Abstract: A wafer manufacturing method, an epitaxial wafer manufacturing method, and a wafer and epitaxial wafer manufactured thereby, are provided. The wafer manufacturing method enables the manufacture of a wafer with a low density of micropipe defects and minimum numbers of particles and scratches. The epitaxial wafer manufacturing method enables the manufacture of an epitaxial wafer that has low densities of defects such as downfall, triangular, and carrot defects, exhibits excellent device characteristics, and improves the yield of devices.

Abstract: A wafer manufacturing method, an epitaxial wafer manufacturing method, and a wafer and epitaxial wafer manufactured thereby, are provided. The wafer manufacturing method enables the manufacture of a wafer with a low density of micropipe defects and minimum numbers of particles and scratches. The epitaxial wafer manufacturing method enables the manufacture of an epitaxial wafer that has low densities of defects such as downfall, triangular, and carrot defects, exhibits excellent device characteristics, and improves the yield of devices.

Abstract: The present invention relates to a vinyl chloride resin composition containing diethylhexylcyclohexane as a plasticizer. Diethylhexylcyclohexane may replace controversial phthalate based plasticizers to prevent environmental contamination and have significantly low initial viscosity and low-temperature viscosity and a remarkably low low-temperature viscosity with the passage of time as compared to the existing phthalate based plasticizers and dioctyl terephthalate, which is a non-phthalate based plasticizer, such that the vinyl chloride resin composition containing the diethylhexylcyclohexane plasticizer may have excellent workability and generate less volatile organic compounds, thereby making it possible to apply this composition to develop eco-friendly products.