Abstract: The disclosed hybrid shielding structure may include a printed circuit board (PCB) that is to be overmolded with at least a portion of molding compound. The PCB may include various electronic components disposed thereon. The hybrid shielding structure may also include conductive trenches and conductive fences that are disposed on the PCB. The conductive trenches and the conductive fences may provide an electromagnetic shield for at least a portion of the electronic components of the PCB. The hybrid shielding structure may further include a conformal shielding and a PCB ground flood and ground layers. Various other systems, electronic devices, apparatuses, and methods of manufacturing are also disclosed.

Abstract: A unmanned aerial vehicle can include a modem comprising a first antenna port and a second antenna port, an omnidirectional antenna connected to the first antenna port, and antennas configured to generate a directional transmission pattern connected to the second antenna port, the antennas including (a) an array of omni-directional antennas and (b) multiple directional antennas