Abstract: A semiconductor substrate includes a main surface inclined by a first off-angle greater than 0° from a first direction parallel to a crystal plane, with respect to the crystal plane, in a first radial direction of the main surface, and a notch disposed toward the first direction, at an edge of the main surface in the first radial direction.

Abstract: A semiconductor substrate includes a main surface inclined by a first off-angle greater than 0° from a first direction parallel to a crystal plane, with respect to the crystal plane, in a first radial direction of the main surface, and a notch disposed toward the first direction, at an edge of the main surface in the first radial direction.

Abstract: A semiconductor wafer is provided. The semiconductor wafer includes a wafer body including a first surface and a second surface opposite the first surface; and a bevel portion disposed along an outer circumference of the wafer body and including an inclined surface, an outermost point, a first surface end portion connecting the bevel portion to the first surface and a second surface end portion connecting the bevel portion to the second surface. A first bevel angle between a first tangential direction of the inclined surface and the first surface corresponds to a capillary force of a fluid on the first surface, and a first bevel length between the first surface end portion and the outermost point along a first direction substantially parallel to the first surface corresponds to a first surface flatness.

Abstract: A semiconductor wafer is provided. The semiconductor wafer includes a wafer body including a first surface and a second surface opposite the first surface; and a bevel portion disposed along an outer circumference of the wafer body and including an inclined surface, an outermost point, a first surface end portion connecting the bevel portion to the first surface and a second surface end portion connecting the bevel portion to the second surface. A first bevel angle between a first tangential direction of the inclined surface and the first surface corresponds to a capillary force of a fluid on the first surface, and a first bevel length between the first surface end portion and the outermost point along a first direction substantially parallel to the first surface corresponds to a first surface flatness.

Abstract: A comment data acquisition unit acquires comment data for display over a display image, and a superimposition processing unit 162 generates a superimposition image from the comment data. The comment data includes a scaling factor or information related to the scaling factor, and a display requirement determination unit determines whether the scaling factor of the display image and either a scaling factor or information related to the scaling factor included in comment data are in a predetermined relationship. When the scaling factor of the display image and either the scaling factor or the information related to the scaling factor included in the comment data are in the predetermined relationship, a superimposition image generation unit generates a comment image using display information included in the comment data.

Abstract: A displayed image generation unit enlarges, reduces, or scrolls a displayed image in accordance with a command for change from a user. When a clip command receiving unit receives a clip command, a clipping area identification unit identifies an area to be clipped according to the clip command. A thumbnail image generation unit generates a thumbnail image corresponding to the identified area. A positional information acquisition unit acquires positional information identifying a position of the identified area in an image as a whole. A content ID acquisition unit acquires identification information identifying an image when the clipping command is received. A hard disk drive maps the identification information, the thumbnail image, and the positional information and stores the mapped information.

Abstract: A comment data acquisition unit acquires comment data for display over a display image, and a superimposition processing unit 162 generates a superimposition image from the comment data. The comment data includes a scaling factor or information related to the scaling factor, and a display requirement determination unit determines whether the scaling factor of the display image and either a scaling factor or information related to the scaling factor included in comment data are in a predetermined relationship. When the scaling factor of the display image and either the scaling factor or the information related to the scaling factor included in the comment data are in the predetermined relationship, a superimposition image generation unit generates a comment image using display information included in the comment data.

Abstract: A displayed image generation unit enlarges, reduces, or scrolls a displayed image in accordance with a command for change from a user. When a clip command receiving unit receives a clip command, a clipping area identification unit identifies an area to be clipped according to the clip command. A thumbnail image generation unit generates a thumbnail image corresponding to the identified area. A positional information acquisition unit acquires positional information identifying a position of the identified area in an image as a whole. A content ID acquisition unit acquires identification information identifying an image when the clipping command is received. A hard disk drive maps the identification information, the thumbnail image, and the positional information and stores the mapped information.

Abstract: A semiconductor wafer including an identification indication is provided. The wafer includes a convex edge with an upper surface area and a lower surface area. The identification indication is in a marking region which is disposed on a lower side surface of the convex edge. The lower side surface has a wide region where the marking region is located. This wide region has a width that is wider than an upper side surface of the wafer and thus makes a cross-section of a side of the wafer asymmetrical. With the present invention, the entire top surface of the semiconductor wafer can be utilized for a semiconductor chip region and prevents manufacturing problems associated with the uneven nature of the identification indication when the identification is located on the top surface of the wafer.

Abstract: A semiconductor wafer including an identification indication is provided. The wafer includes a convex edge with an upper surface area and a lower surface area. The identification indication is in a marking region which is disposed on a lower side surface of the convex edge. The lower side surface has a wide region where the marking region is located. This wide region has a width that is wider than an upper side surface of the wafer and thus makes a cross-section of a side of the wafer asymmetrical. With the present invention, the entire top surface of the semiconductor wafer can be utilized for a semiconductor chip region and prevents manufacturing problems associated with the uneven nature of the identification indication when the identification is located on the top surface of the wafer.