Patents by Inventor Yeoung-Seok Kim

Yeoung-Seok Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090297825
    Abstract: The present invention relates to the buffer material used for the package of an article, and with the overlapped plastic film being stickig and having the air pocket while SAM of the air is prevented with the injected pneumatic pressure in which especially, the repetition injection of the air is possible and, the productivity is improved. Presently, if a thing and the long time thereafter that it measures and it is impossible to the injection in which various kinds of things are developed as the buffer material which has the buffer force in a package while being expanded by the aerial pressurizing but which such most of the things injects the single air go by, the leak of the air is generated to the change of the external environment. The valve film adheres closely with the pressure of the air injected in the state where the air passage forms on the part in which the air is injected and the air is injected in the air pocket to one side of the air pocket, the conventional problem is solved.
    Type: Application
    Filed: September 2, 2004
    Publication date: December 3, 2009
    Inventors: Yeoung-Seok Kim, Yong-Ho Yun