Patents by Inventor Yeow Loye SIEW

Yeow Loye SIEW has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Design-for-manufacturing—design-enabled-manufacturing (DFM-DEM) proactive integrated manufacturing flow
    Patent number: 9081919
    Abstract: System and methods for design-for-manufacturing and design-enabled-manufacturing (DFM-DEM) proactive integrated manufacturing flow are presented. A method includes receiving design data related to layout of an integrated circuit (IC); extracting information from the design data; and performing analysis on the extracted information. The method also enables DFM-DEM aware manufacturing applications using information stored in a knowledge database. The method further updates the knowledge database with new information learned from at least the extracted information and the analysis.
    Type: Grant
    Filed: March 13, 2014
    Date of Patent: July 14, 2015
    Assignee: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
    Inventors: Vito Dai, Beng Lye Oh, Chiu Wing Hui, Yeow Loye Siew
  • DESIGN-FOR-MANUFACTURING - DESIGN-ENABLED-MANUFACTURING (DFM-DEM) PROACTIVE INTEGRATED MANUFACTURING FLOW
    Publication number: 20140282288
    Abstract: System and methods for design-for-manufacturing and design-enabled-manufacturing (DFM-DEM) proactive integrated manufacturing flow are presented. A method includes receiving design data related to layout of an integrated circuit (IC); extracting information from the design data; and performing analysis on the extracted information. The method also enables DFM-DEM aware manufacturing applications using information stored in a knowledge database. The method further updates the knowledge database with new information learned from at least the extracted information and the analysis.
    Type: Application
    Filed: March 13, 2014
    Publication date: September 18, 2014
    Inventors: Vito DAI, Beng Lye OH, Chiu Wing HUI, Yeow Loye SIEW