Patents by Inventor Yeong-yan Guu

Yeong-yan Guu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170343582
    Abstract: A probe card device includes a plurality of pins; a thin film substrate including a plurality of first thin film connecting points and a plurality of second thin film connecting points, wherein at least one of the first thin film connecting points is electrically connected to at least one the second thin film connecting points, and a pitch of any two adjacent ones of the first film connecting points is less than a pitch of any two adjacent ones of the second film connecting points; and a circuit board including a plurality of first circuit board connecting points, wherein at least one of the second thin film connecting points is electrically connected to at least one of the first circuit board connecting points. The probe card device can enhance a layout function and a support function at the same time.
    Type: Application
    Filed: May 26, 2017
    Publication date: November 30, 2017
    Inventors: Chih-kuang YANG, Yeong-yan GUU, MOU-I LEE
  • Patent number: 9379089
    Abstract: Disclosed is a core module, comprising: a package substrate, having a plurality of pads; a first component, connected to the pads of the package substrate corresponding to the first component with a plurality of first joint parts; a second component, connected to the pads of the package substrate corresponding to the first component with a plurality of second joint parts; and a third component, connected to the pads of the package substrate corresponding to the third component with a plurality of third joint parts, wherein the first component is positioned above the second component relative to the lower package substrate, and the first component, the second component and the third component are all electrically connected via the package substrate, and a main molding material is molding the first component, the second component and the third component.
    Type: Grant
    Filed: January 23, 2014
    Date of Patent: June 28, 2016
    Assignee: PRINCO MIDDLE EAST FZE
    Inventors: Chih-kuang Yang, Cheng-yi Chang, Yeong-yan Guu, Gan-how Shaue
  • Patent number: 9256209
    Abstract: The present invention provides a wristwatch structure, an electronic core for a wristwatch, and a method for manufacturing the wristwatch. The wristwatch structure comprises: a dial; an indicator designed with the dial; an electric driving component connected to the indicator, for driving the indicator and actuating it; and an electronic core having an integrated circuit unit packaged therein, the electronic core also having a plurality of two-dimensional joints distributed on an external surface thereof, wherein the electric driving component is electrically connected to the integrated circuit unit of the electronic core via one set of joints among the two-dimensional joints. The present invention can improve compatibility for various designs, thereby shortening the product development cycle.
    Type: Grant
    Filed: February 24, 2014
    Date of Patent: February 9, 2016
    Assignee: PRINCO MIDDLE EAST FZE
    Inventors: Chih-Kuang Yang, Yeong-yan Guu, Cheng-yi Chang, Gan-how Shaue
  • Patent number: 9223296
    Abstract: The present invention provides a wristwatch structure, an electronic crown for wristwatch, and a wristwatch having a display. The wristwatch structure comprises an electric driving component; an electronic core having a plurality of two-dimensional joints; and an electronic crown comprising a rotating portion and a fixed detecting portion, the detecting portion detecting electronic signals according to a rotation of the rotating portion; wherein the detecting portion of the electronic crown exports the electronic signals to the electronic core via one of the joints, and the electric driving component is electrically connected to one set of joints among the two-dimensional joints. The present invention can improve compatibility for various designs, thereby shortening product development cycle. Also, the present invention is suitable for developing a product with appearance similar to a mechanical watch.
    Type: Grant
    Filed: February 24, 2014
    Date of Patent: December 29, 2015
    Assignee: PRINCO MIDDLE EAST FZE
    Inventors: Chih-kuang Yang, Yeong-yan Guu, Cheng-yi Chang, Gan-how Shaue
  • Publication number: 20140328147
    Abstract: The present invention provides a wristwatch structure, an electronic crown for wristwatch, and a wristwatch having a display. The wristwatch structure comprises an electric driving component; an electronic core having a plurality of two-dimensional joints; and an electronic crown comprising a rotating portion and a fixed detecting portion, the detecting portion detecting electronic signals according to a rotation of the rotating portion; wherein the detecting portion of the electronic crown exports the electronic signals to the electronic core via one of the joints, and the electric driving component is electrically connected to one set of joints among the two-dimensional joints. The present invention can improve compatibility for various designs, thereby shortening product development cycle. Also, the present invention is suitable for developing a product with appearance similar to a mechanical watch.
    Type: Application
    Filed: February 24, 2014
    Publication date: November 6, 2014
    Applicant: Princo Middle East FZE
    Inventors: Chih-kuang YANG, Yeong-yan GUU, Cheng-yi CHANG, Gan-how SHAUE
  • Publication number: 20140328148
    Abstract: The present invention provides a wristwatch structure, an electronic core for a wristwatch, and a method for manufacturing the wristwatch. The wristwatch structure comprises: a dial; an indicator designed with the dial; an electric driving component connected to the indicator, for driving the indicator and actuating it; and an electronic core having an integrated circuit unit packaged therein, the electronic core also having a plurality of two-dimensional joints distributed on an external surface thereof, wherein the electric driving component is electrically connected to the integrated circuit unit of the electronic core via one set of joints among the two-dimensional joints. The present invention can improve compatibility for various designs, thereby shortening the product development cycle.
    Type: Application
    Filed: February 24, 2014
    Publication date: November 6, 2014
    Applicant: Princo Middle East FZE
    Inventors: Chih-Kuang YANG, Yeong-yan GUU, Cheng-yi CHANG, Gan-how SHAUE
  • Publication number: 20140312490
    Abstract: Disclosed is a core module, comprising: a package substrate, having a plurality of pads; a first component, connected to the pads of the package substrate corresponding to the first component with a plurality of first joint parts; a second component, connected to the pads of the package substrate corresponding to the first component with a plurality of second joint parts; and a third component, connected to the pads of the package substrate corresponding to the third component with a plurality of third joint parts, wherein the first component is positioned above the second component relative to the lower package substrate, and the first component, the second component and the third component are all electrically connected via the package substrate, and a main molding material is molding the first component, the second component and the third component.
    Type: Application
    Filed: January 23, 2014
    Publication date: October 23, 2014
    Applicant: Princo Middle East FZE
    Inventors: Chih-kuang YANG, Cheng-yi CHANG, Yeong-yan GUU, Gan-how SHAUE
  • Publication number: 20140167255
    Abstract: Disclosed are a package structure and a package method. The package structure comprises an IC bare die, having bare die pads formed on a surface; a flexible packaging substrate, having first pads formed on a first surface and second pads formed on a second surface; and a plurality of bumps, previously formed on the first surface of the flexible packaging substrate. The bumps have different heights, and correspond to the first pads and contact the bare die pads respectively. Pressing or heating is implemented to package the IC bare die. The package structure further comprises a printed circuit board, having a plurality of contact pads. The second pads of the flexible packaging substrate respectively contact with the contact pads via solders. Connection is implemented by pressing or heating. Extremely low stress is generated to the packaging substrate and the printed circuit board.
    Type: Application
    Filed: November 13, 2013
    Publication date: June 19, 2014
    Applicant: PRINCO MIDDLE EAST FZE
    Inventors: Gan-how SHAUE, Chih-kuang YANG, Yeong-yan GUU
  • Publication number: 20140162382
    Abstract: Disclosed is a package method for electronic components by a thin substrate, including: providing a carrier; forming at least one metal layer and at least one dielectric layer on the carrier for manufacturing the thin substrate, and the thin substrate including at least one package unit for connecting at least one chip; forming at least one pad layer on a surface of the thin substrate; parting the thin substrate from the carrier; performing test to the thin substrate to weed out the package unit with defects in the at least one package unit and select the package units for connecting the chips; connecting the chips with the selected package units by flip chip bonding respectively. Accordingly, the yield of the entire package process can be improved and the pointless manufacture material cost can be reduced.
    Type: Application
    Filed: February 17, 2014
    Publication date: June 12, 2014
    Applicant: Princo Middle East FZE
    Inventors: Yeong-yan Guu, Ying-jer SHIH
  • Patent number: 8658437
    Abstract: Disclosed is a package method for electronic components by a thin substrate, comprising: providing a carrier; forming at least one metal layer and at least one dielectric layer on the carrier for manufacturing the thin substrate, and the thin substrate comprises at least one package unit for connecting at least one chip; forming at least one pad layer on a surface of the thin substrate; parting the thin substrate from the carrier; performing test to the thin substrate to weed out the package unit with defects in the at least one package unit and select the package units for connecting the chips; connecting the chips with the selected package units by flip chip bonding respectively. Accordingly, the yield of the entire package process can be improved and the pointless manufacture material cost can be reduced.
    Type: Grant
    Filed: November 1, 2012
    Date of Patent: February 25, 2014
    Assignee: Princo Middle East FZE
    Inventors: Yeong-yan Guu, Ying-jer Shih
  • Patent number: 8501502
    Abstract: Disclosed is a package method for electronic components by a thin substrate, comprising: providing a carrier; forming at least one metal layer and at least one dielectric layer on the carrier for manufacturing the thin substrate, and the thin substrate comprises at least one package unit for connecting at least one chip; forming at least one pad layer on a surface of the thin substrate; parting the thin substrate from the carrier; performing test to the thin substrate to weed out the package unit with defects in the at least one package unit and select the package units for connecting the chips; connecting the chips with the selected package units by flip chip bonding respectively. Accordingly, the yield of the entire package process can be improved and the pointless manufacture material cost can be reduced.
    Type: Grant
    Filed: November 1, 2012
    Date of Patent: August 6, 2013
    Assignee: Princo Middle East FZE
    Inventors: Yeong-yan Guu, Ying-jer Shih