Abstract: An image sensor may include a substrate having photoelectric conversion regions respectively formed on a plurality of pixels and charge trap regions overlapping with the respective photoelectric conversion regions and having depths or thicknesses that are different, for each of the respective pixel.

Abstract: An image sensor includes: a first inter-layer dielectric layer formed over a front side of a substrate including photoelectric conversion regions; isolation structures each of which penetrates through the first inter-layer dielectric layer and has a portion buried in the substrate; first metal lines formed over the first inter-layer dielectric layer to correspond to the photoelectric conversion regions; and an optical filter and a light condenser formed over a back side of the substrate.

Abstract: Provided is an image sensor having improved characteristics. An image sensor in accordance with an embodiment of the present invention may include first and second photoelectric conversion elements formed in a substrate, wherein the first photoelectric conversion element has a first impurity region; a device isolation trench formed in the substrate and between the first and the second photoelectric conversion elements, wherein a sidewall of the device isolation trench is in contact with the first impurity region; and an epitaxial layer filling the device isolation trench, and having different conductivity from the first impurity region.

Abstract: An image sensor includes: a first inter-layer dielectric layer formed over a front side of a substrate including photoelectric conversion regions; isolation structures each of which penetrates through the first inter-layer dielectric layer and has a portion buried in the substrate; first metal lines formed over the first inter-layer dielectric layer to correspond to the photoelectric conversion regions; and an optical filter and a light condenser formed over a back side of the substrate.

Abstract: An image sensor may include a substrate having photoelectric conversion regions respectively formed on a plurality of pixels and charge trap regions overlapping with the respective photoelectric conversion regions and having depths or thicknesses that are different, for each of the respective pixel.

Abstract: An image sensor includes: a first inter-layer dielectric layer formed over a front side of a substrate including photoelectric conversion regions; isolation structures each of which penetrates through the first inter-layer dielectric layer and has a portion buried in the substrate; first metal lines formed over the first inter-layer dielectric layer to correspond to the photoelectric conversion regions; and an optical filter and a light condenser formed over a back side of the substrate.

Abstract: An image sensor may include a substrate having photoelectric conversion regions respectively formed on a plurality of pixels and charge trap regions overlapping with the respective photoelectric conversion regions and having depths or thicknesses that are different, for each of the respective pixel.

Abstract: An image sensor includes: a first inter-layer dielectric layer formed over a front side of a substrate including photoelectric conversion regions; isolation structures each of which penetrates through the first inter-layer dielectric layer and has a portion buried in the substrate; first metal lines formed over the first inter-layer dielectric layer to correspond to the photoelectric conversion regions; and an optical filter and a light condenser formed over a back side of the substrate.

Abstract: An image sensor may include a substrate having photoelectric conversion regions respectively formed on a plurality of pixels and charge trap regions overlapping with the respective photoelectric conversion regions and having depths or thicknesses that are different, for each of the respective pixel.