Patents by Inventor Yeou Chian Chang

Yeou Chian Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device packaging leadframe assembly and method therefor
    Patent number: 11676885
    Abstract: A method of manufacturing a semiconductor device is provided. The method includes forming a package leadframe assembly. The package leadframe includes a plurality of leads. An adhesive is placed on a portion of the plurality of leads. A die pad is placed onto the adhesive. A portion of the die pad overlaps the portion of the plurality of leads. A semiconductor die is attached to the die pad. A molding compound encapsulates the semiconductor die and a portion of the package leadframe assembly.
    Type: Grant
    Filed: May 5, 2021
    Date of Patent: June 13, 2023
    Inventors: Yeou Chian Chang, Chao Hui Huang
  • SEMICONDUCTOR DEVICE PACKAGING LEADFRAME ASSEMBLY AND METHOD THEREFOR
    Publication number: 20220359350
    Abstract: A method of manufacturing a semiconductor device is provided. The method includes forming a package leadframe assembly. The package leadframe includes a plurality of leads. An adhesive is placed on a portion of the plurality of leads. A die pad is placed onto the adhesive. A portion of the die pad overlaps the portion of the plurality of leads. A semiconductor die is attached to the die pad. A molding compound encapsulates the semiconductor die and a portion of the package leadframe assembly.
    Type: Application
    Filed: May 5, 2021
    Publication date: November 10, 2022
    Inventors: Yeou Chian Chang, Chao Hui Huang
  • DIE ATTACHMENT FOR SEMICONDUCTOR DEVICE PACKAGING AND METHOD THEREFOR
    Publication number: 20220189856
    Abstract: A method of manufacturing a semiconductor device is provided. The method includes forming a package leadframe including leads and a die paddle. A cavity is formed in the die paddle. Sidewall and bottom surfaces of the cavity are plated with a solder alloy material. A semiconductor die is attached to the bottom surface of the cavity by way of a thermal cycle. A molding compound encapsulates the semiconductor die, a portion of the leads, and a portion of the die paddle.
    Type: Application
    Filed: December 11, 2020
    Publication date: June 16, 2022
    Inventors: Yeou Chian Chang, Chao Hui Huang