss due to non-consent to resale during a distribution process, and contribution of a processor and/or an inspector involved in a provision process.
    Type: Application
    Filed: September 18, 2023
    Publication date: May 30, 2024
    Inventor: Yeong Seon PARK
  • Patent number: 11167347
    Abstract: A material feeding apparatus is disclosed. An apparatus for removing a surface oxide of a metal material and feeding the metal material to a melting furnace, according to an embodiment of the present disclosure, includes: a housing including a material dropping chamber for feeding and discharging the metal material and a material etching chamber for performing a plasma etching process; and a pretreatment casing configured to reciprocate between the material dropping chamber and the material etching chamber in the housing, wherein the pretreatment casing receives the metal material from the material dropping chamber to store the metal material, moves to the material etching chamber to plasma-etch a surface oxide layer of the stored metal material, and then returns to the material dropping chamber to drop the etched metal material into the melting furnace.
    Type: Grant
    Filed: August 24, 2017
    Date of Patent: November 9, 2021
    Assignee: POSCO
    Inventors: Seung Ho Lim, Goo Hwa Kim, Kyung Hoon Nam, Yeong Seon Park
  • Publication number: 20190308240
    Abstract: A material feeding apparatus is disclosed. An apparatus for removing a surface oxide of a metal material and feeding the metal material to a melting furnace, according to an embodiment of the present disclosure, includes: a housing including a material dropping chamber for feeding and discharging the metal material and a material etching chamber for performing a plasma etching process; and a pretreatment casing configured to reciprocate between the material dropping chamber and the material etching chamber in the housing, wherein the pretreatment casing receives the metal material from the material dropping chamber to store the metal material, moves to the material etching chamber to plasma-etch a surface oxide layer of the stored metal material, and then returns to the material dropping chamber to drop the etched metal material into the melting furnace.
    Type: Application
    Filed: August 24, 2017
    Publication date: October 10, 2019
    Inventors: Seung Ho Lim, Goo Hwa Kim, Kyung Hoon Nam, Yeong Seon Park
  • Publication number: 20190203345
    Abstract: A molten material supply unit includes a raw material supply portion to which a solid material is supplied; a melting container portion connected to the raw material supply portion, and configured to melt the solid material to form a liquefied material and then emit the liquefied material externally; and a barrier portion provided between a supply area of the melting container portion connected to the raw material supply portion and an emission area of the melting container portion emitting the liquefied material externally, and configured to move only the liquefied material to the emission area.
    Type: Application
    Filed: May 16, 2017
    Publication date: July 4, 2019
    Inventors: Goo-Hwa KIM, Seung-Ho LIM, Tae-Yeob KIM, Yeong-Seon PARK, Kyung-Hoon NAM
  • Patent number: 10239143
    Abstract: A slab scarfing apparatus comprises: an upper nozzle unit having an upper surface nozzle for scarfing an edge portion of the upper surface of a slab and having a first side nozzle scarfing an upper edge portion of the side surface of the slab and moving together with the upper surface nozzle; a lower nozzle unit having a lower nozzle for scarfing an edge portion of the lower surface of the slab and having a second side nozzle scarfing a lower edge portion of the side surface of the slab and moving together with the lower nozzle; and a moving apparatus for moving the upper nozzle unit and the lower nozzle unit to allow the upper nozzle unit and the lower nozzle unit to be adjacent to or to be spaced apart from an edge portion of the slab. A method of controlling the apparatus is provided.
    Type: Grant
    Filed: December 22, 2014
    Date of Patent: March 26, 2019
    Assignee: POSCO
    Inventors: Seung-Ho Lim, Yeong-Seon Park, Seong-Yeon Kim, Ki-Hwan Kim, Ji-Won Yu
  • Publication number: 20160368073
    Abstract: A slab scarfing apparatus comprises: an upper nozzle unit having an upper surface nozzle for scarfing an edge portion of the upper surface of a slab and having a first side nozzle scarfing an upper edge portion of the side surface of the slab and moving together with the upper surface nozzle; a lower nozzle unit having a lower nozzle for scarfing an edge portion of the lower surface of the slab and having a second side nozzle scarfing a lower edge portion of the side surface of the slab and moving together with the lower nozzle; and a moving apparatus for moving the upper nozzle unit and the lower nozzle unit to allow the upper nozzle unit and the lower nozzle unit to be adjacent to or to be spaced apart from an edge portion of the slab. A method of controlling the apparatus is provided.
    Type: Application
    Filed: December 22, 2014
    Publication date: December 22, 2016
    Inventors: Seung-Ho LIM, Yeong-Seon PARK, Seong-Yeon KIM, Ki-Hwan KIM, Ji-Won YU