Abstract: Provided is a manufacturing method of a radio-frequency (1A, 1B) smart card with a metal inlay (4), comprising the steps of forming a card body (1 A, 1B, 11) including said metal inlay (4) in the form of a metal plate (4i) equipped with a cavity (22), and arranging at least a radiofrequency transponder (5c) antenna inside this cavity (22). The method is characterized in that it comprises a step of arranging an external metal element (4c) around said metal plate (4i) for forming the metal inlay (4), said external metal element being visible on the edge (14) of the card (11).

Abstract: Provided is a multilayer structure manufacturing method for bonding layers with adhesive film(s), comprising the steps of bonding one or more layers (4, 8, 5, 6) of its structure (1, 7) with thermosetting adhesive film(s) (2, 3), said thermosetting adhesive film(s) having recommended operating conditions of temperature and duration in its technical specification (TDS) to polymerize during thermal lamination (500, 600). The thermosetting adhesive is laminated with said layers in order to present a partial polymerization rate less than polymerization rate resulting from said recommended operating conditions.