Patents by Inventor Yeong-yan Guu
Yeong-yan Guu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11221351Abstract: A probe card device includes a probe head including a plurality of pins, wherein each of the pins includes a body, a first metal layer formed on the body, and a second metal layer covering the first metal layer; a multi-layered flexible board electrically connected to the pins; a support plate, the multi-layered flexible board disposed on a first surface of the support plate; and a circuit board electrically connected to the multi-layered flexible board.Type: GrantFiled: July 11, 2019Date of Patent: January 11, 2022Assignee: PRINCO CORP.Inventors: Chih-kuang Yang, Yeong-yan Guu, Chun-hsiung Chou
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Publication number: 20200103441Abstract: A probe card device includes a probe head including a plurality of pins, wherein each of the pins includes a body, a first metal layer formed on the body, and a second metal layer covering the first metal layer; a multi-layered flexible board electrically connected to the pins; a support plate, the multi-layered flexible board disposed on a first surface of the support plate; and a circuit board electrically connected to the multi-layered flexible board.Type: ApplicationFiled: July 11, 2019Publication date: April 2, 2020Inventors: CHIH-KUANG YANG, YEONG-YAN GUU, CHUN-HSIUNG CHOU
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Patent number: 10451654Abstract: A probe card device includes a plurality of pins; a thin film substrate including a plurality of first thin film connecting points and a plurality of second thin film connecting points, wherein at least one of the first thin film connecting points is electrically connected to at least one the second thin film connecting points, and a pitch of any two adjacent ones of the first film connecting points is less than a pitch of any two adjacent ones of the second film connecting points; and a circuit board including a plurality of first circuit board connecting points, wherein at least one of the second thin film connecting points is electrically connected to at least one of the first circuit board connecting points. The probe card device can enhance a layout function and a support function at the same time.Type: GrantFiled: May 26, 2017Date of Patent: October 22, 2019Assignees: PRINCO CORP., TEK CROWN TECHNOLOGY CO., LTD.Inventors: Chih-kuang Yang, Yeong-yan Guu, Mou-I Lee
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Publication number: 20170343582Abstract: A probe card device includes a plurality of pins; a thin film substrate including a plurality of first thin film connecting points and a plurality of second thin film connecting points, wherein at least one of the first thin film connecting points is electrically connected to at least one the second thin film connecting points, and a pitch of any two adjacent ones of the first film connecting points is less than a pitch of any two adjacent ones of the second film connecting points; and a circuit board including a plurality of first circuit board connecting points, wherein at least one of the second thin film connecting points is electrically connected to at least one of the first circuit board connecting points. The probe card device can enhance a layout function and a support function at the same time.Type: ApplicationFiled: May 26, 2017Publication date: November 30, 2017Inventors: Chih-kuang YANG, Yeong-yan GUU, MOU-I LEE
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Patent number: 9379089Abstract: Disclosed is a core module, comprising: a package substrate, having a plurality of pads; a first component, connected to the pads of the package substrate corresponding to the first component with a plurality of first joint parts; a second component, connected to the pads of the package substrate corresponding to the first component with a plurality of second joint parts; and a third component, connected to the pads of the package substrate corresponding to the third component with a plurality of third joint parts, wherein the first component is positioned above the second component relative to the lower package substrate, and the first component, the second component and the third component are all electrically connected via the package substrate, and a main molding material is molding the first component, the second component and the third component.Type: GrantFiled: January 23, 2014Date of Patent: June 28, 2016Assignee: PRINCO MIDDLE EAST FZEInventors: Chih-kuang Yang, Cheng-yi Chang, Yeong-yan Guu, Gan-how Shaue
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Patent number: 9256209Abstract: The present invention provides a wristwatch structure, an electronic core for a wristwatch, and a method for manufacturing the wristwatch. The wristwatch structure comprises: a dial; an indicator designed with the dial; an electric driving component connected to the indicator, for driving the indicator and actuating it; and an electronic core having an integrated circuit unit packaged therein, the electronic core also having a plurality of two-dimensional joints distributed on an external surface thereof, wherein the electric driving component is electrically connected to the integrated circuit unit of the electronic core via one set of joints among the two-dimensional joints. The present invention can improve compatibility for various designs, thereby shortening the product development cycle.Type: GrantFiled: February 24, 2014Date of Patent: February 9, 2016Assignee: PRINCO MIDDLE EAST FZEInventors: Chih-Kuang Yang, Yeong-yan Guu, Cheng-yi Chang, Gan-how Shaue
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Patent number: 9223296Abstract: The present invention provides a wristwatch structure, an electronic crown for wristwatch, and a wristwatch having a display. The wristwatch structure comprises an electric driving component; an electronic core having a plurality of two-dimensional joints; and an electronic crown comprising a rotating portion and a fixed detecting portion, the detecting portion detecting electronic signals according to a rotation of the rotating portion; wherein the detecting portion of the electronic crown exports the electronic signals to the electronic core via one of the joints, and the electric driving component is electrically connected to one set of joints among the two-dimensional joints. The present invention can improve compatibility for various designs, thereby shortening product development cycle. Also, the present invention is suitable for developing a product with appearance similar to a mechanical watch.Type: GrantFiled: February 24, 2014Date of Patent: December 29, 2015Assignee: PRINCO MIDDLE EAST FZEInventors: Chih-kuang Yang, Yeong-yan Guu, Cheng-yi Chang, Gan-how Shaue
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Publication number: 20140328147Abstract: The present invention provides a wristwatch structure, an electronic crown for wristwatch, and a wristwatch having a display. The wristwatch structure comprises an electric driving component; an electronic core having a plurality of two-dimensional joints; and an electronic crown comprising a rotating portion and a fixed detecting portion, the detecting portion detecting electronic signals according to a rotation of the rotating portion; wherein the detecting portion of the electronic crown exports the electronic signals to the electronic core via one of the joints, and the electric driving component is electrically connected to one set of joints among the two-dimensional joints. The present invention can improve compatibility for various designs, thereby shortening product development cycle. Also, the present invention is suitable for developing a product with appearance similar to a mechanical watch.Type: ApplicationFiled: February 24, 2014Publication date: November 6, 2014Applicant: Princo Middle East FZEInventors: Chih-kuang YANG, Yeong-yan GUU, Cheng-yi CHANG, Gan-how SHAUE
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Publication number: 20140328148Abstract: The present invention provides a wristwatch structure, an electronic core for a wristwatch, and a method for manufacturing the wristwatch. The wristwatch structure comprises: a dial; an indicator designed with the dial; an electric driving component connected to the indicator, for driving the indicator and actuating it; and an electronic core having an integrated circuit unit packaged therein, the electronic core also having a plurality of two-dimensional joints distributed on an external surface thereof, wherein the electric driving component is electrically connected to the integrated circuit unit of the electronic core via one set of joints among the two-dimensional joints. The present invention can improve compatibility for various designs, thereby shortening the product development cycle.Type: ApplicationFiled: February 24, 2014Publication date: November 6, 2014Applicant: Princo Middle East FZEInventors: Chih-Kuang YANG, Yeong-yan GUU, Cheng-yi CHANG, Gan-how SHAUE
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Publication number: 20140312490Abstract: Disclosed is a core module, comprising: a package substrate, having a plurality of pads; a first component, connected to the pads of the package substrate corresponding to the first component with a plurality of first joint parts; a second component, connected to the pads of the package substrate corresponding to the first component with a plurality of second joint parts; and a third component, connected to the pads of the package substrate corresponding to the third component with a plurality of third joint parts, wherein the first component is positioned above the second component relative to the lower package substrate, and the first component, the second component and the third component are all electrically connected via the package substrate, and a main molding material is molding the first component, the second component and the third component.Type: ApplicationFiled: January 23, 2014Publication date: October 23, 2014Applicant: Princo Middle East FZEInventors: Chih-kuang YANG, Cheng-yi CHANG, Yeong-yan GUU, Gan-how SHAUE
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Publication number: 20140167255Abstract: Disclosed are a package structure and a package method. The package structure comprises an IC bare die, having bare die pads formed on a surface; a flexible packaging substrate, having first pads formed on a first surface and second pads formed on a second surface; and a plurality of bumps, previously formed on the first surface of the flexible packaging substrate. The bumps have different heights, and correspond to the first pads and contact the bare die pads respectively. Pressing or heating is implemented to package the IC bare die. The package structure further comprises a printed circuit board, having a plurality of contact pads. The second pads of the flexible packaging substrate respectively contact with the contact pads via solders. Connection is implemented by pressing or heating. Extremely low stress is generated to the packaging substrate and the printed circuit board.Type: ApplicationFiled: November 13, 2013Publication date: June 19, 2014Applicant: PRINCO MIDDLE EAST FZEInventors: Gan-how SHAUE, Chih-kuang YANG, Yeong-yan GUU
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Publication number: 20140162382Abstract: Disclosed is a package method for electronic components by a thin substrate, including: providing a carrier; forming at least one metal layer and at least one dielectric layer on the carrier for manufacturing the thin substrate, and the thin substrate including at least one package unit for connecting at least one chip; forming at least one pad layer on a surface of the thin substrate; parting the thin substrate from the carrier; performing test to the thin substrate to weed out the package unit with defects in the at least one package unit and select the package units for connecting the chips; connecting the chips with the selected package units by flip chip bonding respectively. Accordingly, the yield of the entire package process can be improved and the pointless manufacture material cost can be reduced.Type: ApplicationFiled: February 17, 2014Publication date: June 12, 2014Applicant: Princo Middle East FZEInventors: Yeong-yan Guu, Ying-jer SHIH
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Patent number: 8658437Abstract: Disclosed is a package method for electronic components by a thin substrate, comprising: providing a carrier; forming at least one metal layer and at least one dielectric layer on the carrier for manufacturing the thin substrate, and the thin substrate comprises at least one package unit for connecting at least one chip; forming at least one pad layer on a surface of the thin substrate; parting the thin substrate from the carrier; performing test to the thin substrate to weed out the package unit with defects in the at least one package unit and select the package units for connecting the chips; connecting the chips with the selected package units by flip chip bonding respectively. Accordingly, the yield of the entire package process can be improved and the pointless manufacture material cost can be reduced.Type: GrantFiled: November 1, 2012Date of Patent: February 25, 2014Assignee: Princo Middle East FZEInventors: Yeong-yan Guu, Ying-jer Shih
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Patent number: 8501502Abstract: Disclosed is a package method for electronic components by a thin substrate, comprising: providing a carrier; forming at least one metal layer and at least one dielectric layer on the carrier for manufacturing the thin substrate, and the thin substrate comprises at least one package unit for connecting at least one chip; forming at least one pad layer on a surface of the thin substrate; parting the thin substrate from the carrier; performing test to the thin substrate to weed out the package unit with defects in the at least one package unit and select the package units for connecting the chips; connecting the chips with the selected package units by flip chip bonding respectively. Accordingly, the yield of the entire package process can be improved and the pointless manufacture material cost can be reduced.Type: GrantFiled: November 1, 2012Date of Patent: August 6, 2013Assignee: Princo Middle East FZEInventors: Yeong-yan Guu, Ying-jer Shih