Patents by Inventor Yeong Uk Seo
Yeong Uk Seo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9888569Abstract: A printed circuit board includes a core insulating layer including an isotropic resin, a first circuit pattern filled in a circuit pattern groove at an upper portion or a lower portion of the core insulating layer, a first insulating layer provided in a top surface thereof with a circuit pattern groove and covering the first circuit pattern, and a second circuit pattern to fill the circuit pattern groove of the first insulating layer. A material, such as polyimide, having an isotropic structure is employed for the core insulating layer, thereby preventing the substrate from being bent without glass fiber. Since the glass fiber is not included, the buried pattern is formed at the upper portion or the lower portion of the core insulating layer, so that the thin substrate is fabricated.Type: GrantFiled: October 4, 2013Date of Patent: February 6, 2018Assignee: LG INNOTEK CO., LTD.Inventors: Sang Myung Lee, Byeong Ho Kim, Jae Seok Park, Yeong Uk Seo, Hyun Seok Seo, Chang Woo Yoo, Kyu Won Lee
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Publication number: 20180013219Abstract: Provided is a matable electrical connection structure including a female connection member and a male connection member respectively including a plurality of first connection portions and a plurality of second connection portions, and a plurality of matable connection portions configured to detachably couple the female connection member and the male connection member, and respectively and electrically connect the plurality of first connection portions to the plurality of second connection portions, and the matable connection portions include inner conductive materials respectively and electrically connected to the plurality of first connection portions and provided on inner walls of a plurality of insertion holes formed in the female connection member, columns respectively and electrically connected to the plurality of second connection portions and configured to protrude from the male connection member to be inserted into the insertion hole, and elastic fins configured to extend outside the column to elasticType: ApplicationFiled: March 20, 2015Publication date: January 11, 2018Inventors: Chong Kwang YOON, Young Soo KIM, Yeong Uk SEO, Yeong Joo MOON
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Publication number: 20180013251Abstract: Provided is a method of manufacturing an electrical connection structure which includes a female connection structure having an inner conductive material inside an insertion hole of a female connection member, and a male connection structure having a conductive column configured to be inserted into and fixed to the insertion hole to be in contact with the inner conductive material, and formed to protrude from a male connection member. The method includes preparing insulating members used for the female connection member and the male connection member, and forming the inner conductive material and the column by patterning a conductive material on each of the insulating member using a photolithography process.Type: ApplicationFiled: March 20, 2015Publication date: January 11, 2018Inventors: Yeong Uk SEO, Yeong Joo MOON, Chong Kwang YOON, Young Soo KIM
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Patent number: 9642246Abstract: A printed circuit board includes: a core insulating layer including a glass fiber; a first insulating layer on an upper portion or a lower portion of the core insulating layer, the first insulating layer including a first circuit pattern groove; a first circuit pattern filling the first circuit pattern groove of the first insulating layer; a second insulating layer covering the first circuit pattern and including a second circuit pattern groove at a top surface thereof; and a second circuit pattern filling the second circuit pattern groove of the second insulating layer, wherein the first insulating layer includes a resin material and a filler distributed in the resin material. Accordingly, a total thickness of the PCB can be thinly formed while maintaining the stiffness by separately forming a thin insulating layer without a glass fiber for the buried pattern on the core insulating layer.Type: GrantFiled: March 14, 2013Date of Patent: May 2, 2017Assignee: LG INNOTEK CO., LTD.Inventors: Myoung Hwa Nam, Byeong Ho Kim, Yeong Uk Seo, Hyun Seok Seo, Chang Woo Yoo, Sang Myung Lee
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Patent number: 9585258Abstract: Provided is a method of manufacturing a printed circuit board, the method including: preparing an insulating substrate including a resin material in which a solid component is impregnated; forming a circuit pattern groove on the resin material by etching an upper surface of the insulating substrate; forming a plated layer in which the circuit pattern groove is buried; and forming a buried circuit pattern by removing the plated layer until the insulating layer is exposed, wherein the solid component has a diameter of less than 5% to a width of the buried circuit pattern. Thus, as a filler of a predetermined size or less is applied into the insulating layer for forming the circuit pattern, the occurrence of a void due to separation of the filler from a boundary part with the circuit pattern can be reduced, and reliability can be also secured.Type: GrantFiled: December 12, 2012Date of Patent: February 28, 2017Assignee: LG INNOTEK CO., LTD.Inventors: Yeong Uk Seo, Ki Do Chun, Chang Woo Yoo, Hyun Seok Seo, Byeong Ho Kim, Sang Myung Lee
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Patent number: 9549465Abstract: Provided are a printed circuit board and a method of manufacturing the same, the printed circuit board according to the present invention, the printed circuit board, including: an insulating substrate having a plurality of circuit pattern grooves formed on a surface thereof; and a plurality of circuit patterns formed by burying the circuit pattern grooves, wherein the circuit patterns protrude as much as a predetermined thickness from an upper surface of the insulating substrate.Type: GrantFiled: December 12, 2012Date of Patent: January 17, 2017Assignee: LG INNOTEK CO., LTD.Inventors: Chang Woo Yoo, Yeong Uk Seo, Byeong Ho Kim, Hyun Seok Seo, Sang Myung Lee, Ki Do Chun
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Patent number: 9532462Abstract: The present invention provides a structure of a printed circuit board and a manufacturing method thereof. The method includes: (a) forming a circuit pattern on an insulating layer in which a seed layer is formed; (b) embedding the circuit pattern into the insulating layer by a press method; and (c) removing the seed layer. According to the present invention, a fine pattern may be formed without occurring alignment problem by forming a circuit pattern directly on an insulating layer and reliability of the formed fine pattern may be increased by performing a process of embedding protruded circuits into the insulating layer. In addition, possibility of inferior circuit occurring due to ion migration between adjacent circuits may be reduced by performing over-etching a circuit layer to be lower than a surface of the insulating layer during the etching process of removing a seed layer.Type: GrantFiled: November 25, 2010Date of Patent: December 27, 2016Assignee: LG INNOTEK CO., LTD.Inventors: Yeong Uk Seo, Sung Woon Yoon, Jin Su Kim, Myoung Hwa Nam, Sang Myung Lee, Chi Hee Ahn
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Patent number: 9491866Abstract: Provided is a method for manufacturing a printed circuit board. The method for manufacturing a printed circuit board includes preparing an insulation board, irradiating a laser onto a graytone mask to each a surface of the insulation board, thereby forming a circuit pattern groove and a via hole at the same time, and filling the circuit pattern groove and the via hole to form a buried circuit pattern and the via. Thus, the circuit pattern groove and the via hole may be formed using the graytone mask at the same time without perfolining a separate process for forming the via hole. Therefore, the manufacturing process may be simplified to reduce the manufacturing costs.Type: GrantFiled: July 7, 2011Date of Patent: November 8, 2016Assignee: LG INNOTEK CO., LTD.Inventors: Sang Myung Lee, Byeong Ho Kim, Jin Su Kim, Myoung Hwa Nam, Yeong Uk Seo, Sung Woon Yoon
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Patent number: 9433107Abstract: Provided is a printed circuit board, including a plurality of buried circuit patterns which are formed in an active area; and a plurality of buried dummy patterns which are uniformly formed in a dummy area except the active area. Thus, since when the circuit patterns are formed, the dummy patterns are also uniformly formed, a difference in plating can be reduced. Also, since the dummy patterns are uniformly formed in the dummy area, a difference in grinding between the dummy area and the active area can be reduced, thereby enabling the circuit patterns to be formed in the active area without the occurrence of over-grinding.Type: GrantFiled: December 12, 2012Date of Patent: August 30, 2016Assignee: LG INNOTEK CO., LTD.Inventors: Hyun Seok Seo, Ki Do Chun, Sang Myung Lee, Yeong Uk Seo, Chang Woo Yoo, Byeong Ho Kim
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Patent number: 9265161Abstract: An embedded PCB, a multi-layer PCB using the embedded PCB, and a method of manufacturing the same are provided. The method of manufacturing an embedded PCB includes a first step of patterning an insulating layer on which a photoresist layer is formed using a laser such that parts of the insulating layer are selectively etched to form a circuit pattern region and a second step of filling the circuit pattern region with a plating material to form a circuit pattern. Accordingly, the method of manufacturing an embedded PCB can simultaneously or sequentially etch a photoresist layer and an insulating layer using a laser to form a circuit pattern so as to obtain a micro pattern and simplify a manufacturing process and achieve alignment accuracy in construction of a multi-layer PCB using the embedded PCB to thereby improve product reliability and yield.Type: GrantFiled: November 30, 2010Date of Patent: February 16, 2016Assignee: LG INNOTEK CO., LTD.Inventors: Chi Hee Ahn, Sang Myung Lee, Yeong Uk Seo, Jin Su Kim, Sung Woon Yoon, Myoung Hwa Nam
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Publication number: 20150257262Abstract: A printed circuit board includes a core insulating layer including an isotropic resin, a first circuit pattern filled in a circuit pattern groove at an upper portion or a lower portion of the core insulating layer, a first insulating layer provided in a top surface thereof with a circuit pattern groove and covering the first circuit pattern, and a second circuit pattern to fill the circuit pattern groove of the first insulating layer. A material, such as polyimide, having an isotropic structure is employed for the core insulating layer, thereby preventing the substrate from being bent without glass fiber. Since the glass fiber is not included, the buried pattern is formed at the upper portion or the lower portion of the core insulating layer, so that the thin substrate is fabricated.Type: ApplicationFiled: October 4, 2013Publication date: September 10, 2015Inventors: Sang Myung Lee, Byeong Ho Kim, Jae Seok Park, Yeong Uk Seo, Hyun Seok Seo, Chang Woo Yoo, Kyu Won Lee
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Publication number: 20150041184Abstract: A printed circuit board includes: a core insulating layer including a glass fiber; a first insulating layer on an upper portion or a lower portion of the core insulating layer, the first insulating layer including a first circuit pattern groove; a first circuit pattern filling the first circuit pattern groove of the first insulating layer; a second insulating layer covering the first circuit pattern and including a second circuit pattern groove at a top surface thereof; and a second circuit pattern filling the second circuit pattern groove of the second insulating layer, wherein the first insulating layer includes a resin material and a filler distributed in the resin material. Accordingly, a total thickness of the PCB can be thinly formed while maintaining the stiffness by separately forming a thin insulating layer without a glass fiber for the buried pattern on the core insulating layer.Type: ApplicationFiled: March 14, 2013Publication date: February 12, 2015Inventors: Myoung Hwa Nam, Byeong Ho Kim, Yeong Uk Seo, Hyun Seok Seo, Chang Woo Yoo, Sang Myung Lee
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Publication number: 20140360761Abstract: Provided is a printed circuit board, including a plurality of buried circuit patterns which are formed in an active area; and a plurality of buried dummy patterns which are uniformly formed in a dummy area except the active area. Thus, since when the circuit patterns are formed, the dummy patterns are also uniformly formed, a difference in plating can be reduced. Also, since the dummy patterns are uniformly formed in the dummy area, a difference in grinding between the dummy area and the active area can be reduced, thereby enabling the circuit patterns to be formed in the active area without the occurrence of over-grinding.Type: ApplicationFiled: December 12, 2012Publication date: December 11, 2014Inventors: Hyun Seok Seo, Ki Do Chun, Sang Myung Lee, Yeong Uk Seo, Chang Woo Yoo, Byeong Ho Kim
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Publication number: 20140345913Abstract: Provided is a method of manufacturing a printed circuit board, the method including: preparing an insulating substrate including a resin material in which a solid component is impregnated; forming a circuit pattern groove on the resin material by etching an upper surface of the insulating substrate; forming a plated layer in which the circuit pattern groove is buried; and forming a buried circuit pattern by removing the plated layer until the insulating layer is exposed, wherein the solid component has a diameter of less than 5% to a width of the buried circuit pattern. Thus, as a filler of a predetermined size or less is applied into the insulating layer for forming the circuit pattern, the occurrence of a void due to separation of the filler from a boundary part with the circuit pattern can be reduced, and reliability can be also secured.Type: ApplicationFiled: December 12, 2012Publication date: November 27, 2014Inventors: Yeong Uk Seo, Ki Do Chun, Chang Woo Yoo, Hyun Seok Seo, Byeong Ho Kim, Sang Myung Lee
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Publication number: 20140332255Abstract: Provided are a printed circuit board and a method of manufacturing the same, the printed circuit board according to the present invention, the printed circuit board, including: an insulating substrate having a plurality of circuit pattern grooves formed on a surface thereof; and a plurality of circuit patterns formed by burying the circuit pattern grooves, wherein the circuit patterns protrude as much as a predetermined thickness from an upper surface of the insulating substrate.Type: ApplicationFiled: December 12, 2012Publication date: November 13, 2014Inventors: Chang Woo Yoo, Yeong Uk Seo, Byeong Ho Kim, Hyun Seok Seo, Sang Myung Lee, Ki Do Chun
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Patent number: 8659131Abstract: The present invention relates to structure and manufacture method for multi-row lead frame and semiconductor package, the method characterized by forming a pad portion on a metal material (first step); performing a surface plating process or organic material coating following the first pattern formation (second step); forming a second pattern on the metal material (third step); and packaging a semiconductor chip following the second pattern formation (fourth step), whereby an under-cut phenomenon is minimized by applying a gradual etching.Type: GrantFiled: September 25, 2009Date of Patent: February 25, 2014Assignee: LG Innotek Co., Ltd.Inventors: Ji Yun Kim, Hyun Sub Shin, Sung Won Lee, Hyung Eui Lee, Yeong Uk Seo, Sung Wuk Ryu, Hyuk Soo Lee
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Publication number: 20130192881Abstract: Provided is a method for manufacturing a printed circuit board. The method for manufacturing a printed circuit board includes preparing an insulation board, irradiating a laser onto a graytone mask to each a surface of the insulation board, thereby forming a circuit pattern groove and a via hole at the same time, and filling the circuit pattern groove and the via hole to form a buried circuit pattern and the via. Thus, the circuit pattern groove and the via hole may be formed using the graytone mask at the same time without performing a separate process for forming the via hole. Therefore, the manufacturing process may be simplified to reduce the manufacturing costs.Type: ApplicationFiled: July 7, 2011Publication date: August 1, 2013Applicant: LG INNOTEK CO., LTD.Inventors: Sang Myung Lee, Byeong Ho Kim, Jin Su Kim, Myoung Hwa Nam, Yeong Uk Seo, Sung Woon Yoon
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Publication number: 20130112463Abstract: The present invention provides a structure of a printed circuit board and a manufacturing method thereof. The method includes: (a) forming a circuit pattern on an insulating layer in which a seed layer is formed; (b) embedding the circuit pattern into the insulating layer by a press method; and (c) removing the seed layer. According to the present invention, a fine pattern may be formed without occurring alignment problem by forming a circuit pattern directly on an insulating layer and reliability of the formed fine pattern may be increased by performing a process of embedding protruded circuits into the insulating layer. In addition, possibility of inferior circuit occurring due to ion migration between adjacent circuits may be reduced by performing over-etching a circuit layer to be lower than a surface of the insulating layer during the etching process of removing a seed layer.Type: ApplicationFiled: November 25, 2010Publication date: May 9, 2013Applicant: LG Innotek Co., Ltd.Inventors: Yeong Uk Seo, Sung Woon Yoon, Jin Su Kim, Myoung Hwa Nam, Sang Myung Lee, Chi Hee Ahn
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Publication number: 20130062106Abstract: A structure of a printed circuit board and a method of manufacturing the same are provided. The manufacturing method includes a first step of forming at least one connecting bump on first circuit patterns and forming a first insulating layer to form an inner circuit board, a second step of processing a second insulating layer with a metal seed layer formed thereon using a mold to form second circuit patterns so as to construct an outer circuit board, and a third step of aligning the inner circuit board and the outer circuit board with each other and laminating the inner circuit board and the outer circuit board. Accordingly, a structure of a high-density high-reliability printed circuit board having a circuit embedded in an insulating layer can be provided. A seed layer forming process for forming an outmost circuit can be removed by using an insulating layer combined with a seed layer.Type: ApplicationFiled: November 26, 2010Publication date: March 14, 2013Applicant: LG Innotek Co., Ltd.Inventors: Jin Su Kim, Duk Nam Kim, Jae Hyun Ahn, Sang Myung Lee, Yeong Uk Seo, Chi Hee Ahn, Sung Woon Yoon, Myoung Hwa Nam
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Publication number: 20120255764Abstract: An embedded printed circuit board and a manufacturing method thereof are provided. The manufacturing method includes a first step of forming a first insulating layer having a seed layer formed on one side thereof and at least. one metal pattern embedded therein and a second step of laminating the first insulating layer and a base substrate with an inner circuit having a second insulating layer interposed between the first insulating layer and the base substrate. Accordingly, a printed circuit board with a circuit embedded in an insulating layer is provided, and thus a high-density and high-reliability printed circuit board can be achieved. Furthermore, since the printed circuit board is manufactured using a mold, a circuit manufacturing process for embedding, a process for forming a seed layer and a complicated process such as surface grinding are omitted so as to simplify the manufacturing process.Type: ApplicationFiled: August 5, 2010Publication date: October 11, 2012Applicant: LG INNOTEK CO., LTD.Inventors: Jin Su Kim, Myoung Hwa Nam, Yeong Uk Seo, Chi Hee Ahn