Abstract: A method of manufacturing an encapsulation film, the method including preparing a solventless type encapsulation composition by mixing an encapsulation resin and a moisture adsorbent in a single step; and preparing an encapsulation layer by extruding the encapsulation composition at a temperature of 90° C. or more, a method of manufacturing an organic electronic device manufacturing method using same, and provides a method of manufacturing an encapsulation film having a structure capable of blocking moisture or oxygen flowing into an organic electronic device from the outside, and enabling long-term reliability of the organic electronic device to be ensured.

Abstract: An encapsulation film, a manufacturing method therefor, an organic electronic device comprising same, and a method for manufacturing an organic electronic device by using same, which provides an encapsulation film that has a structure capable of blocking moisture or oxygen flowing into an organic electronic device from the outside, and long-term reliability of the organic electronic device can be ensured. The encapsulation film includes an encapsulation layer that is a cured product of an encapsulation composition, wherein the encapsulation composition includes an encapsulation resin and a moisture adsorbent, and the encapsulation layer is a single layer and includes a first region, a second region, and a third region in which the concentrations of the moisture adsorbent are different according to the thickness direction.

Abstract: Provided is an apparatus and method for a centralized ultra-precision network control framework controlling heterogeneous multiple network domains to provide a large-scale end-to-end ultra-precision service in a communication system. A method of operating a network domain controller in a communication system includes: receiving node information, link information, adjacent node information, and adjacent node link information from a network node control agent; identifying controller topology information based on the node information, the link information, the adjacent node information, and the adjacent node link information; and transmitting boundary node information, boundary node link information, adjacent domain node information, and adjacent domain node link information to a network orchestrator.

Abstract: A superconductor magnetic field effect transistor. The superconductor magnetic field effect transistor may include a sheet of a superconducting material; and a solenoid. The sheet may be substantially flat, and the solenoid may include a plurality of turns, each of the turns being substantially parallel to the sheet. The superconducting material may be a type-II superconducting material.

Abstract: A memory system includes: a memory; and a memory controller suitable for issuing a command to the memory and performing a power throttling operation based on a number of read commands and a number of write commands that are issued to the memory for a predetermined time, and ratios of ‘1’ and ‘0’ of write data.

Abstract: A semiconductor package includes a package substrate having a hole pattern including a first through hole extending in a first direction and a second through hole extending in a second direction substantially perpendicular to the first direction, at least one first semiconductor chip disposed on the package substrate to overlap with the first through hole, at least one second semiconductor chip disposed on the package substrate to overlap with the second through hole, first bonding wires passing through the first through hole to electrically connect the at least one first semiconductor chip to the package substrate, and second bonding wires passing through the second through hole to electrically connect the at least one second semiconductor chip to the package substrate.

Abstract: A package substrate of a semiconductor package includes second and third pad bonding portions respectively located at both sides of a first pad bonding portion disposed on a substrate body. First to third via landing portions are disposed to be spaced apart from the first to third pad bonding portions. First and second connection trace portions are disposed to be parallel with each other, and a first guard trace portion is disposed to be substantially parallel with the first connection trace portion. The second connection trace portion is connected to the first guard trace portion through a first connection plane portion, and the first connection plane portion connects the second connection trace portion to the second via landing portion. The third pad bonding portion is connected to the third via landing portion through a second connection plane portion.

Abstract: A semiconductor package includes a package substrate having a hole pattern including a first through hole extending in a first direction and a second through hole extending in a second direction substantially perpendicular to the first direction, at least one first semiconductor chip disposed on the package substrate to overlap with the first through hole, at least one second semiconductor chip disposed on the package substrate to overlap with the second through hole, first bonding wires passing through the first through hole to electrically connect the at least one first semiconductor chip to the package substrate, and second bonding wires passing through the second through hole to electrically connect the at least one second semiconductor chip to the package substrate.

Abstract: A package substrate of a semiconductor package includes second and third pad bonding portions respectively located at both sides of a first pad bonding portion disposed on a substrate body. First to third via landing portions are disposed to be spaced apart from the first to third pad bonding portions. First and second connection trace portions are disposed to be parallel with each other, and a first guard trace portion is disposed to be substantially parallel with the first connection trace portion. The second connection trace portion is connected to the first guard trace portion through a first connection plane portion, and the first connection plane portion connects the second connection trace portion to the second via landing portion. The third pad bonding portion is connected to the third via landing portion through a second connection plane portion.

Abstract: Disclosed is a controller-based fault management apparatus and method. The method according to an embodiment of the present disclosure may include: receiving information on a reason of a fault occurring in a network, generating restoration basis information on the fault on the basis of the information on the fault reason; determining whether or not to report a management system of the fault on the basis of the restoration basis information and filtering information, and generating subject to be reported classification information on whether or not the fault corresponds to a subject to be reported to the management system; and when the fault is determined to correspond to the subject to be reported on the basis of the subject to be reported classification information, transmitting information on a fault reason to the management system subject to be reported classification information.

Abstract: A method for providing a protection switching service in a virtual tenant network (VTN) and a controller are provided. The method enables a real-time protection switching setup on a VTN path in order to provide reliability of a VTN service.

Abstract: Provided is a method and an apparatus for protecting a software defined network (SDN), the apparatus including a controller configured to perform a protection switching on at least one working path in an SDN, and a processor configured to set a first event of performing the protection switching and set a protection path before the first event occurs.

Abstract: The present invention relates to a signal detection system of a touch screen, and more particularly to a signal detection system of a large-sized mutual capacitive multi touch screen that is capable of effectively reducing RC time delay, signal distortion, an effect of noise, parasitic resistance, and parasitic capacitance.

Abstract: A method for providing a protection switching service in a virtual tenant network (VTN) and a controller are provided. The method enables a real-time protection switching setup on a VTN path in order to provide reliability of a VTN service.

Abstract: A software-defined networking (SDN) method. The SDN method according to an exemplary embodiment may be used in managing and operating SDN-based network resources in an optical communications network, a fixed mobile convergence subscriber network, a wired broadband subscriber network, a distributed mobile communications base station network, etc.

Abstract: Provided are a method and an apparatus for performing network failure restoration when a failure occurs in a software-defined networking (SDN) network, the method including detecting a failure by verifying whether a failure occurs in a channel and switching a channel from a first channel to a second channel when a failure occurs and thus, recovering from the failure by switching the channel from the first channel to the second channel.

Abstract: An OpenFlow switch which processes a packet received from the outside is provided. The OpenFlow switch includes: a first table used to process a received packet; a second table used to create the first table; and a packet processor that manages the first table and the second table and controls the processing of the packet.

Abstract: The present invention relates to a signal detection system of a touch screen, and more particularly to a signal detection system of a large-sized mutual capacitive multi touch screen that is capable of effectively reducing RC time delay, signal distortion, an effect of noise, parasitic resistance, and parasitic capacitance.

Abstract: There are provided a packet processing apparatus and method for enabling an interface server connected to an external interface to set up a list of multi-layered protocols for processing a received packet and to control all service servers to distributively process the loads of the multi-layered protocols. The packet processing apparatus includes: an interface server configured to set up, if a packet is received from an external node, an execution order of protocols with respect to the received packet, and to edit the packet such that the packet includes information about the execution order of the protocols; a plurality of service servers configured to process the packet according to the corresponding protocols in the execution order of the protocols; and a switch configured to transfer the packet between the interface server and the plurality of service servers.

Abstract: A burst mode optical repeater is provided. The burst mode optical repeater receives optical signals, which are transmitted from a plurality of optical network units (ONUs) in a passive optical network (PON) to a central office using a time division multiplexing access (TDMA) method, and relays the received optical signals using an optical-electrical-optical (OEO) method. Since the burst mode optical repeater can be installed anywhere between an optical line terminal (OLT) and the ONUs, the number of subscribers and transmission range that can be supported by a corresponding network can be increased.