Patents by Inventor Yeong Su Cho

Yeong Su Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110102972
    Abstract: There is provided a chip-type electric double layer capacitor comprising: a resin case having a housing space provided therein and formed of insulating resin and first and second external terminals inserted into the resin case by insert injection molding. Each of the external terminals has a first portion exposed to an outer surface of the resin case for external contact and a second portion exposed to an inner surface of the housing space for internal contact. a sealing portion includes a groove portion provided in the resin case along a circumference of at least one of the first and second external terminals and a resin filling the groove portion. An electric double layer capacitor cell is mounted in the housing space and electrically connected to the second portion of the first and second external terminals.
    Type: Application
    Filed: October 15, 2010
    Publication date: May 5, 2011
    Applicant: SAMSUNG ELCTRO-MECHANICS CO., LTD.
    Inventors: Chang Ryul Jung, Sung Ho Lee, Dong Sup Park, Hyun Chul Jung, Yeong Su Cho, Sang Kyun Lee
  • Publication number: 20110085283
    Abstract: The present invention provides a chip type electric double layer capacitor including: a lower case having an internal space of which an upper surface is opened and an external terminal of which portions exposed to a bottom of the internal space and the outside are connected to each other; an electric double layer capacitor cell disposed in the internal space of the lower case to be electrically connected to the portion of the external terminal, which is exposed to the bottom of the internal space; and an upper cap mounted on the lower case to cover the internal space, and a method for manufacturing the same.
    Type: Application
    Filed: December 18, 2009
    Publication date: April 14, 2011
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Sup Park, Ill Kyoo Park, Chang Ryul Jung, Sang Kyun Lee, Yeong Su Cho, Sung Ho Lee
  • Publication number: 20110069426
    Abstract: An electric double layer capacitor (EDLC) includes an electric double layer cell and first and second external electrodes. The electric double layer cell includes a separator and at least one first polarizable electrode and at least one second polarizable electrode. The first and second external electrodes are formed at first and second side surfaces of the electric double layer cell facing each other, respectively. The first polarizable electrode includes a first current collection layer and a first active material layer formed on either surface of the first current collection layer facing the separator and the second polarizable electrode includes a second current collection layer and a second active material layer formed on either surface of the second current collection layer facing the separator.
    Type: Application
    Filed: December 30, 2009
    Publication date: March 24, 2011
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yeong Su Cho, Kang Heon Hur, Kwan Hyeong Kim, Chang Ryul Jung, Sang Kyun Lee, Sung Ho Lee, Dong Sup Park
  • Publication number: 20110058307
    Abstract: The present invention relates to a chip-type electric double layer capacitor and a method for manufacturing a method for manufacturing the same. The chip-type electric double layer capacitor includes an electric double layer element including two electrodes that include two different polarities and electrode terminals protruded on sides opposite to each other, a first separator that prevents the two electrodes from being short-circuited, and a second separator that is disposed at a position opposed to the first separator on the basis of one electrode of the two electrodes; and a package including package terminals attached to the protruded electrode terminals of the two electrodes, which are formed on the bottom thereof and housing the electric double layer element, wherein the electric double layer element is wound on the basis of the protruded electrode terminals opposite to the two electrodes as a reference axis and the electrode terminals are attached to the package terminals, respectively.
    Type: Application
    Filed: November 18, 2009
    Publication date: March 10, 2011
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Ho Lee, Seung Hyun Ra, Dong Sup Park, Yeong Su Cho, Sang Kyun Lee, Hyun Chul Jung, Chang Ryul Jung
  • Publication number: 20110058306
    Abstract: Disclosed is a package structure of a chip-type electric double layer capacitor which includes a lower package, which houses an electric double layer element and has a package terminal formed thereon to be electrically connected to the electric double layer element, and an upper package which is disposed on a top part of the lower package and seals the electric double layer element from the outside, wherein the package terminals are formed to be protruded from an internal bottom surface and an external bottom surface of the lower package, and the external bottom surface of the lower package has at least two pairs of protrusions formed thereon.
    Type: Application
    Filed: November 4, 2009
    Publication date: March 10, 2011
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Ho Lee, Seung Hyun Ra, Dong Sup Park, Yeong Su Cho, Sang Kyun Lee, Hyun Chul Jung, Chang Ryul Jung
  • Publication number: 20110002084
    Abstract: A chip-type electric double layer capacitor includes: an exterior case including a housing space formed therein and formed of insulation resin; a first external terminal buried in the exterior case and including a first surface exposed to the housing space and a second surface exposed to the outside of the exterior case; a second external terminal buried in the exterior case and including a first surface exposed to the housing space and a second surface exposed to the outside of the exterior case; and an electric double layer cell disposed in the housing space so as to be electrically connected to the first surfaces of the first and second external terminals.
    Type: Application
    Filed: December 30, 2009
    Publication date: January 6, 2011
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sang Kyun Lee, Chang Ryul Jung, Sung Ho Lee, Dong Sup Park, Yeong Su Cho, Hyun Chul Jung
  • Publication number: 20100328846
    Abstract: An electrode for an electric double layer capacitor includes a current collector including an aluminum (Al) foil layer and a highly conductive metal layer having a higher conductivity than Al and laminated on the Al foil layer, a groove formed in the Al foil layer to cause the highly conductive metal layer to contact an electrode material, and an electrode layer formed of the electrode material on the groove and the Al foil layer.
    Type: Application
    Filed: December 22, 2009
    Publication date: December 30, 2010
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sung Ho Lee, Hyun Chul Jung, Chang Ryul Jung, Yeong Su Cho