Abstract: A self-cleaning apparatus for use in a chemical mechanical polishing tool. The apparatus includes a slurry-dispensing arm with a first end suspended over a polishing pad, and a second end for mounting to the chemical mechanical polishing tool. A slurry-dispensing nozzle is positioned under the first end for dispensing a polishing slurry against the polishing pad. The first end has a compound slanted top surface, a front face and adjoining side surfaces. The compound slanted top surface forms a longitudinal peak slanting from center to both sides and from the back end to the front face. The top surface of the first end has a liquid distribution manifold that is mounted distally from the front face and has a plurality of nozzles directed to spray deionized water to wash away slurry splatter from surfaces of the first end of the slurry dispensing arm during the water polishing cycle.