Patents by Inventor Yeqing Su

Yeqing Su has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CRYSTALLINE FORMS OF N-(4-(4-(CYCLOPROPYLMETHYL)PIPERAZINE-1-CARBONYL)PHENYL)QUINOLINE-8-SULFONAMIDE
    Publication number: 20220220093
    Abstract: Provided herein are amorphous and crystalline hemisulfate salt forms of the formula. Also provided are pharmaceutical compositions comprising the amorphous and crystalline hemisulfate salt forms, methods for their manufacture, and uses thereof for treating conditions associated with pyruvate kinase such as e.g., pyruvate kinase deficiency.
    Type: Application
    Filed: January 14, 2022
    Publication date: July 14, 2022
    Inventors: Jacob P. Sizemore, Liting Guo, Mahmoud Mirmehrabi, Yeqing Su
  • Crystalline forms of N-(4-(4-(cyclopropymethyl)piperazine-1-carbonyl)phenyl)quinoline-8-sulfonamide
    Patent number: 11254652
    Abstract: Provided herein are amorphous and crystalline hemisulfate salt forms of the formula (I). Also provided are pharmaceutical compositions comprising the amorphous and crystalline hemisulfate salt forms, methods for their manufacture, and uses thereof for treating conditions associated with pyruvate kinase such as e.g., pyruvate kinase deficiency.
    Type: Grant
    Filed: November 21, 2018
    Date of Patent: February 22, 2022
    Assignee: Agios Pharmaceuticals, Inc.
    Inventors: Jacob P. Sizemore, Liting Guo, Mahmoud Mirmehrabi, Yeqing Su
  • CRYSTALLINE FORMS OF N-(4-(4-(CYCLOPROPYLMETHYL)PIPERAZINE-1-CARBONYL)PHENYL)QUINOLINE-8-SULFONAMIDE
    Publication number: 20200277279
    Abstract: Provided herein are amorphous and crystalline hemisulfate salt forms of the formula (I). Also provided are pharmaceutical compositions comprising the amorphous and crystalline hemisulfate salt forms, methods for their manufacture, and uses thereof for treating conditions associated with pyruvate kinase such as e.g., pyruvate kinase deficiency.
    Type: Application
    Filed: November 21, 2018
    Publication date: September 3, 2020
    Inventors: Jacob P. Sizemore, Liting Guo, Mahmoud Mirmehrabi, Yeqing Su
  • Thin semiconductor package and method for manufacturing same
    Patent number: 8354739
    Abstract: A method for manufacturing a thin semiconductor package includes providing a lead frame with a removable substrate that has an attaching surface attached to a first surface of the lead frame. The lead frame is formed from an electrically conductive sheet and has leads that extend inwardly from a lead frame boundary towards a central region of the lead frame. A semiconductor die is mounted on the removable substrate at the central region. The semiconductor die has a connection pad surface with die pads on it, and the connection pad surface is attached to the attaching surface of the removable substrate. The lead frame and die are encapsulated with a first encapsulant so that the lead frame is sandwiched between the first encapsulant and the removable substrate. The removable substrate is removed from the lead frame to expose the first surface of the lead frame and then the die pads are electrically connected to respective ones of the leads.
    Type: Grant
    Filed: April 22, 2011
    Date of Patent: January 15, 2013
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Yeqing Su, Zhigang Bai, Weimin Chen, Wei Shen, Jianhong Wang, Baoguan Yin, Wanming Yu
  • THIN SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME
    Publication number: 20110316130
    Abstract: A method for manufacturing a thin semiconductor package includes providing a lead frame with a removable substrate that has an attaching surface attached to a first surface of the lead frame. The lead frame is formed from an electrically conductive sheet and has leads that extend inwardly from a lead frame boundary towards a central region of the lead frame. A semiconductor die is mounted on the removable substrate at the central region. The semiconductor die has a connection pad surface with die pads on it, and the connection pad surface is attached to the attaching surface of the removable substrate. The lead frame and die are encapsulated with a first encapsulant so that the lead frame is sandwiched between the first encapsulant and the removable substrate. The removable substrate is removed from the lead frame to expose the first surface of the lead frame and then the die pads are electrically connected to respective ones of the leads.
    Type: Application
    Filed: April 22, 2011
    Publication date: December 29, 2011
    Applicant: FREESCALE SEMICONDUCTOR, INC.
    Inventors: Yeqing Su, Zhigang Bai, Weimin Chen, Wei Shen, Jianhong Wang, Baoguan Yin, Wanming Yu